NO160377B - CURSOR FOR EPOXY RESIN PASSES AND PROCEDURE FOR MANUFACTURING THE HARDENER. - Google Patents
CURSOR FOR EPOXY RESIN PASSES AND PROCEDURE FOR MANUFACTURING THE HARDENER. Download PDFInfo
- Publication number
- NO160377B NO160377B NO844495A NO844495A NO160377B NO 160377 B NO160377 B NO 160377B NO 844495 A NO844495 A NO 844495A NO 844495 A NO844495 A NO 844495A NO 160377 B NO160377 B NO 160377B
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- dicyandiamide
- hardener
- epoxy resin
- weight
- metal oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
- C08K5/3155—Dicyandiamide
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exhaust Gas After Treatment (AREA)
- Ceramic Products (AREA)
- Bidet-Like Cleaning Device And Other Flush Toilet Accessories (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Foreliggende oppfinnelse angår en herder for eposkyharpiks-masser på basis av dicyandiamid. The present invention relates to a hardener for epoxy resin masses based on dicyandiamide.
Det er kjent å anvende dicyandiamid for en herding av epoksyharpiks, se f.eks. TJS-PS 2.637.715 og 3.339.113. Fordelene ved dicyandiamider er fremfor alt toksikologisk problemfrihet og luktløshet samt den kjemisk inerte oppførsel, slik at harpiks-herderblandinger oppviser god lagringsstabilitet. It is known to use dicyandiamide for a curing of epoxy resin, see e.g. TJS-PS 2,637,715 and 3,339,113. The advantages of dicyandiamides are, above all, freedom from toxicological problems and odorlessness as well as the chemically inert behavior, so that resin-hardener mixtures exhibit good storage stability.
Manglene ved dicyandiamider er den dårlige pppløselighet og den ikke optimale fordelbarhet for den dicyandiamidholdige herder i epoksyharpiksen, noe som f.eks. kan føre til forhøyet forbruk av herder. Disse forhøyede bruksmengder har dog igjen tiIfølge at det i den utherdede harpiks kan oppstå områder med høyt innhold av ikke-brukt herder og dermed feilsteder i sluttproduktet. The shortcomings of dicyandiamides are the poor solubility and the non-optimal distribution of the dicyandiamide-containing hardener in the epoxy resin, which e.g. can lead to increased consumption of hardener. However, these increased amounts of use have the consequence that areas with a high content of unused hardener and thus defects in the final product may occur in the cured resin.
Det har ikke manglet på forsøk på å løse dette problem med dårlig fordelbarhet av dicyandiamid i flytende eller ved høyere temperatur smeltende epoksyharpikser, hvorved det alt efter anvendelsesretning ble prøvet følgende veier: - anvendelse av et egnet oppløsningsmiddel eller en opp-løsningsmiddelblanding for fremstilling av impregnerings-oppløsninger av epoksyharpiks og herder (se DE-AS 30.26.706 og DD-AS 133.955); anvendelse av substituert dicyandiamid med forbedret fordelbarhet i epoksyharpiksmasser (sammenlign f.eks. FR-A 2.207.911); -anvendelse av dicyandiamiddispersjoner i flytende epoksyharpiksblandinger. There has been no shortage of attempts to solve this problem of poor distribution of dicyandiamide in liquid or epoxy resins melting at a higher temperature, whereby the following ways have been tried, depending on the direction of application: - use of a suitable solvent or a solvent mixture for the production of impregnation - solutions of epoxy resin and hardener (see DE-AS 30.26.706 and DD-AS 133.955); use of substituted dicyandiamide with improved distributability in epoxy resin masses (compare e.g. FR-A 2,207,911); - use of dicyandiamide dispersions in liquid epoxy resin mixtures.
Mens det ifølge den første vei til nu kun ble funnet få oppløsningsmiddelblandinger som oppviste de nødvendige kriterier som god oppløselighet eller god forenelighet med epoksyharpiksblandingen, er tilveiebringelsen av substituerte dicyandiamider ved den andre vei uøkonomisk fordi fremstillingen av disse produkter forårsaker høye drifts- og investeringsomkostninger. Ved den sistnevnte vei opptrer den vanskelighet at man må anvende mest mulig finfordelt dicyandiamid for å oppnå en god fordeling i pulverformige epoksyharpiks-herderblandinger eller -dispersjoner i flytende epoksyharpiksblandinger, mens på den annen side finfordelt dicyandiamid har en utpreget tendens til sammenklumping slik at finoppmalt dicyandiamid i løpet av meget kort tid danner agglomerater som senere vanskelig kan knuses. Denne agglo-merering av finoppmalt dicyandiamid fører ved dicyandiamid-suspensjoner til dannelse av større fnokker som ved epoksyharpiksblandinger fører til betydelige problemer. While according to the first route only a few solvent mixtures were found which exhibited the necessary criteria such as good solubility or good compatibility with the epoxy resin mixture, the provision of substituted dicyandiamides by the second route is uneconomical because the production of these products causes high operating and investment costs. With the latter route, the difficulty arises that one must use as finely divided dicyandiamide as possible in order to achieve a good distribution in powdery epoxy resin-hardener mixtures or dispersions in liquid epoxy resin mixtures, while on the other hand, finely divided dicyandiamide has a distinct tendency to agglomerate so that finely ground dicyandiamide within a very short time form agglomerates which can later be difficult to crush. This agglomeration of finely ground dicyandiamide leads to the formation of larger flakes in the case of dicyandiamide suspensions, which in the case of epoxy resin mixtures leads to significant problems.
Foreliggende oppfinnelse har derfor til oppgave å tilveie- . bringe en herder for epoksyharpiksmasser på basis av dicyandiamid som ikke oppviser de nevnte mangler ved den kjente teknikk og som udmerker seg ved gode anvendelsestekniske egenskaper ved rimelig fremstilling. The present invention therefore has the task of providing bring a hardener for epoxy resin masses on the basis of dicyandiamide which does not exhibit the aforementioned shortcomings of the known technique and which is distinguished by good application technical properties at reasonable production.
Oppgaven løses ved hjelp av en herder for epoksymasser på basis av dicyandiamid, og denne herder karakteriseres ved at den består av a) dicyandiamid der minst 90% av partiklene oppviser en kornstørrelse på inntil 10 pm, og b) 0,1 - 30 vekt-#, beregnet på vekten av dicyandiamidet, silisiumdioksid og/eller et metalloksid fra II. hoved-eller undergruppe i det periodiske system med en spesifikk overflate på minst 50 m<2>/g, målt i henhold til BET. The task is solved using a hardener for epoxy compounds based on dicyandiamide, and this hardener is characterized by the fact that it consists of a) dicyandiamide in which at least 90% of the particles have a grain size of up to 10 pm, and b) 0.1 - 30 wt. #, calculated on the weight of the dicyandiamide, silicon dioxide and/or a metal oxide from II. main or subgroup in the periodic table with a specific surface of at least 50 m<2>/g, measured according to BET.
Det har overraskende vist seg at oppfinnelsens herder for epoksyharpiksmasser oppviser en forbedret fordelbarhet i epoksyharpiks samt en forhøyet lagringsstabilitet i epoksyharpiks-herderdispersjonen. Ut over dette bevirker til-setningene av silisiumdioksid og/eller metalloksider fra den annen hoved- eller undergruppe en delvis betydelig for-kortelse av geldannelsestiden vis a vis vanlig dicyandiamid, noe som heller ikke kunne forutsees. It has surprisingly been found that the hardener of the invention for epoxy resin masses exhibits an improved distributability in epoxy resin as well as an increased storage stability in the epoxy resin hardener dispersion. In addition to this, the additions of silicon dioxide and/or metal oxides from the other main or subgroup cause a partially significant shortening of the gel formation time vis a vis ordinary dicyandiamide, which could not be predicted either.
Spesielt fordelaktige sllislumdioksidtyper er de kommersielle "Aerosil" og "HDK". Particularly advantageous sludge dioxide types are the commercial "Aerosil" and "HDK".
Oppfinnelsen angår også en fremgangsmåte for fremstilling av en herder for epoksyharpiksmasser ifølge kravene 1-3, og denne karakteriseres ved at silisiumdioksidet og/eller metalloksidet fra II. hoved- eller undergruppe doseres til dicyandiamid før oppmalingen og så males sammen med dicyandiamidet til den angitte kornstørrelse. The invention also relates to a method for producing a hardener for epoxy resin masses according to claims 1-3, and this is characterized in that the silicon dioxide and/or the metal oxide from II. main or subgroup is dosed to dicyandiamide before grinding and then ground together with the dicyandiamide to the specified grain size.
Som metalloksider fra II. hoved- eller undergruppe egner seg spesielt magnesium(II)oksid, kalsium(II)oksid, zink(II)oksid samt blandinger derav, dog er prinsipielt også andre oksider slik som de av barium eller strontium, anvendbare. As metal oxides from II. main or subgroup, magnesium (II) oxide, calcium (II) oxide, zinc (II) oxide and mixtures thereof are particularly suitable, although in principle other oxides such as those of barium or strontium are also applicable.
Mengden av silisiumdioksid henholdsvis metalloksid fra II. hoved- eller undergruppe utgjør 0,1 til 30 vekt-* og for-trinnsvis 0,2 til 20 vekt-%, beregnet på vekten av dicyan-diamldet. The amount of silicon dioxide or metal oxide from II. main or subgroup amounts to 0.1 to 30% by weight and preferably 0.2 to 20% by weight, calculated on the weight of the dicyandiamine.
Fremstillingen av epoksyharpiksherderen ifølge oppfinnelsen skjer hensiktsmessig på den måte at man til dicyandiamidet før oppmaling til den angitte kornstørrelse doserer silisiumdioksidet og/eller metalloksidet fra II. hoved- eller undergruppe kontinuerlig slik at metalloksidet oppviser den samme kornstørrelsesfordeling som dicyandiamidet. The production of the epoxy resin hardener according to the invention takes place appropriately in such a way that the silicon dioxide and/or metal oxide from II is dosed to the dicyandiamide before grinding to the specified grain size. main or subgroup continuously so that the metal oxide exhibits the same grain size distribution as the dicyandiamide.
På denne måte forhindrer man at det finoppmalte dicyandiamid umiddelbart efter oppmalingen pakkes sammen og danner uønskede agglomerater. Også gjennomblandingen av komponentene kan skje i ett trinn. Oppmalingen av dicyandiamidet og/eller metalloksidet kan skje i vanlige tekniske innret-ninger slik som siktemøller o.l. uten problemer, dvs. uten å separere dicyandiamid og metalloksid under siktingen. Oppfinnelsens dicyandiamidholdige epoksyherder som oppviser en massevekt på 300 til 500 g/l kan fordeles optimalt i faste eller flytende epoksyharpikser, hvorved herdermengden i forhold til vanlige herdere på basis av dicyandiamidet kan reduseres. Det har vist seg at mengder på 3 til 6 vekt-*, beregnet på epoksidekvivalentvekten, er tilstrekkelig. In this way, it is prevented that the finely ground dicyandiamide immediately after grinding is packed together and forms unwanted agglomerates. The thorough mixing of the components can also take place in one step. The grinding of the dicyandiamide and/or the metal oxide can take place in ordinary technical devices such as sieve mills and the like. without problems, i.e. without separating dicyandiamide and metal oxide during sieving. The dicyandiamide-containing epoxy hardener of the invention, which has a mass weight of 300 to 500 g/l, can be distributed optimally in solid or liquid epoxy resins, whereby the amount of hardener can be reduced compared to ordinary hardeners based on the dicyandiamide. It has been found that amounts of 3 to 6 weight-*, calculated on the epoxide equivalent weight, are sufficient.
Herdereaksjonen med herderen tilsvarende foreliggende oppfinnelse kan i tillegg aktiveres med vanlige herdeaksel-leratorer slik som f.eks. 2-metylimidazol, substituerte urinstoffer (monouron, diuron), dimetylbenzylamin eller substituerte metylendianiliner. Den utherdede epoksyharpiks oppviser en tydelig forbedret kjemikalieresistens og ved-hefting i forhold til produkter fremstilt med vanlige dicyandiamidholdige herdere. The hardening reaction with the hardener corresponding to the present invention can also be activated with common hardening accelerators such as e.g. 2-methylimidazole, substituted ureas (monouron, diuron), dimethylbenzylamine or substituted methylenedianilines. The cured epoxy resin exhibits a clearly improved chemical resistance and adhesion compared to products made with common dicyandiamide-containing hardeners.
De følgende eksempler skal forklare oppfinnelsen nærmere. The following examples shall explain the invention in more detail.
For sammenligningsformål fremstilles det epoksyharpiksherdere på basis av dicyandiamid med oppmaling av dicyandiamid med følgende tilsetninger hvorefter produktene sammenlignes: Herder a): Dicyandiamid med 1,3 vekt-* silisiumdioksid For comparison purposes, epoxy resin hardeners are produced on the basis of dicyandiamide with grinding of dicyandiamide with the following additions, after which the products are compared: Hardener a): Dicyandiamide with 1.3 weight-* silicon dioxide
"HDK"N20 med en spesifikk overflate på 200 m<2>/g Herder b): Dicyandiamid med 10,0 vekt-* kalsium(II)oksid Herder c): Dicyandiamid med 0.8 vekt-* magnesium(II )oksid Herder d): Dicyandiamid med 5.0 vekt-* zink(II )oksid "HDK"N20 with a specific surface area of 200 m<2>/g Hardener b): Dicyandiamide with 10.0 weight-* calcium(II) oxide Hardener c): Dicyandiamide with 0.8 weight-* magnesium(II) oxide Hardener d ): Dicyandiamide with 5.0 weight-* zinc(II) oxide
Herder e): Dicyandiamid uten tilsetning Hardener e): Dicyandiamide without addition
EKSEMPEL 1: Bestemmelse av en midlere korndiameter ved hjelp EXAMPLE 1: Determination of an average grain diameter using
av røntgenelektronmikroskopi by X-ray electron microscopy
Herder a): 4 - 5 pm (lite agglomerat) Hardener a): 4 - 5 pm (small agglomerate)
Herder b): 4 - 5 pm (nesten ikke agglomerat) Hardener b): 4 - 5 pm (almost no agglomerate)
Herder c): 4 - 5 pm (nesten ikke agglomerat) Hardener c): 4 - 5 pm (almost no agglomerate)
Herder d): 4 - 5 pm (nesten ikke agglomerat) Hardener d): 4 - 5 pm (almost no agglomerate)
Herder e): 15 pm (agglomerat opptil 40 pm) Hardener e): 15 pm (agglomerate up to 40 pm)
EKSEMPEL 2: Bestemmelse av kornstørrelsen ved våtsiktlng ved EXAMPLE 2: Determination of the grain size by wet sieving wood
en slktmaskevldde på 10 um a mesh size of 10 µm
For våtsiktlng fremstilles det en 15 *-ig suspensjon av de oppnådde kvaliteter i med dicyandiamid mettet etylacetat. For homogen blanding blir suspensjonen behandlet med ultralyd i 5 minutter og så filtrert gjennom et vibrerende og på forhånd veiet 10 pm-filter. For wet sieving, a 15% suspension of the obtained grades is prepared in ethyl acetate saturated with dicyandiamide. For homogeneous mixing, the suspension is treated with ultrasound for 5 minutes and then filtered through a vibrating and pre-weighed 10 µm filter.
Etter at filteret er vasket med ytterligere 50 g etylacetat tørkes og veies det. Derved oppnår man ^-andelen av dicyandiamid med en korndiameter mindre enn 10 pm. After the filter has been washed with a further 50 g of ethyl acetate, it is dried and weighed. Thereby, the ^-part of dicyandiamide with a grain diameter of less than 10 µm is obtained.
Eksempel 3: Bestemmelse av geldannelsestiden Example 3: Determination of the gel formation time
Man bestemmer geldannelsestiden for forskjellige epoksyher-dere ifølge oppfinnelsen med "Epikote" 1007 og disse sammenlignes med vanlig dicyandiamid med midlere kornstørrelse 80 pm. The gel formation time for various epoxy hardeners according to the invention is determined with "Epikote" 1007 and these are compared with ordinary dicyandiamide with an average grain size of 80 pm.
Eksempel 4: Bestemmelse av lagrin<g>sstablliteten Example 4: Determination of the storage stability
Man fremstiller dispersjoner av hver gang 4* av herderen ifølge oppfinnelsen i "Epikote" 828 som så sammenlignes med en dispersjon av 45É dicyandiamid (80 pm) i et tidsrom av 4 uker: One prepares dispersions of each time 4* of the hardener according to the invention in "Epikote" 828 which is then compared with a dispersion of 45É dicyandiamide (80 pm) over a period of 4 weeks:
Eksempel 5: De i eksempel 4 beskrevne dispersjoner herdes ut i form av et lakksjikt på en renset stålplate og ved 180°C hvorved følgende betraktninger gjøres: Example 5: The dispersions described in example 4 are cured in the form of a lacquer layer on a cleaned steel plate and at 180°C, whereby the following considerations are made:
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833340788 DE3340788A1 (en) | 1983-11-11 | 1983-11-11 | HARDENER FOR EPOXY RESINS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO844495L NO844495L (en) | 1985-05-13 |
| NO160377B true NO160377B (en) | 1989-01-02 |
| NO160377C NO160377C (en) | 1989-04-12 |
Family
ID=6214045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO844495A NO160377C (en) | 1983-11-11 | 1984-11-09 | CURSOR FOR EPOXY RESIN PASSES AND PROCEDURE FOR MANUFACTURING THE HARDENER. |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0148365B2 (en) |
| JP (1) | JPS60124618A (en) |
| AT (1) | ATE28653T1 (en) |
| CA (1) | CA1229939A (en) |
| DE (2) | DE3340788A1 (en) |
| FI (1) | FI844415A7 (en) |
| NO (1) | NO160377C (en) |
| ZA (1) | ZA848542B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61223023A (en) * | 1985-03-28 | 1986-10-03 | Nitto Electric Ind Co Ltd | Curing agent composition for epoxy resin |
| JPH0668091B2 (en) * | 1987-10-27 | 1994-08-31 | 三菱電機株式会社 | Thermosetting insulating resin paste |
| JPH0660230B2 (en) * | 1989-09-30 | 1994-08-10 | 東燃株式会社 | Epoxy resin composition |
| JPH0662737B2 (en) * | 1989-10-31 | 1994-08-17 | 東燃株式会社 | Epoxy resin composition |
| DE102008022007A1 (en) | 2008-05-02 | 2009-11-05 | Alzchem Trostberg Gmbh | Dicyandiamide granules with high dissolution rate and good flowability and process for its preparation |
| DE102009052061A1 (en) | 2009-11-05 | 2011-05-12 | Alzchem Trostberg Gmbh | Use of guanidine derivatives as curing accelerator for epoxy resins |
| DE102010020882A1 (en) | 2010-05-18 | 2011-11-24 | Alzchem Trostberg Gmbh | Semicarbazone for curing epoxy resins |
| JP2021147496A (en) * | 2020-03-19 | 2021-09-27 | 三菱ケミカル株式会社 | Epoxy resin composition, and prepreg and fiber-reinforced plastic using the same |
| JP2023035684A (en) * | 2021-09-01 | 2023-03-13 | 株式会社豊田中央研究所 | Heat-curable composition |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH565216A5 (en) * | 1970-06-12 | 1975-08-15 | Schering Ag | |
| DE2338430C3 (en) * | 1973-07-28 | 1978-10-12 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Heat-curable, thickened epoxy resin compounds |
| US3882064A (en) * | 1973-12-27 | 1975-05-06 | Du Pont | Epoxy resin powder coating composition |
| US4169187A (en) * | 1977-04-01 | 1979-09-25 | E. I. Du Pont De Nemours And Company | Powder coating composition of a mixture of epoxy resins |
| JPS585925B2 (en) * | 1978-07-23 | 1983-02-02 | 東邦ベスロン株式会社 | Epoxy resin composition for carbon fiber prepreg |
| US4311753A (en) * | 1979-07-17 | 1982-01-19 | General Electric Company | Curing agent for epoxy resin laminating compositions comprising a mixture of dicyandiamide and a tetra-alkylguanidine |
-
1983
- 1983-11-11 DE DE19833340788 patent/DE3340788A1/en not_active Withdrawn
-
1984
- 1984-11-01 ZA ZA848542A patent/ZA848542B/en unknown
- 1984-11-05 CA CA000467065A patent/CA1229939A/en not_active Expired
- 1984-11-07 JP JP59233424A patent/JPS60124618A/en active Granted
- 1984-11-09 DE DE8484113531T patent/DE3465096D1/en not_active Expired
- 1984-11-09 NO NO844495A patent/NO160377C/en not_active IP Right Cessation
- 1984-11-09 EP EP84113531A patent/EP0148365B2/en not_active Expired - Lifetime
- 1984-11-09 AT AT84113531T patent/ATE28653T1/en not_active IP Right Cessation
- 1984-11-09 FI FI844415A patent/FI844415A7/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| ZA848542B (en) | 1985-06-26 |
| ATE28653T1 (en) | 1987-08-15 |
| EP0148365B2 (en) | 1994-08-24 |
| FI844415L (en) | 1985-05-12 |
| FI844415A7 (en) | 1985-05-12 |
| DE3465096D1 (en) | 1987-09-03 |
| NO844495L (en) | 1985-05-13 |
| JPS60124618A (en) | 1985-07-03 |
| FI844415A0 (en) | 1984-11-09 |
| CA1229939A (en) | 1987-12-01 |
| NO160377C (en) | 1989-04-12 |
| JPH0443086B2 (en) | 1992-07-15 |
| DE3340788A1 (en) | 1985-05-23 |
| EP0148365B1 (en) | 1987-07-29 |
| EP0148365A1 (en) | 1985-07-17 |
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