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NO20020321D0 - LED-signaler - Google Patents

LED-signaler

Info

Publication number
NO20020321D0
NO20020321D0 NO20020321A NO20020321A NO20020321D0 NO 20020321 D0 NO20020321 D0 NO 20020321D0 NO 20020321 A NO20020321 A NO 20020321A NO 20020321 A NO20020321 A NO 20020321A NO 20020321 D0 NO20020321 D0 NO 20020321D0
Authority
NO
Norway
Prior art keywords
main surface
conducting
led signals
tracks
thermally conducting
Prior art date
Application number
NO20020321A
Other languages
English (en)
Other versions
NO322102B1 (no
NO20020321L (no
Inventor
Simon Bluemel
Ulrich Kreplin
Dirk Zimmermann
Axel Heilmann
Michael Zabel
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of NO20020321D0 publication Critical patent/NO20020321D0/no
Publication of NO20020321L publication Critical patent/NO20020321L/no
Publication of NO322102B1 publication Critical patent/NO322102B1/no

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/04Refractors for light sources of lens shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H10W90/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
NO20020321A 2001-01-19 2002-01-21 LED-signalmodul NO322102B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10102353A DE10102353B4 (de) 2001-01-19 2001-01-19 LED-Signalmodul

Publications (3)

Publication Number Publication Date
NO20020321D0 true NO20020321D0 (no) 2002-01-21
NO20020321L NO20020321L (no) 2002-07-22
NO322102B1 NO322102B1 (no) 2006-08-14

Family

ID=7671117

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20020321A NO322102B1 (no) 2001-01-19 2002-01-21 LED-signalmodul

Country Status (5)

Country Link
EP (1) EP1243843B1 (no)
AT (1) ATE419492T1 (no)
DE (2) DE10102353B4 (no)
DK (1) DK1243843T3 (no)
NO (1) NO322102B1 (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004053958B3 (de) * 2004-11-09 2005-09-01 Behr Hella Thermocontrol Gmbh Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug
PT3770980T (pt) 2005-05-20 2024-09-24 Signify Holding Bv Módulo emissor de luz
EP1791187B1 (en) * 2005-11-29 2009-08-26 National Central University Light emitting device
US20080074884A1 (en) * 2006-09-25 2008-03-27 Thye Linn Mok Compact high-intensty LED-based light source and method for making the same
KR20100049677A (ko) 2007-08-29 2010-05-12 베르-헬라 테르모콘트롤 게엠베하 태양 복사의 입사 방향 및 강도를 탐지하기 위한 태양 센서
DE102009020851A1 (de) * 2009-05-12 2010-11-25 Osram Gesellschaft mit beschränkter Haftung Leuchtband und Verfahren zum Herstellen eines Leuchtbands
ITTV20090228A1 (it) * 2009-12-09 2011-06-10 Giovine Vincenzo Di Segnalatore a lungo raggio in rifrazione con sorgenti luminose di tipo led
DE102012202353A1 (de) * 2012-02-16 2013-08-22 Osram Gmbh Leuchtmodul-Leiterplatte
DE102017104386A1 (de) 2017-03-02 2018-09-06 HELLA GmbH & Co. KGaA Verfahren zur Herstellung einer elektrischen Baugruppe

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733335A (en) * 1984-12-28 1988-03-22 Koito Manufacturing Co., Ltd. Vehicular lamp
DE8815418U1 (de) * 1988-12-12 1989-02-16 Isensee-Electronic-GmbH, 7012 Fellbach Infrarot-Scheinwerfer
JPH033276A (ja) * 1989-05-31 1991-01-09 Nippon Denyo Kk Ledランプ
DE9003623U1 (de) * 1990-03-28 1990-10-31 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte
JPH07114813A (ja) * 1993-10-19 1995-05-02 Koito Mfg Co Ltd 車輌用灯具
US5808592A (en) * 1994-04-28 1998-09-15 Toyoda Gosei Co., Ltd. Integrated light-emitting diode lamp and method of producing the same
DE4444567A1 (de) * 1994-12-02 1996-06-05 Siemens Ag Verfahren zum Herstellen einer Leiterplatte mit einer Kernplatte aus Aluminium oder Aluminiumlegierung
US5612680A (en) * 1995-03-31 1997-03-18 Desanto; Joseph J. Universal termination module for assembling wire harnesses having multiple diverse connectors
DE19528459C2 (de) * 1995-08-03 2001-08-23 Garufo Gmbh Kühlung für ein mit LED's bestücktes Leuchtaggregat
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
DE19736962B4 (de) * 1997-08-25 2009-08-06 Robert Bosch Gmbh Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
EP1243843A3 (de) 2004-12-15
NO322102B1 (no) 2006-08-14
DK1243843T3 (da) 2009-04-14
DE10102353B4 (de) 2007-11-15
EP1243843A2 (de) 2002-09-25
EP1243843B1 (de) 2008-12-31
DE10102353A1 (de) 2002-08-01
ATE419492T1 (de) 2009-01-15
DE50213157D1 (de) 2009-02-12
NO20020321L (no) 2002-07-22

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