NL8006409A - PRESSURE SENSITIVE ELECTRONIC DEVICE. - Google Patents

Description

-1- 21642 / JF / jg

Applicant: Franklin Neal Eventoff, Los Angeles, California, United States of America.

Short designation: Pressure sensitive electronic device.

The invention relates to: a bounce-free switching device with a transition resistance which varies inversely with a pressure applied perpendicular thereto; one bounce-free switching device having a surface contact resistance which varies inversely with a pressure applied perpendicular thereto; a dual switching device, which defines two independent switches, which are energized simultaneously in response to a single * transverse force; 15 a device for generating at least one tone, comprising a switching device defining two switches which are energized simultaneously in response to a single transverse force; a multiple touch switch device, to be selectively actuated in response to the application of at least one transverse force; a pressure transducer device; a touch switch device with a dual function; a multi-function touch switch device; and a pressure sensitive transducer.

Generally speaking, the present invention relates to pressure sensitive devices of variable resistance and in particular to devices having a thin layer of particulate semiconductive material having a plurality of surface contact protrusions disposed between at least two electrical contacts.

The generation of music sounds by electronic organs is borrowed. However, a problem present in most electronic instruments * is the impossibility of continuously varying either the volume, or the tone quality of the generated sound. This impossibility limits the freedom of musical expression by the musician.

Pressure-sensitive analog switches are known. In both U.S. Pat. No. 2,375,178 and U.S. Pat. No. 3,386,067, analog switches are shown and disclosed in which a 8 00 6 40 9 -2-21642 / JF / jg

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a sea-like or sponge-like layer containing a conductive material is applied between two conductor plates. When the two conductor plates are compressed, the number of electrically conductive paths increases, decreasing the electrical resistance. However, the resistive layer should be resilient in order to separate the electrodes when the same compression force is released. The resistive layer further depends on the macroscopic compactness to increase the number of electrically conductive paths and consequently it should have a relatively great thickness. Finally, in such devices, the resilience of the sponge-like layer may decrease the longer these devices are in use, causing a degeneration of the working characteristics.

In U.S. Pat. No. 3,806,471, pressure sensitive semiconductor materials, for example molybdenum disulfide, are placed between 15 conductor plates to provide an adjustable resistance or transducer. However, U.S. Pat. No. 3,806,417 is based on volume weave, i.e., the resistance by a relatively thick volume of the molybdenum disulfide layer. In particular, said U.S. Patent shows and describes a molybdenum disulfide volume (thickness) of 0.001 to 1.0 inch using molybdenum disulfide particles in the prepared vessel from 50 to 600 mesh to provide a large, yet finite number of three-dimensionally distributed flow paths through the resistance material. Under compression, the number of flow flows between the particles increases in volume, thereby decreasing the resistance value. The semiconductor volume layer is then permanently placed and secured between two conductive electrodes.

The structures, shown and described in the latter U.S. patent, require that the semiconductor volume be placed between two conductors or between a conductor and an insulating plate 30 in intimate contact with either the insulating plate, or the conductors,

The object of the invention is to eliminate the above-mentioned drawback, and to that end it provides devices of the type mentioned in the opening paragraph, which are characterized in that: the device comprises: a first conductor member, a first pressure-sensitive composite layer, comprising a particulate, semiconductor material arranged to cover the first conductor member in intimate, electrically conductive contact therewith and further with a first exposed surface and a second conductor member arranged in a bonded 8 00 6 40 9-3 21642 / JF / jg I 1, yet not intimately related to the first exposed surface of the first pressure sensitive composite layer to provide a transition with the transition resistance; the device includes: a first conductor member, a first, pressure-sensitive, Composite layer, comprising a particulate semiconductive material disposed for covering the first conductor member in an electrical conductive contact therewith and further with a first exposed surface, a second conductor member and a second pressure-sensitive composite layer, comprising the particulate semiconductive material * arranged to cover the second conductor with intimate electrically conductive contact therewith, and further with a second exposed surface, the first and second exposed surface in contact, yet non-intimate contacting relationship, are provided to provide variable surface contact transition with the transition resistance thereon; the device comprises: a first support member, a first guide, mounted on the first support member, a second guide, arranged on the first support member, a second support member, a third guide, mounted on the second support member, wherein the first and second support members 20 means are arranged opposite each other, with a normally spaced relationship to the first and third guides and wherein the second and fourth leads are spaced laterally in a simultaneously energizing proximity, the first and third guides being movable transversely in a electrically conductive bandages 25 and the second and fourth conductors are movable transversely in an electric + conductive relationship in response to the application of the single transverse force, wherein the first and third conductors form a first switch and the second and fourth conductors form a second switch molds and a pressure sensitive semiconductor composition applied for the 30 providing a contact resistance across at least one of the first and second switches, the contact resistance varying in response to variations in the magnitude of the single transverse force; the switching device comprises: a first supporting member, a first conductor, mounted on the first supporting member, a second conductor, mounted on the first supporting member, a second supporting member, a third conductor, mounted on the second supporting member, a fourth conductor, mounted on the second support member, the first and second support members being opposite each other 8 00 6 40 9 I 4 -4- 21642 / JF / jg in a perpendicularly spaced relationship with the first and third conductors with the second and fourth conductor transversely aligned and spaced laterally in a simultaneously energizing proximity, the first and third conductors being transversely movable in an electrically conductive relationship and the second and fourth conductors being transversely movable in an electrically conductive relationship in response to the exercise of the single, transverse force, a pressure sensitive, semiconductive composition sandwiched between at least one of the first and third pairs of conductors and the second and fourth pairs, conductors 10 for providing a contact resistance thereon, which contact resistance varies in response to variations in the magnitude of the single transverse force, a first utilization circuit coupled between the first and third conductors and a second utilization circuit coupled between the second and fourth conductors.

The device comprises: a first support layer having a top surface, at least one multi-segment conductor layer disposed on the top surface of the first support member, comprising a plurality of first, electrically separated, conductor segments, immediately adjacent, yet laterally spaced from each other and with a surface area, wherein one or more selected first electrically separated conductor segments are contacted simultaneously, in response to the application of a single transverse touch force, a second support member having an upper surface and a lower surface, a uniform conductive layer, applied to the bottom surface, opposite and transversely spaced from at least one conductive layer, the second support layer and the uniform conductive layer being resiliently deformable to deform the uniform conductive layer in an electrical contacting relationship with at least one selected conductive layer having more the other segments responsive to the application of the transverse force, wherein the uniform conductive layer comprises a first conductive layer applied to the bottom surface of the second carrier layer and a first Composite semiconductor layer applied to the first conductive layer to face opposite at least one multi-segment conductor layer and a transversal spacer disposed laterally between each multi-segment conductor layer and transversely disposed between the first and second support members for spacing the uniform conductor layer mm at least one multi-segment conductor layer} 8 00 6 40 9-521642 / JF / jg comprising the device: a housing defining a chamber with a bottom surface and side walls, a first conductor disposed adjacent the bottom surface of the chamber, a valve with a bottom -and top surface in main-5 parallel to the bottom surface and a hinge region d for movably mounting the valve in a spaced position above the bottom surface to extend from a side wall in the chamber, the valve movable in the chamber around the hinge portion, a second guide mounted on the bottom surface of the valve, a pressure-XO sensitive semiconductive composite layer, applied to cover at least one of the first conductor and the second conductor and a diaphragm, - around its circumference secured to the housing in a spaced relationship with the bottom surface For sealing the chamber, wherein the diaphragm is adhesively attached to the top surface 15 of the valve with a center region spaced laterally from the housing, and the second guide is movably movable with the valve in an electrically conductive relationship with the first guide through the diaphragm in response to variations in the compressive force, exerted ° P the diaphragm 20 in a stacked form. The configuration includes: a first support member having a top surface, a first conductor layer disposed on the top surface of the first support member, a second support member having one top surface, opposite the top surface of the first support member and having a top surface, the second support member 25 being spaced from the first support member, a second conductor layer, disposed opposite the first conductor layer and affixed to the bottom surface of the second support member in normally spaced relationship for defining a first switch, wherein at least one of the first and second conductor layer includes a first conductor-layer 30, which is attached to the adjacent first or second support member, as well as a first semiconductor layer, attached to the first conductor layer and juxtaposed with another of the first second support member, a third conductor layer on the top surface of the second support member, e and third support member having an upper surface and lower surface, opposite, yet spaced from the top surface of the second support member and a fourth conductor layer on the bottom surface of the third support member disposed opposite the third conductor layer in a normally spaced 8 00 6 40 9 -6- 21642 / JF / jg relationship for defining a second switch, wherein at least the second and third support members are resiliently defortable in response to the application of a transverse force to make electrical contact between the first and second conductor layer and 5 between the third and fourth conductor layer.

that it comprises a plurality of juxtaposed touch switches in a stacked configuration to be closed in response to a single transverse touch force, each touch switch comprising a first conductor layer, and a second conductor layer * adjacent to and located in a first conductor layer normally spaced related thereto, wherein at least one of the first and second conductor layers is resiliently deformable in electrical contacting relationship with the other V1 rt the first and second conductor layers by transverse touch force, each juxtaposed stacked touch switch being electrically separated of the other touch switches; comprising: a base member, a first contact on the base member, a second contact in a laterally spaced relationship with the first contact 20 on the base member, a resilient cover * having at least one fold formed therein for resiliently spacing at least a portion of the lid above the base member, and a semiconductor layer on a portion of the lid spaced above the base in a shunt relationship with the first and second contact, comprising at least one tri-sensitive, particulate semiconductor material, wherein the semiconductor layer has an exposed surface, arranged in a normally spaced relationship with the first and second contact and the semiconductor layer responds to an external compressive force to electrically shunt the exposed surface 30 of the semiconductor layer between the first and second contact to provide an electric disc h resistive transition region between the first and second contact along the exposed surface, the resistance across the electrically resistive transition region varying in response to variations in the external pressing force.

The present invention provides new, yet simple, pressure-sensitive, analog devices with a contact resistance that varies inversely with the amount of pressure applied to the device. When the device is used in electronic music instruments, 7 00 21 40 9 21642 / JF / jg, a number of such analog transducers or switches can be lined up side by side before providing a keyboard or a such a switch can be used before effecting the change in the tone by changing the characteristics of one or more tone · 1 generating circuits in the musical instrument.

Thus, the invention overcomes the drawback present in the devices described and shown in both U.S. Patent 2,375,178 and U.S. Patent 3,386,067. Furthermore, and in contrast to U.S. Pat. No. 3,806,471, the present invention uses the contact or surface resistance of a very thin layer of molybdenum disulfide. In addition to the aforementioned functional distinction, the configuration disclosed in the aforementioned U.S. Patent 3,806,471 fundamentally differs from the present invention, wherein the semiconductive composite layer must necessarily have at least one contact surface which is not in intimate contact with either a conductor or any other semiconductor layer. Such a device takes advantage of the physical contact resistance across the surface of the composition rather than the surface resistance of the individual particles through the bulk material as in U.S. Pat. No. 3,806,471.

The present invention uses particle sizes on the order of 1 micrometer and layer thicknesses preferably less than 0.001 inch. Furthermore, since the variable resistance occurs because of a greater or less number of surface contact sites, one surface of the semiconductor layer must either be initially spaced from one of the conductive electrodes or must be in intimate contact with the opposite surface. Depression of the conductive electrode against the surface of the thin semiconductor layer results in a number of contact points made along the surface.This number of contact points increases as more pressure is applied, causing the Resistance between the conductive plates or the contacts decreases on both sides of the semiconductor layer. The semiconductor layer is made of any suitable particulate semiconductor material which is held together and surface-held by means of a binder.

A significant example of the semiconductor thin layer of the present invention is that the semiconductor material used 800 6 40 9 -8- 21642 / JF / µg before forming the layer can be combined with a binder and a thinner for a binder and then sprayed or can be screen printed on a desired surface to form a layer with a thickness of 1 milli-inch or less. The amount of work 5 and material costs is thus significantly reduced.

In addition to the drawbacks mentioned above, the use of molybdenum disulfide to cover the conductive layers effectively protects the surface of the conductor from contact with air. This overcomes a serious problem which was present when using conductors which corrode slowly when exposed to the air.

The present invention also essentially eliminates electric vibration, which is inherent in most switches. When sensitive, the resulting switching structure is bounce-free.

In U.S. Patent 4,044,642, a touch sensitive resistance device is described and shown for use in musical instruments. However, the device uses a semiconductor material interposed between two conductor plates in a manner similar to that shown in the first two aforementioned U.S. patents. In particular, U.S. Pat. No. 4,044,642 of a resilient material, such as a foam rubber or foamed synthetic polymer material, which has a particulate material such as graphite dispersed therein. The link structure has a foamed semiconductor layer and an insulator layer 25 with one opening therethrough sandwiched between two conductor plates. When a Compression Force is applied, the graphite-saturated resilient foamy layer deforms in the gap in the insulator material to initially make electrical contact to thereby switch the musical instrument. Thereafter, an additional compressive force decreases the Resistance between the two conductor plates in a manner as described above.

It is therefore desirable to provide analog transducer devices which do not rely on the resilience of the semiconductor layer and which further do not rely on the volume resistance through relatively thick semiconductor layers. A particular embodiment of the invention includes a number of chord switches in a keyboard arrangement, so that when a chord switch is pressed, one or more musical notes will be generated. The determined chord can be easily modified by simply rolling the finger, which applies the transverse touch force.

In another embodiment of the present invention, a dual touch sensitive switching structure has two switches, which are energized simultaneously in response to a single touch force. A semiconductor composition can be applied over the switch conductors (contacts) of at least one of the switches, so that the resistance across the contact of that switch varies inversely with the amount of force applied.

The present invention encompasses pressure sensitive analog switches and transducers having a resistance which varies inversely with the compression force applied to the switch.

The pressure-sensitive transducer comprises a thin, pressure-sensitive, composite conductor layer applied to the surface of a resiliently movable cover. Alternatively, the pressure-sensitive semiconductor layer comprises a third conductor, such as a layer of silver on a surface of the cover in an envelope, and a pressure-sensitive semiconductor composition layer, applied to at least one of the first and second contact conductors.

Other embodiments of the invention include a pressure-sensitive and multi-switch devices which are energized simultaneously.

In summary, the invention provides a pressure sensitive analog variable resistance device having at least one pair consisting of a first and second conductor in a spaced band.

A pressure sensitive resistive conductor assembly is arranged in a position to connect a resistor between the first and second conductors when the resistive conductor assembly contacts the conductors. The amount of resistance thus connected therebetween varies inversely in proportion to the amount of pressure applied to the resistive composition. The invention can be applied as part of a multiple touch switch with either a lateral or vertical configuration. In addition, the invention can be implemented as a pressure transducer device with or without a spacer 35 between adjacent components of the device.

A full understanding of the present invention and of the above-mentioned advantages can be obtained by considering the following description of the preferred embodiments, in 8 00 6 40 9 -10-21642 / JF / jg context with the accompanying drawing, wherein: Fig. 1 is a cross-sectional view of an embodiment of a pressure sensitive analog switch, with the pressure sensitive cover layer applied between two conductor plates in a spaced relationship; Fig. 2 is a cross-sectional view of a bounce-free switching device in accordance with the invention; FIG. 3 is a pressure-to-tension curve showing the variations in stress across the semiconductor composite layers as the compression that compresses these two layers increases; Fig. 4 is a curve showing the output of the bounce-free switch in accordance with the invention shown in Fig. 5; FIG. 5 is an embodiment showing the bounce-free switching device of the present invention with only one semiconductor compound layer; Fig. 6 is a drawing showing partly disassembled parts and partly an electrical schematic of a dual lateral transducer switch in accordance with the invention in an unfolded open configuration; FIG. 7 is a cross-sectional view of the switch arrangement shown in FIG. 6 in the folded working configuration taken along line 7-7 in FIG. 6; FIG. 8 is a partially exploded view and partly an electrical schematic of another embodiment of the dual lateral switch embodiment of the invention; FIG. 9 is a partially schematic, partially cut away perspective drawing showing a chord switch structure in accordance with the present invention; FIG. 10 is a side cutaway view of a dual-function touch switch arrangement according to the present invention; FIG. 11 is an exploded sectional view of the embodiment of a pressure transducer according to the invention; FIG. 12 is a top plan view of the flexible base member of FIG. 11 in an unfolded configuration, showing the conductor patterns disposed thereon; Fig. 13 is an exploded sectional view of a second embodiment of the pressure transducer in accordance with the invention, wherein the top of the flexible base forms a valve, 8 00 6 409

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which is arranged to move transversely about a hinge section; FIG. 14 is a plan view of the flexible base used in FIG. 13 in an unfolded configuration, showing the conductor patterns mounted thereon; FIG. 15 is a simplified, partly sectional and partly schematic drawing of a musical instrument incorporating a pressure transducer drive, as shown in FIGS. 11 to 13; and FIG. 16 is a top view of the flexible base used in FIG. 13 in an unfolded configuration, showing another conductor configuration.

As shown in Fig. 1, an analog switch according to the present invention comprises a first conductor plate 50 spaced from a second conductor plate 52 by spacer portions 54 for defining a gap or chamber 60 between the first and second conductor plates 50 and 52. At least one of the conductor plates 50 or 52 is resilient so that it can be pressed against the other conductor plate to close the switch.

The guide plate may include a flexible support plate 64, such as Mylar, with a thin conductive layer 66 of silver or other conductive material that has been sprayed, screened or otherwise applied to the surface of the support plate 64 adjacent to the second guide plate 52. The second conductor plate 52 may include a rigid plastic base member 68 with a thin copper surface 70 mounted thereon. Of course, it will be appreciated that the base member 68 may be flexible and the thin surface 70 may be made of silver or other suitable conductive material.

A lead 56 and a lead 58 may be coupled to the silver layer 66 and the copper surface 70, respectively, to allow electrical coupling of the analog switch to a utilization circuit 30.

Finally, a semiconductor thin layer 62 of semiconductor material is sprayed, sieved or otherwise equally applied to the copper surface 70. Alternatively, the semiconductor material 62 can be sprayed, sieved or otherwise equally applied to the conductive layer 66 or both copper surface 70 as the conductive layer 66. The semiconductor material may be of any suitable composition which is sprayable, screenable or otherwise of a consistency which may be applied evenly to provide a smooth, exposed surface. JF / jg laid surface. The semiconductor material may be, for example, molybdenum disulfide applied in the form of particles of the order of one to ten microns in size, mixed with a bonding material, such as resin, to form a liquid. A resin-5 thinner can be added to give the composition a consistency suitable for spraying. The semiconductor thin layer 62 of the semiconductor material is then sprayed or screened onto the conductive layer 66 of the support plate 64 or onto the copper surface 70. On the Rigid base member 68, it will be appreciated, of course, that the semiconductor layer of arbitrary thickness as long as there is an exposed smooth semiconductor surface. However, in order to save semiconductor material and surface irregularities that can occur when thick semiconductor layers are used, a thickness on the order of about 0.001 inch or less is preferred.

The spacer 54 can take various forms. For example, in a particularly sensitive embodiment, shown in Fig. 1, the spacer 54 is simply an extension of the support plate 64, the support plate being folded around at least a portion of the circumference of the usable portion of the conductive layer 66. The fold 20 acts as a spring, which tends to maintain the distance in opposition to an externally pressing force or pressure. Thus, the fold not only gives a spacer but also gives the member 50 a resilience, which is significantly the sensitivity of the transducer enlarged

It will be appreciated that the configuration of Fig. 1 is only illustrative. Thus, the semiconductor layer 62 can be applied to one or both of the carrier plates 68 or 64 or it can be placed directly on the carrier plate 66 in order to act as a shunt between the conductors 56 and 58. When guide 58 is placed on the carrier plate 68 in a laterally spaced relationship to guide 56.

In FIG. 2, another embodiment of the invention is shown to provide a rounder-free switch device having a surface contact resistance that varies inversely with a pressure applied perpendicular thereto. In particular, a bounce-free Switch Device 100 has a first support member 102, which may be made of Mylar, a rigid plastic material or any other suitable non-conductive base material. A first conductor 104 is provided on the surface of the support member 102 with a first pressure sensitive composite layer 106 applied thereto to cover the 800 6 40 9 -13- 21642 / JF / jg conductor member 104 and to be in intimate contact therewith. to be.

Perpendicular to the first pressure-sensitive composition layer 106, an assembly consisting of a support member 110, which may be of Mylar, rigid plastic or other suitable non-conductive material, a guide member 112, is provided on one surface of the support member 110 and a second pressure-sensitive composition layer 114 provided to cover the conductor 112 and thereby be in intimate electrically conductive relationship. The assembly comprising the second support 110, the second conductor member 112 and the second, pressure-sensitive composition layer 114 is disposed opposite the assembly, comprising the first member 102, the first conductor member 104 and the first pressure-sensitive composition layer 106, so that the exposed surface 108 of the first pressure-sensitive composition layer 106 in a non-intimate * but touching relationship with the exposed surface 116 of the second pressure-sensitive composition layer 114, thereby defining a non-intimate contact transition 118,

The first and second pressure-sensitive saloon layers are made of a particulate semiconductor material having particle sizes, which are preferably on the order of 1 to 10 microns, although larger sizes are possible. The particulate layer layer is mixed with a binder material and, if necessary, a binder thinner, and then sprayed, screen-printed or otherwise applied to conductors 104 and 112. Each resulting pressure-sensitive composition layer 106 and 114 has a plurality of particles, which are outwardly extending the main surface of the respective pressure sensitive composition layers 106 and 114 to form micro-protrusions of particulate semiconductor material.

It is these micro-protrusions that allow the first and second pressure sensitive composition layers to touch without being in an intimately electrically conductive relationship. However, when pressure is applied, whereby the two surfaces are pressed together, the micro-protrusions on the respective pressure-sensitive composition layers are pressed together, creating more and more electrical contact points, thereby reducing the resistance across the transition 118. However, since there are always a small number of electrically contacting touch points, (although these are extremely few and results in a very high resistance, when the respective pressure sensitive composition layers are not compressed), the vibration that occurs when - 8 00 6 40 9

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-14- 21642 / JF / jg cousin mechanical contacts are brought into contact in conventional switches, virtually eliminated. Furthermore, any vibration that can be generated only occurs only when the resistance across the radiator 118 is extremely high, thus making the voltage drop across the transition 118 very high, making the relative voltage deviation or variation very small.

In operation, the pressure is applied in order to press the respective pressure-sensitive composition layers towards each other, so that the resistance across the oviposition 118 decreases as the number of contact points 10 between the micro-protrusions of the particulate semiconducting material increases, thus causing the voltage drop the transition will slow down.

This, in turn, results in an increase in the output voltage at 128 as shown in Fig. 3. By coupling these voltages to the threshold circuit 122, a thunder-free transition from the off to the on state at the output 130 as shown generally in Fig. 4.

Of course, Wórden will recognize that a threshold circuit is not necessary in Many circuit types, particularly those using CMOS circuit types, which have an inherent threshold.

An alternative embodiment of the invention in which only one of the conductors has a pressure-sensitive composition layer applied thereon is shown in Fig. 5. In particular, a conductor member 132 is provided on the top of an insulating support member 130 with a pressure-sensitive composition layer 134 arranged to cover conductor 132 and in intimate electrically conductive relationship thereto. The second conductor member 138 is similarly applied to the second support member 140. The second conductor 138 is then placed in a non-intimate, touching relationship with the exposed surface 136 of the pressure sensitive composition layer 134. In a manner similar to that previously described. the meticulous micro-protrusions of conductive material allow the conductor 138 to come into an abutting, but not intimate and virtually non-conductive relationship with the semiconductor layer 134, resulting in an extremely high transition resistance between the conductor 138 and the surface 136 of the pressure sensitive composition layer.

Although various particle sizes and layer thicknesses are possible in accordance with the invention, it has been found that there is an inverse relationship between the amount of electric vibration caused by 800 6 40 9 -15-21642 / JF / µg by closing or opening the switch contacts and the dimensions of the molybate disulfide particles. The finer the grain size of the molybdenum disulfide, the smoother is the overfill from the off to the on (or vice versa) state of the switch. In particular, it has been found that particle sizes of less than one micrometer and preferably rottd 0.7 micrometer provide a substantially vibration-free switch transition.

Another embodiment of the invention includes a new switch arrangement, which functions essentially as a double-pole OM-10 switch * whereby two independent switches are energized simultaneously, i.e. closed in response to a single transverse touch force. At least one of the switches may be pressure sensitive, so that the amount of voltage across the switch varies inversely with the amount of touch pressure applied to the switch.

As shown in Figures 6 and 7, the pressure actuated dual switch device 210 has a support member 212, which may be made of a flexible, resilient material, such as a thin layer of Mylar. The carrier member 212 has a first or bottom portion 214 and a second or top portion 216. The first portion 214 and the second portion 216 of the carrier member is defined by a fold line 218 * along which the second portion 216 is folded in an overlapping, but spaced horizontal, related to the first section 214.

A number of conductors are provided on one side of the support member 212. In particular, a first conductor 220 electrically connected to a first terminal 222 is mounted on the surface of the support member 212 in a first cartridge 224. A second conductor 230 electrically coupled to a second clamp 232 is mounted on the top of the carrier member 212 in a second cartridge 234. In the first cartridge 224 and the second cartridge 234 of the first conductor 220, and the second conductor 230, mounted on the first portion 214 of the support member 212.

A third conductor 240 is electrically connected to a third terminal 242 and is mounted on the second portion 216 of the support member 212 in a conductor pattern 244, which is the reciprocal or mirror-healed of the first conductor pattern 224. Finally, a fourth conductor 250 electrically connected to a fourth terminal 252. The fourth conductor 800 6 40 9 -16- 21642 / JF / jg dér 250 is disposed over the first portion 214 and on the second portion 216 of the support member 212. The fourth conductor 250 is mounted on the second portion 216 of the support member 212 in the cartridge 254, which is the reciprocal, i.e., the mirror image of the second cartridge 5 234.

The semiconductor assembly 260 is disposed on the top of at least one of the first, second, third and fourth conductors. Of course, it will be appreciated that the semiconductor composition 260 can be applied to the top of several of the conductors.

Thus, electrical contact will be made through the semiconductive composition layer. This effectively provides a contact resistance between conductors 220 and 240 so that a resistor is in series with the switch defined by conductors 220 and 240.

The semiconductive composite layer 260 may be of any suitable material that is sprayable, screenable or otherwise of a consistency which may be applied equally to form a smooth exposed surface covering the conductor as described above.

A dual pressure actuated switch structure can be formed by folding the support member 212 along the fold line 218 so that the second portion 216 is aligned over the first portion 214 and the pattern portions of the first conductor 220 and the third conductor 240 transversely. align and the pattern portions of the second conductor 230 and fourth conductor 250 are transversely aligned. The first and third conductors include the cash for a first switch and the second and fourth conductors include the contacts for the second switch.

A spacer 262 is provided to keep the conductors between the first portion and the second portion to keep the first and third conductors 220 and 240 and the second and fourth conductors 230 and 250 in a normally spaced relationship. It should be appreciated that the first and second conductors 220 and 230 on the first section 214 and the third and fourth conductors 240 and 250 on the second section 216 must be in close lateral proximity to permit a single transverse the first and third conductors 220 and 240 and the second and fourth conductors 240 and 250 simultaneously move in an electrically conductive relationship.

The switchgear can be used in an electrical switch 8 00 6 40 9 -17- 21642 / JF / jg 4 * circuit with a first and second utilization circuits 264 and 266. The utilization circuits 264 and 266 can be of any suitable arrangement circuit configuration, such as those described in U.S. Pat. Nos. 3,609,203 or 3,796,756.

It will be appreciated that the patterns formed by the conductors on the support member may have any configuration as long as the conductors for the respective two switches are sufficiently close to each other to enable simultaneous actuation by the finger of an operator. to make. In addition, the support member may be made in two portions, the first and third terminals are attached to the first support member and the second and fourth terminals are attached to the second support member.

In FIG. 8, another embodiment of the invention is shown which includes a first base member 270, which may be made of a flexible Mylar material, a rigid plastic material, or other suitable non-conductive support member and a second base support member 272 in a transversely spaced relationship with the first support member 270. A first conductor 274 is disposed on the surface of the first base member 270. The conductor 274 includes a first contact member 276 with a plurality of interlocking fingers 278 and a second contact member 280 also with a plurality of interlocking fingers 282. The first contact member 276 is electrically connected to a first terminal 284 and the second contact member 280 is electrically connected to a second terminal 286. A first utilizing circuit 288 can then be electrically coupled between the first terminal 284 and the second terminal 286 in a manner described above i n related to the embodiment shown in fig. 6.

A second guide 290 is similarly mounted on the surface of the first base member 270. The second guide 290 has a pattern, which in one embodiment is a U-shaped pattern, is arranged around a first guide 274. As discussed above. Embodiment, the honor conductor 274 and the second conductor 290 are laterally spaced on the first base member in a sufficiently close proximity so that a single transverse touch force will simultaneously energize the switches including the first conductor 274 and the second conductor 290.

A third conductor 292 is similarly mounted on a surface of the second base member 272 in an opposing, and in-line relationship with the first conductor 274 and a fourth conductor 294, arranged on the same surface on the second base member 272 in an opposing and aligned relationship with the second conductor 290. Thus, the first conductor 274 and the third conductor 292 comprise the contacts of a first switch and the second conductor 294 and the fourth conductor 294 includes the contacts of a second switch, according to the present invention.

In the preferred embodiment, the third conductor 292 is simply an electrically separated conductive portion on the second base member 272 with dimensions sufficient to overlap or cover the entire first conductor 274. The fourth conductor 294 has the dimensions and shape, corresponding to the second conductor 290. The first, two, third and fourth conductors 274, 290, 292 and 294 may be made of any suitable material and may be, for example, a thin layer of silver sprayed on, a thin layer of copper or other suitable conductive material.

In order to provide a variable contact resistance, a semiconductor composition 296, somewhat similar to that described above, may be applied to cover the first conductor 274, the third conductor 292 or one or both of the second and fourth conductors 290 and 294.

In yet another alternative embodiment, the semiconductor composition layer 296 can be omitted and the third conductor 294 made solely from the semiconductor composition. In such an embodiment, a separate conductive layer, such as the silver or copper layer as described above, need not be applied for the third conductor 292. finally, a second utilization circuit 298 may be connected between the second conductor 290 and the fourth conductor 294.

An advantage of this last embodiment is that a number of similar dual switch devices can be arranged in a keyboard device, whereby every fourth contact of each separate dual switch device can be connected in a common bus configuration, thereby increasing the number of electrical contacts which made to interconnect the number of dual switches in the keyboard device can be minimized.

Fig. 9 shows a partially cut-away drawing of another new multi-touch switch arrangement according to the invention, from 8 00 6 40 9-1921642 / JF / jg. This switch is particularly useful in generating a chord in response to the application of a single transverse touch force. The multiple touch switch 310 5 functionally includes a number of separate, electrically separated switches, grouped in pairs of two or more. Each such set includes a chord switch. A plurality of chord switches are arranged side by side to form a keyboard for a multiple touch switch device 310. In particular, the multiple touch switch switch device 310 includes a first support layer 320, which may be made of a rigid insulating plastic material or made from a resilient, deformable material such as Mylar. A plurality of multi-segment conductive layers 322 each representing a separate chord switch includes four first electrically separated conductors, for example conductors 324, 326, 328 and 330, each representing a single pole or a single contact of the separate electrically separated switches, respectively 325,327,329 and 331 are then affixed or otherwise affixed to the top surface 332 of the first support layer 320. In the embodiment of the invention, wherein one chord can be generated after applying a single transverse touch force, 2 x the several first electrically separated conductors 324, 326, 328, and 330 are placed in a sufficiently close lateral proximity to each other that when an operator presses his finger against the multiple touch switch device 310, the upper surfaces of the several first electrically separated conductors 324, 326, 328, and 330 contact can be brought together, thereby simultaneously generating all electrically separated switches 325, 327, 329 and 331.

While each of the first electrically separated conductors 324, 50 326, 328 et 330 may be a single layer made of a pure conductive material such as a layer of silver, copper or other similar material, in the preferred embodiment each of the first electrically separated layers comprises two layers, namely a conductive layer, which is attached to the top side of the first carrier layer 320 and a first 55 semiconductor composition layer, which is sprayed, screen-printed, electrostatically applied or vapor-deposited or otherwise applied to form a very thin layer of semiconductor material. totalp conductive layer covered.

8 00 6 40 9

J

-20 "21642 / JF / µg

By way of example and in accordance with this preferred embodiment, the first electrically separated conductor 324 comprises a first conductive layer 334, at the top of which a first semiconductor composition layer 336 is applied, by spraying, screen printing, or other suitable method.

Each of the first electrically separated conductors 324, 326, 328 and 330 are laterally spaced apart from each other to provide necessary electrical insulation. Insulating spacers are not used between the first electrically separated conductor, which includes a single chord switch, so that a smooth transition between one chord and another chord with already added or omitted notes can be achieved without clicking by simply rolling the finger. Control Person along the surface of the touch switch 310 to make and break contact with one or more of the first 15 electrically separated conductors. On the other hand, it is an insulating transverse; spacer to provide each multi-segment guide layer 322, i.e. also a chord switch.

For example, in the embodiment of Fig. 14, a plurality of sets of separate electrically separated switches, one for each chord to be generated, are arranged on the top surface 332, where each such set of electrically separated switches is located. surrounded by a transverse spacer 338.

The multiple touch switch device 31O further includes a second carrier layer 344 having a bottom surface 340, in which a uniform conductive layer 342 is mounted in common for all chord switches. The uniform conductive layer 342 may also be a copper or silver layer, which is preferably applied by electroplating, spraying, electrostatic galvanizing or any other suitable technique, whereby a thin conductive layer can be applied to the bottom surface 340 of the second support layer 344. preferred, yet

Preferably, yet not necessarily, a second semiconductor composition layer 346 is applied by spraying, screen printing or the like to the otherwise exposed surface of the uniform conductive layer 342. The resulting structure includes the second support layer 344, the uniform conductive layer 342 and the semiconductor composition layer 346 is then attached by ✓ gluing by appropriate mechanical fastening or other method to the transverse spacer 338 so that the semiconductor composition layer 346 is transversely opposite and spaced 800 6 4 (19 -21-21642 / JF / jg places the semiconductors at count layers of the chord switches.

The second support layer 344, the uniform conductive layer 342, and the semiconductor compound layer 346 are resiliently deformable so that when the operator presses his finger against the multiple touch switch device 310, the second support layer 344 resiliently deforms to form the semiconductor compound layer 346 in an electrical contact making force one or more of the semiconductor composite layers of one of the several sets of first electrically separated conductors, such as conductors 324, 326, 328, and 330.

It will be appreciated that thereby each of the electrically separated switches, such as switches 325, 327, 329 and 331, representing one chord switch, perform a separate switching function, but all or a selected number of those switches may be closed in response to the application of a single transverse touch * -15 force.

By way of illustration of the interconnection of the switch arrangement 310 of FIG. 8, a voltage controlled oscillator (VCO) 350, which generates a single high-frequency signal, is coupled to a top octave gerator 352, which is known, for example, in the art co-operates with a frequency divider circuit to generate a plurality of output signals, each with a different frequency on one of a plurality of output lines. In order to generate a chord using the multiple touch switch device 310 described above, it is only necessary to select four notes, and then identify the particular frequency of those musical notes. The output line of the top octave generator 352 at that frequency is then coupled to one of the first conductive layers of the first electrically separated conductors 324, 326, 328 or 330. Similarly, the remaining first conductive layers of the first electrically separated 30 conductors coupled to the appropriate output of the top octave generator. tor 352 with output signals with the remaining selected frequencies. Thus, when a single transverse touch force is applied to the multi-touch switch device 310, the semiconductor composite layer 346 will be pressed into contact with one or more of the semiconductor composite layers of the first electrically separated conductors 324, 326, 328, or 33Ö to form one or more signals, each at a different frequency, to be coupled to the uniform conductive layer 342, where these signals are combined and output to an amplifier 354 and then made audible through a loudspeaker 356 for 800 6 40 9 -22- 21642 / JF / µg.

In the preferred embodiment of the invention, the first electrically separated conductor 324 with its conductive layer 334 is coupled to the frequency output of the top octave generator 352 at the frequency 5 of the chord's magnitude. In addition, in order to make it easy for the root note of the chord to be played alone, the first electrically separated conductor 324 is wider than the remaining first electrically separated conductor * 326, 326, and 330.

It will also be apparent from the above description 10 that when an operator wishes to play a chord with four notes of different frequency, it is simply necessary to apply some transverse touch force in a place which is followed by will have the first semiconductor layer 346 contact with hiccups of the first electrically separated conductors 324, 15 326, 328 eii 330. If the operator wishes to omit a note from the chord, it is only necessary for the operator to slightly lift his finger to thereby open one or more of the separate electrically separated switches by canceling the transverse touch force.

The multiple touch switch device 310 may also include a single on / off switch stacked in a layer-like configuration in the above-described keyboard switch direction. For example, in Fig. 9, a first on / off switch guide 360 is applied to the top surface of the second support layer 344 and a two-way on / off switch guide 362 is disposed over the bottom surface of a third support layer 364 to face the first on / off switch guide 360. The first on / off switch guide 360 and the second on / off switch guide 362 are then spaced apart in a normally open switch configuration 30 by a spacer 366, which includes, for example, a strip of may include a rectangular cross-section secured between the second support layer 344 and the third support layer 364.

The on / off switch may be coupled between a voltage source 361 and the voltage controlled oscillator and the top octave generator. unless the keyboard is pressed to close at least one of the chord switches, said no power is applied to the voltage. controlled oscillator or by the top octave generator.

Each of the conductors of the present invention comprises each conductor -23- 21642 / JF / jg direct layer 322 with multiple segments of FIG. 9 a single electrical adjacent conductor instead of four electrical separated conductors. In the same configuration, a touch sensitive, single-note keyboard can be provided by interconnecting each electrically adjacent conductor to a different successive frequency output from the top octave generator, such as the top octave generator 352 shown in FIG. 9.

in Fig. 10, a dual function touch switch configuration, in accordance with the invention, has a first support member 620, 10 made of an insulating material, which may be flexible or rigid. The first support member 620 has a top surface 622 on which a first conductor layer 624 is applied.

A second support member 626, also made of insulating material, is spaced above the first support member 620 by first spacers 628. A second conductor layer 630 is provided or otherwise secured to the lower surface of the second support member 626, opposite, but in a spaced relationship with the first conductor layer 624. The second support member 626 is made of a material that is resiliently deformable so that the second conductor layer 630 can be pressed into contact with the first conductor layer 624 by applying a transverse force. F. The movement of the second conductor layer 630 in contact with the first conductor layer in response to an applied transverse force thus provides a first touch switch 632.

A second touch switch 642, which can also be made to operate in response to the same transverse force F, is provided by providing a first conductor layer 634 on the top surface of the second support member 626. A third support member, which is also made of a resilient deformable material, is spaced above the third conductor layer 634 by the second spacer 640. A fourth conductor layer 638 is attached to the lower surface of a third support member 636, opposite, yet spaced from the first conductor layer 634 in a normally open ie non-conductive dressing. The third support member 636 and thereby the fourth conductor layer 638 is spaced from the third conductor layer 634 by the second spacers 640.

In operation, the application of the transverse force F, which can be exerted by simply pressing against the top surface of the third support member 636, causes the third support member 636 and the fourth conductor layer 638 to be are deformed resiliently in electrically conductive contact with the third conductor layer 634 to thereby close the second switch 642 coupled between the power source 643 and the power source input of a utilization circuit 644. When additional transverse touch force F is applied, the second support member and thereby the third conductor layer 34 and the second conductor layer 630 are deformed so that the second conductor layer 630 is electrically connected to the first conductor layer 624 to thereby switch the first switch 632. and thus coupling an input signal to the utilization circuit 644.

In a basic embodiment of the present invention, the first, second, third and fourth conductor layers 624, 630, 634 and 638 each simply comprise a conductive layer or plate applied to the corresponding first, second or third support member, 620, 626 or 636.

In an alternative embodiment, at least one of the first and second conductor layers 624 and 630 comprises a conductive layer, on the top of which a layer of semiconductor material is applied to couple thereto by a resistor in series with the switch. Similarly, the second conductor layer 630 and second conductor layer 650 may include, which is covered by a second semiconductor composition layer 652.

Of course, it will be appreciated that one or both of the third and fourth conductor layers 634 and 638 may also be embodied in a semiconductor top surface layer to provide additional variable resistance across the switch 642.

Whether the switches 632 and 642 of the present dual function touch switch arrangement as described above are closed substantially simultaneously at the same time, it will be appreciated that there will in fact be a very small delay between the time when the fourth conductor layer 638 contacts the third conductor layer 634 and the time when the second conductor layer 630 contacts the first conductor layer 624. This very small delay allows power to be applied to the utilization circuit 644 before supplying the input signal to the utilization switch 644. This makes it the various circuit components may be substantially fully powered and thus operate prior to the input signal's 8 00 6 40 9 -25- 21642 / JF / µg connection.

It will be appreciated that more than two switches can be stacked on top of the other in a unitary touch switch arrangement to thereby provide a multi-function touch switch arrangement without departing from the spirit of the present invention. Any such additional touch switch arrangement can be configured in a manner as described above.

A different configuration of the present invention is shown in FIG. 10 showing a pressure transducer device 410 having a rigid base member 412, a Foldable flexible base member 414 with a bottom portion 416 and a top portion 418, a diaphragm spacer 422, a resilient, deformable diaphragm 424 and a retaining ring 426.

As shown in particular in Fig. 12, the flexible base member 414 in a non-folded configuration provides a connector portion 428 extending from the circular bottom portion 416 attached to the circular reciprocally formed top portion 418 through a bridge. or hinge portion 434. A first conductor 436 is mounted on the flexible base member 434 to extend from the connector clamp portion 428 to define a contact pad 440 on the center portion of the lower region 416. A second conductor 438 is mounted on the flexible base 414, starting on the connecting clamp portion 428 and extending in a semicircular velocity path around the circumference of the lower portion 416 over the hinge or bridge portion 434 and ending in a center location in the upper portion 418 for defining a contact pad 442. The first conductor 436 and the second conductor 438 are electrically isolated from each other insulated along the surface of the flexible base member 414.

The contact pads 440 and 442 and the top and bottom portions 416 50 and 4i8 can have any desired shape. However, both the contact pad 440 and the contact pad 442 should have such a shape and be arranged on the bottom portion 416 and the top portion 418, respectively, that when the top portion 418 is folded along a fold line 444, the contact pad 442 is transverse. 35 will align with the contact pad 440 to allow electrical conduction between the contact pad 440 and the contact pad 442 when the top portion 418 is folded against the bottom portion 416.

8 00 6 40 9 -26- 21642 / JF / jg

In order to provide variations in the potential drop between the first conductor 436 and the second conductor 438 in response to variation in the pressure with which the upper portion 418 is pressed into contact with the lower portion 416, a first semiconductor composite layer 5 446 is applied by spraying or in order to cover the first conductor 436 including the silver contact pad 440. Likewise, although not essential, a semiconductor lubricating array Layer 448 is also applied by spraying or the like to cover the second conductor 438 especially including the contact pads 442.

The semiconductor composition is preferably a mixture of molybdenum disulfide, a resin and possibly powdered carbon, which has been diluted with a heat thinner to a sprayable consistency. Therefore, a very thin layer of the semiconductor safflower setting layer can be applied to the top of the first and second conductors.

Referring again to Figure 11, the flexible base member, which may be made from a thin (preferably in the range of from 5 to 5 milli-inches), is Mylar folded in a sandwich-like configuration with the donut-shaped starter 420 therebetween. An adhesive material is then applied to the top and bottom surfaces of the spacer 420, keeping the bottom portion 416 and the top portion 418 apart from the coht tact pads 440 and 442 covered by the semiconductive composite layer in an opposed but spaced relationship. The bottom surface 428 of the bottom portion 416 of the flexible base is also adhered to the top surface 450 of the rigid base member 412. The bottom portion 416 of the flexible base 414 is held stiff by the rigid base 412, while the top portion 418 of the flexible base 414 is transversely movable in contact with the lower portion 416.

In the embodiment shown in Figures 11 and 12, the spacer 420 is positioned to bond the lower portion 416 and the upper portion 418 of the flexible base 414 along the entire circumference or at least a substantial portion of the circumference of the two sections 416 et 418. In one embodiment, the spacer 55 may simply be a double-sided adhesive tape cut to the appropriate shape.

A breathable opening 429 may also be provided between the chamber defined by the spacer 420 and the area outside of the 8 00 6 40 § -27- 21642 / JF / jg transducer 410.

The resilient, deformable diaphragm 424 is then adhesively attached to the top surface of the diaphragm spacer 422, which is adhesively attached to the top portion 418 of the flexible base member. The spacer 422 may be a toroidal or dot-shaped member of square or rectangular cross section and may also be cut from double-sided adhesive tape. Consequently, the circumferential edges of the resiliently deformable diaphragm 424 are spaced from the top portion 418 of the flexible base member 414. However, in order to ensure that the top portion 418 continuously responds to either increasing or decreasing pressure forces, a center portion of the resilient deformable diaphragm 424 spaced laterally from the edges of the diaphragm spacer 422 is adhesively attached to the top of the upper portion 4i8 and the flexible base member 414. Thus, as increasing pressure is released Exercised on the diaphragm 424, the top portion 418 will be pressed down until the thermal pad 424 covered with the semiconductor composition is electrically conductive with the contact pad 440 coated with the semiconductor composition. The greater the force applied to the top portion 418, the smaller the contact resistance between the top 1st and bottom Contact Pads, 442 and 440, respectively, and therefore the smaller the voltage drop across the first and second conductors, 436 and 438, respectively. As the compression force decreases, the inherent resilience of the diaphragm 25 424, which may, for example, be made of stretchable rubber such as damrübber, pull the upper portion 418 in a direction away from the lower portion 416, thereby increasing the contact resistance between the lower contact pad 440 and the upper contact pad 442 until the force applied to the diaphragm 424 is sufficiently small to contact the between the top and bottom contact pads 440 and 442, respectively, making the resistance infinite.

The resilient, deformable diaphragm 424 is preferably held adhesive over the top of the diaphragm spacer 442 by the retaining ring 426, which is also adhesively attached around the circumference of the diaphragm 424 so that the diaphragm 442 is flat or flat. configuration is held between the retaining ring 426 and the diaphragm spacer 422.

As shown in Figs. 13 et 14, an alternative 8 00 6 40 9 -28 "21642 / JF / jg embodiment includes a rigid base 412, an alternative flexible base structure 46Ö, a diaphragm spacer 422, a diaphragm 424, and a rigid bone member 426. As in the first embodiment, the lower surface of a lower portion 462 of the flexible base member 460 is adhesively attached to the rigid base 412. In addition, the spacer 422 attaches the diaphragm 424 to it in an adhesive manner. the flexible base member 460. A middle portion of the diaphragm 424 is then adhesively attached to the top or valve portion 464 of the flexible base member 460.

In Fig. 14, the flexible base member 460 has a first substantially circular cell-shaped lower portion 462 connected by a hinge or bridge portion 468 to the generally circular valve portion 464 which has a smaller diameter than the lower portion 462. member 466 is affixed securely around the circumference of the lower portion 462. The spacer 466 is a substantially toroidal spacer of square or rectangular cross section and having an interior having an area larger than the surface area of the valve portion 464 Thus, when the flap portion 464 is folded to overlie the lower portion 462, it will not be secured around its periphery, except for the hinge portion 468. Thus, the flap portion 464 is freely movable transversely about the hinge portion 468 in the region by the spacer 466.

In a manner similar to that described above in connection with Fig. 12, a first conductor 470 extends from one connection clamp portion 472 to form a centrally located contact pad 474 in the first portion 462 of the flexible base 460 .

A second conductor 476, mounted on the base 460, also extends from the connecting clamp portion 472, but extends in a path around the circumference of the first portion 462 over the hinge portion 468 and forms a contact pad 478, which is centrally located in the valve portion 464. A suitable semiconductor composite layer 480 is applied to cover at least the contact pad 474 and optionally the contact pad 478. The conductor pads 474 and 478 are arranged symmetrically on opposite sides of the fold line 486, so that when the flap portion 464 is folded along the fold line 486, the contact pad 478 will align in an opposing relationship with the contact pad 474.

In order to provide a sure movement of the valve portion 464, both 800 640 9 J »-29-21642 / JF / µg toward and away from the wide portion 462 of the flexible base in response to increases and decreases in the air pressure applied, the upper surface of the valve 464, opposite the surface on which the contact pad 478 is applied, is adhesively attached to the lower surface of the diaphragm in a central location of the diaphragm, laterally spaced from the inner circumferential angle of the diaphragm spacer 422. Thus, the valve portion 464 moves as the resiliently deformable diaphragm 424 moves, thereby causing variations in the contact resistance between contact pad 474 and contact pad 478 in response to variations in pressure applied to diaphragm 424.

The pressure transducer of the present invention can be used in any number of devices. However, a particularly advantageous application is in an electronic saxophone-like device 500, such as that shown in Fig. 15, which saxophone-like device 500 has a mouthpiece 502, an air chamber 504 and a pressure transducer 506i disposed in the end of the chamber 504 with the diaphragm directed inward toward the chamber 504. A plug 510 is inserted or otherwise locked into position in the opening end 508 of the saxophone-like device to rigidly hold the pressure transducer 506 in position. An additional pressure transducer 512 may also be mounted on the mouthpiece for pressing thereon with the lips. A connecting terminal 518 is connected to the connecting terminal 428 or 472 of Figures 12 and 14, respectively, or to connecting terminal 432 of Figure 13, as will be described below * or the selected pressure transducer according to the invention. A suitable electric tone generating circuit 416 is connected to the connecting terminal 514, so that, for example, the volume of the generated tone can be varied by the tone generating circuit 516 in response to the variation of the air pressure in the chamber 504, the harder the user blows in the nozzle 502, the greater the pressure in the chamber 504 and the greater the volume generated.

Fig. 16 shows an alternative pressure transducer according to the invention. In particular, the pressure transducer incorporates a first support member 530, which may be flexible or rigid (e.g., a PC-35 plate), a second support member 534, and a connector clamp portion 532 extending from the first support member 430. member is adhesively attached around the circumference of the first support member in a manner similar to that previously described 800 6 40 9 -30-21642 / JF / jg is shown in conjunction with FIG. 14.

Although the first support member 530 and the second support member 434 are shown as separate members, these may, of course, be a single organ which is adhered to the slide by a hinge portion, as in Figures 12 and 5, 14 in which case the second support member fragma, tilts around the hinge section when the diaphragm moves in and out. However, because the second support member provides only a shunt bearing, there is no need to provide a conductive connection over the hinge in this embodiment, as will be described below. Therefore, the second support member 434 can be detached from the eatable support member 530 and the second support member 434 is simply adhesively attached to the diaphragm, so that the second support member 434 moves at the diaphragm. A particularly suitable method for accomplishing this is spraying or screen printing semiconductor material onto the surface of Packlon tape, which is a printable tape, manufactured by 3M Corporation. A circular dot encapsulating this semiconductor coated tape is then mounted on the diaphragm opposite the first support member 530.

In order to provide a transducer device according to this embodiment, a first conductor 540 is placed on the surface of the first support member 530, the first conductor 540 comprising a first contact member 542 with a plurality of interlocking fingers 544 and a second contact member 546 also with a plurality of interlocking fingers 548. The interlocking fingers 544 and 548 interlock in an electrically separated relationship. A second guide 550 is disposed on the surface of the second support member 534 so that when the second support member 534 is adhesively attached to the diaphragm, the second guide section 550 will be transversely aligned adjacent to the first guide 450.

Before attaching the second support member to the diaphragm, a semiconductor composite layer 552 is applied to overlie the second conductor 550 to thereby provide a contact resistance between the first and second conductors 540 and 550 when those two conductors in electrical conductive bandages are pressed together by the movement of the diaphragm. Of course, it will be appreciated that the semiconductive composite layer may be applied to either the first or second conductors 540 or 550, or alternatively the second conductors 550 may be made entirely of the semiconductive composites -31-21642 / jF / jg theorem material, eliminating a separate conductor such as silver or copper. When the semiconductor layer is applied to the first and second support members, it is of course preferred that there is a laterally arranged insulating space between the semiconductor material on the two contact members. It will also be appreciated that the particular interlocking fingers may have any arbitrary shape and may, for example, be applied to the surface in a circular arrangement. Thus, in this embodiment, the second conductor portion acts as a shunt between the first and second contact members.

It will be appreciated that the spacers preferably have the thickness of a commercially available adhesive tape and that the Mylar layer in a preferred embodiment is around 3 milli-inches thick.

The contact pads may be of any suitable size and shape and may be circular, for example, having a diameter of about k to% inches. finally, in the above-described embodiment, when the semiconductor tape dot is applied to the diaphragm, only one of the spacers 420 and 422 is required.

While specific embodiments of the present invention have been considered, it will be appreciated that various other modifications can be made without departing from the true spirit and scope of the invention. Accordingly, it is an object of the claims to encompass all such modifications which fall within the true spirit and scope of the invention.

- CONCLUSIONS - 8 00 6 40 9

Claims (11)

1. Bounce-free switching device having a transition resistance which varies inversely with a pressure applied perpendicularly thereto, characterized in that the device comprises: a first conductor member, a first pressure-sensitive composite layer, comprising a particulate semiconductive material applied to cover the first conductor member in intimate, electrically conductive contact therewith further with a first exposed surface and a second conductor member applied in a touching, yet not intimate relationship with the first exposed surface of the first pressure sensitive composite layer for providing a transition with the transition resistance. 2. Dender-free switching device with a surface contact resistance which varies inversely with a pressure applied perpendicularly thereto, characterized in that the device comprises: a first conductor member, a first pressure-sensitive composite layer, comprising a particulate semiconductor material applied to cover the first conductor member in intimate, electrically conductive contact therewith and further with a first exposed surface, a second conductor or a second pressure-sensitive composite layer, comprising the particulate semiconductive material, arranged to cover the second conductor in intimate, electrically conductive contact therewith, and further with a second exposed surface, the first and second exposed surfaces being in contact with each other, yet non-intimate contact dressing being applied to each other providing a variable surface contact transition with the over resistance to it. 3. Dual switching device, defining two independent switches, which are energized simultaneously in response to a single transverse force, characterized in that the device comprises: a first support member, a first conductor mounted on the first support means, a second conductor , mounted on the first support member, a second support member, a third guide, arranged on the second support member and a fourth guide, arranged on the second support member, the first and second support members being arranged opposite each other, in a normally spaced relationship with the first and third conductors and wherein the second and fourth conductors are laterally spaced in a co-energizing proximity, the first and third conductors movable transversely in an 800 6 40 9 -33-21642 / JF electrically conductive relationship and the second and fourth conductors are movable transversely in an electrically conductive relationship in response to the application of the single transverse force, wherein the first and third conductors form a first switch and the second and fourth conductors form a second switch and a pressure-sensitive semiconductor composition arranged before providing a contact resistance across at least one of the first and second switches, wherein the contact resistance varies in response to variations in the magnitude of the single, transverse force, 4. Two-way switching device, which defines two independent switches, which are energized simultaneously in response to a single, transverse force, characterized in that the device comprises: a folding carrying member with a first section and a second section, a first section guide mounted on the support member, which first guide 15 defines a first pattern on the first section, a second guide arranged on the support member, which second guide defines a second pattern on the first section, a third guide arranged on the second section of the supporting member, which third conductor is arranged substantially in the mirror image of the first cartridge, a fourth guide member, arranged on the second part of the supporting member, which fourth guide is arranged mainly in mirror image of the second cartridge, and a pressure sensitive semiconductor composition arranged to overlie at least one of the first, second The third and fourth conductors have provided a contact resistance thereon, the carrier member being folded transversely to align the first and third conductors and the second and fourth conductors in a normally spaced relationship, the pair consisting of from the first and second conductors and the pair consisting of the second and fourth conductors are arranged laterally in a simultaneously energizing proximity, the first and third conductors being movable transversely in an electrically conductive relationship and the second and fourth conductors be transversely movable in an electrically conductive relationship in response to the single, transverse force. 5. device for generating at least one tone, comprising a switching device defining two switches which are energized simultaneously in response to a single transverse force, characterized in that the switching device comprises: a first carrying member , a first guide, mounted on the first carrier member, 800 6 40 9 -34- 21642 / JF / jg a second guide, mounted on the first carrier member, a second carrier member, a third guide mounted on the second carrier member, a fourth guide Attended to the second support member, the first and second support members being juxtaposed with a perpendicularly spaced relationship to the first and third guides and the second and fourth guides transversely aligned and spaced laterally in a simultaneously energizing proximity, with the first and third conductors movable transversely in an electrically conductive relationship and the second and fourth conductor transver-dull movable in an electrically conductive relationship responsive to the application of the single transverse force, a pressure sensitive semiconductive composition disposed between at least one of the first and third pair of conductors and the second and second conductors. fourth pair of conductors to provide a contact resistance thereon, which contact resistance varies in response to variations in the magnitude of the single transverse force, a first utilization circuit coupled between the first and third conductors and a second utilization circuit coupled between the second and fourth conductor. 6. Device for generating at least one tone, comprising a dual switching device defining two switches, which are energized simultaneously in response to a single transverse force, characterized in that the dual switching device comprises: foldable support member having a first section and a second section, a first guide mounted on the first section of the support member, having a second guide mounted on the first section of the support member, a third guide arranged on the second section of the support member a fourth conductor disposed on the second portion of the carrier member, a pressure sensitive semiconductor assembly disposed to cover at least one of the first, second, third and fourth conductors before providing a contact resistor thereon, the carrier member being folded to align the first and third guides transversely with the second and fourth g conductor in a normally spaced relationship, the first and third conductors defining a first of two switches, the first and 55 third conductors being transversely movable in an electrically conductive contact and the second and fourth conductors the second of the defines two switches and are transversely movable in an electrically conductive contact, the first and second switches being energized simultaneously in response to the single transverse force, a first utilization circuit, coupled between the first and third conductors and a second utilization circuit coupled between the second and fourth conductors. Multiple touch switch arrangement, to be selectively actuated in response to the application of at least one transverse force, not characterized in that it comprises: a first support layer having a top surface, at least one multi-segment conductor layer applied to the top surface of the first support member, comprising a plurality of first, electrically separated conductor segments, immediately adjacent, yet laterally spaced apart, and having a surface region, contacting one or more selected first, electrically separated conductor segments in response to the application of a single transverse contact force, a two-way support member having a top surface and a bottom surface, a uniform conductive layer applied to the lower surface, opposite and transversely spaced from at least one conductive layer, the second support layer and the uniform conductive layer resilient deformable For deforming the uniform conductive layer into an electrical contacting relationship with at least one selected multi-segment conductive layer in response to the application of the transverse force, wherein the uniform conductive layer comprises a first conductive layer applied to the bottom surface of the second carrier layer, as well as a first composite semiconductor layer, disposed on the first conductive layer to be opposed to at least one multi-segment conductor layer and a transverse spacer disposed laterally between each multi-segment conductor layer and transversely disposed between the first or second support member for spacing the uniform conductive layer of at least one multi-segment conductor layer. O. Multiple touch switch device for selectively actuated in response to the application of at least one transverse force, characterized in that it comprises: a first support member having an upper surface, at least one multi-segment conductor layer applied to the top surface of the first support member, comprising a plurality of first, electrically separated conductor segments, immediately adjacent, yet laterally spaced from each other and with a surface region, with at least one selected first electrically separated 800 6 40 9 -36-21642 / JF / The conductor segment is contacted simultaneously in response to the application of the single transverse touch force, a second support member having an upper surface and a lower surface, a first conductor layer applied to the lower surface, the first support member 5, said first conductor layer having a plurality of conductive areas, where every area is opposite one of the first electrically separated conductor segments is a resistance network to be electrically connected between the juxtaposed first electrically separated; conductor segments of conductive portions of the first conductor layer when the transverse force is applied to the second support member, the second support member and the first conductor layer being resiliently deformable in response to the application of the transverse force and a transverse spacer arranged laterally between each multi-segment conductor layer and transversely disposed between the first and second support members for spacing the first conductor layer from the multi-segment conductor layers. 9. Multi-fold touch switch device for selectively actuated in response to the application of at least one transverse force, characterized in that it comprises: a first support member having an upper surface, a plurality of first, electrically separated, conductor segments, laterally are spaced apart, each conductor being responsive to the application of a transverse force, a second support member having an upper surface and a lower surface, a uniform conductive layer applied to the lower surface, opposite, yet transversely or, spaced from the number of first electrically separated conductor segments, wherein the second support member and the uniform conductive layer are resiliently deformable for deforming the uniform conductive layer in electrically contacting relationship with at least one selected first electrically separated conductor segment, the uniform conductive layer forming a first jelly the layer which is disposed on the lower surface of the second support member, as well as a first semiconductor composite layer disposed on the first conductive layer to be opposed to the plurality of first electrically separated conductor elements and a transverse spacer disposed laterally between each first, electrically separated conductor segment and transversely between the first and second support members for spacing the uniform conductor layer of the number of first, 8, 00, 6, 40, 9-37-21642 / JF / µg electrically separated conductor grains. Multi-touch switch device to be selectively actuated in response to the application of at least one transverse force, characterized in that the device comprises: a first support member with an upper surface, a plurality of first electrically separated conductor aggettes, which are laterally spaced from each other and each responsive to the application of a transverse force, each first electrically separated conductor segment comprising a first conductive layer disposed on the top surface of the first transducer layer and a first composite semiconductor layer provided On the first conductive layer, a second support member having a top surface and a bottom surface, applied a uniform conductive layer, applied to the bottom surface, opposite, yet spaced transversely from the plurality of first electrically separated conductor segments, wherein the second support member and the uniform jelly deformation layer are resiliently deformable for deforming the uniform conductive layer in electrical contacting relationship with at least one selected first electrically separated conductor segment in fc in response to the application of the transverse force and a transverse spacer arranged laterally between each first electrically separated conductor. segment and transversely between the first and second support members for spacing the uniform conductive layer from the plurality of first, electrically separated, conductor segments. 11. Pressure transducer device, characterized in that it comprises: a housing defining a chamber with a bottom surface and side walls, a first conductor disposed adjacent to the bottom surface of the chamber, a valve with a bottom and top surface in substantially parallel to the bottom surface and a hinge region for movably attaching the valve to a spaced position above the bottom surface to extend a side wall in the chamber, the valve being movable in the chamber around the hinge portion, a second conductor, mounted on the bottom surface of the valve, a pressure-sensitive, semiconductor composite layer, applied to cover at least one of the first conductor and the second conductor and a diaphragm, attached around the circumference to the housing in a spaced relationship with the bottom surface to seal the chamber, with the diaphragm attached to the top surface of the valve net a center region spaced laterally from the 8 00 6 40 9 * -38- 21642 / JF housing, and wherein the second guide is variably movable with the valve in an electrically conductive relationship with the first guide through the diaphragm in response to variations in the compressive force applied to the diaphragm. 12. Drüktrahsducent device, characterized in that it comprises: a first member, a first conductive contact arranged on the first organ, a second member, a second conductive contact arranged on the second member, wherein the second conductive contact normally spaced from the first conductive contact to be movable in one electrically conductive relationship with the first conductive contact, a pressure sensitive semiconductive composition, comprising at least one of the first and second conductive contacts on the first and second means for providing a variable contact resistance between the first and second conductive contact, a diaphragm which is resilient and variably movable in response to variations in the pressure applied thereto, the diaphragm being secured about its circumference to the second member in a spaced relationship thereto and with a center region attached to the second member, where at the second conductive contact is movable with the diaphragm in an electrically conductive relationship with the first conductive contact. Pressure tread ducer device, characterized in that it comprises: a base structure, a first conductor attached to the base structure, a first spacer with a central spacer attached to. the base structure surrounding the first conductor, a flap with a hinge section attached to the first spacer in a spaced relationship with the first conductor, which flap has an upper and lower surface, a second conductor mounted on the top surface of the valve, opposite the first conductor, the second conductor movable transversely with the valve in contacting relationship with the first conductor, a pressure-sensitive, semiconductive, composite layer applied to cover at least one of the first and the second guide, a second spacer having a central space, attached to the first spacer surrounding the valve, the hinge portion being held between the first spacer and second spacer, a diaphragm circumferentially thereof is attached to the periphery of the second spacer and over the central space of the second spacer for defining an enclosed chamber with the valve therein, with the top surface of the valve adhered to the diaphragm eri at the center portion thereof, which is laterally spaced from the second spacer, wherein the second guide with the valve is movable in an electrically conductive relationship with the first guide extinguishes the diaphragm in response to the pressure force applied to the diaphragm » 14, Pressure transducer device, characterized in that it comprises: a rigid base member, a flexible base member, which is Foldable to define an upper portion having an upper and a lower surface, and a lower portion attached to the rigid base member, a first conductor, applied to the flexible base member in a first place on the bottom portion, a second conductor, applied to the flexible base member in a second place on the bottom surface of the top portion, one semiconductive composite layer, applied for covering at least one of the first and second guides, the flexible base member being folded to position the second guide so that it faces the first guide, a first spacer attached to the flexible base member for spacing the top portion of the flexible basic organ of the body part of the flexible basic organ, in which the above part lt 20 is movable in a contacting relationship with the lower portion, a second spacer attached to the top surface of the lower portion of its flexible base about its circumference and a diaphragm mounted around its deflection on the second spacer transversely to distance from the top portion of the flexible base, the diaphragm being attached to the top surface of the top portion of the flexible base in a central location, laterally spaced from the second spacer. A pressure transducer device, characterized in that it comprises: a housing defining a chamber having a bottom surface and side walls, a first conductor disposed adjacent the bottom surface of the chamber, a diaphragm which its periphery is attached to the housing in a spaced relationship with the bottom surface for enclosing the chamber, a first support member, bonded to the diaphragm to a center portion thereof, laterally spaced from the housing, a second guide mounted on the first support member, which second guide is variably movable with the valve in electrically conductive relationship with the first guide through the diaphragm in response to variations in the thrust force applied to 8006409 -40-21642 / JF / jg the diaphragm and a pressure-sensitive semiconductive composite layer applied to cover at least one of the first conductor and the second conductor, 16 * Touch switch device having a dual function, characterized in that it comprises in a stack-like configuration: a first support member having a top surface, a first conductor layer disposed on the top surface of the first support member, a second support member with a top surface, opposite the top surface of the first support member and having a top surface, wherein the second support member 10 is spaced from the first support member, a second conductor layer disposed opposite the first conductor layer and attached to the lower hopper surface of the second support member in normally spaced band For defining of a first switch, wherein at least one of the first and second conductor layers comprises a first conductor layer attached to the adjacent first or second support member and a first semiconductor layer affixed to the first conductor layer and spaced oppositely from a other of the first t a second support member, a third conductor layer on the top surface of the second support member, a third support member having an upper surface and a lower surface opposite, yet spaced from the top surface of the second support member and a fourth conductor layer on the bottom surface of the third support member positioned opposite the third conductor layer in a normally spaced relationship for defining a second switch, wherein at least the second and third support members are resiliently deformable in response to the application of a transverse force to make an electrical contact between the first and second conductor layer and between the third and fourth conductor layer. 11i Multi-function touch switch device, characterized in that it comprises a plurality of touch switches in a stacked configuration to be closed in response to a single, transverse touch force, each touch switch comprising a first conductor layer and a second conductor layer disposed opposite the first conductor layer in a normally spaced relationship thereto, at least one of the first and second conductor layers being resiliently deformable in electrical contacting relationship with the other of the first and second conductor layers by transverse contact force, each stacked 800 6 40 9 - 41- 21642 / JF / jg touch switch electrical is separated from the other touch switches. boot. 18 * Pressure sensitive transducer, characterized in that it comprises: a base member, a first contact on the base member, a second contact in a laterally spaced relationship with the first contact on the base member, a resilient cover, with at least one fold formed therein for resiliently spacing at least a portion of the lid above the base member, and a semiconductor layer on the portion of the lid spaced above the base in a 10. a first and second contact bandage comprising at least a pressure sensitive particulate semiconductor material, the semiconductor layer having an exposed surface, arranged in a normally spaced relationship with the first and second contact and the semiconductor layer responding to an external compressive force electrically shunting the exposed surface of the semiconductor layer between the first and second contact to provide an electrically resistive transition region between the first and second contact along the exposed surface, the resistance across the electric resistance The bidding transition region varies in response to variations in the external pressing force. Eindhoven, November 1980. 8006409