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NO20025744D0 - Accelerometer with inward groove - Google Patents

Accelerometer with inward groove

Info

Publication number
NO20025744D0
NO20025744D0 NO20025744A NO20025744A NO20025744D0 NO 20025744 D0 NO20025744 D0 NO 20025744D0 NO 20025744 A NO20025744 A NO 20025744A NO 20025744 A NO20025744 A NO 20025744A NO 20025744 D0 NO20025744 D0 NO 20025744D0
Authority
NO
Norway
Prior art keywords
accelerometer
inward groove
inward
groove
Prior art date
Application number
NO20025744A
Other languages
Norwegian (no)
Other versions
NO20025744L (en
Inventor
Robert P Ried
Arjun Selvakumar
Howard D Goldberg
Martin A Schmidt
Lianzhong Yu
Original Assignee
Input Output Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Input Output Inc filed Critical Input Output Inc
Publication of NO20025744D0 publication Critical patent/NO20025744D0/en
Publication of NO20025744L publication Critical patent/NO20025744L/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • G01V1/181Geophones
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Environmental & Geological Engineering (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Pressure Sensors (AREA)
NO20025744A 2000-05-30 2002-11-29 Accelerometer with inward groove NO20025744L (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20793400P 2000-05-30 2000-05-30
PCT/US2001/017254 WO2001092895A1 (en) 2000-05-30 2001-05-29 Accelerometer with re-entrant grooves

Publications (2)

Publication Number Publication Date
NO20025744D0 true NO20025744D0 (en) 2002-11-29
NO20025744L NO20025744L (en) 2003-01-28

Family

ID=22772562

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20025744A NO20025744L (en) 2000-05-30 2002-11-29 Accelerometer with inward groove

Country Status (5)

Country Link
EP (1) EP1305639A4 (en)
AU (1) AU2001265084A1 (en)
CA (1) CA2410909A1 (en)
NO (1) NO20025744L (en)
WO (1) WO2001092895A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10117257A1 (en) * 2001-04-06 2002-10-17 Eads Deutschland Gmbh Micromechanical capacitive acceleration sensor
ATE482577T1 (en) * 2004-10-27 2010-10-15 Epcos Ag REDUCING AIR DAMPING IN A MEMS DEVICE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3780242T2 (en) * 1986-09-22 1993-03-18 Nippon Denso Co SEMICONDUCTOR ACCELEROMETER.
US4993143A (en) * 1989-03-06 1991-02-19 Delco Electronics Corporation Method of making a semiconductive structure useful as a pressure sensor
US5228341A (en) * 1989-10-18 1993-07-20 Hitachi, Ltd. Capacitive acceleration detector having reduced mass portion
JP2728807B2 (en) * 1991-07-24 1998-03-18 株式会社日立製作所 Capacitive acceleration sensor
US5616514A (en) * 1993-06-03 1997-04-01 Robert Bosch Gmbh Method of fabricating a micromechanical sensor
DE69702745T2 (en) * 1997-03-04 2000-12-07 Stmicroelectronics S.R.L., Agrate Brianza Method of manufacturing micromechanical pressure sensors
JPH1194873A (en) * 1997-09-18 1999-04-09 Mitsubishi Electric Corp Acceleration sensor and method of manufacturing the same
EP1043770B1 (en) * 1999-04-09 2006-03-01 STMicroelectronics S.r.l. Formation of buried cavities in a monocrystalline semiconductor wafer and a wafer

Also Published As

Publication number Publication date
EP1305639A4 (en) 2004-03-24
WO2001092895A1 (en) 2001-12-06
EP1305639A1 (en) 2003-05-02
AU2001265084A1 (en) 2001-12-11
NO20025744L (en) 2003-01-28
CA2410909A1 (en) 2001-12-06

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application