NL2038830A - Shape memory alloy driven multi-stage control jet impingement heat exchanger - Google Patents
Shape memory alloy driven multi-stage control jet impingement heat exchanger Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H10W40/475—
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- Microelectronics & Electronic Packaging (AREA)
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- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This invention proposes a multi-stage control jet impingement heat exchanger driven by shape memory alloy, including: a lower cover plate, a coupling flow channel plate, a heat insulation plate, a jet plate, and an upper cover plate stacked sequentially. The heat exchanger still has a jet impingement flow channel and multi-stage jet regulating components, which adjust the flow rate of cooling medium in the jet impingement flow channel based on the induction temperature of the shape memory alloy. The flow situation can be diVided like: no flow of cooling medium, flow with a first flow rate, flow with a second flow rate, and flow with a third flow rate, wherein the first, second, and third flow rates are in a sequence of proportional growth.
Description
SHAPE MEMORY ALLOY DRIVEN MULTI-STAGE CONTROL JET
IMPINGEMENT HEAT EXCHANGER
TECHNOLOGY FIELD
[0001]This invention relates to thermal control technology field, especially to a multi- stage control jet impingement heat exchanger driven by memory alloy.
[0002]With the increasing application of electronic components with high heat flux density in aerospace, electronic information, and other fields, and the development towards high integration, high performance, multifunction, and miniaturization, the heat flux density of the electronic components has sharply increased. According to related literature, as the heat flux density increases and the temperature of electronic components rises, the reliability and service life of electronic devices drastically decrease. For every 2 degrees Celsius increase in temperature, the reliability of performance will decrease by 10%. Statistics show that temperatures exceeding the rated values account for 55% of electronic equipment failures. At the same time, temperature uniformity is also an important indicator; and excessive temperature differences will cause significant thermal stress which lead to uneven stress distribution and thus mechanical failure.
[0003]Liquid cooling technology can meet the current cooling needs of electronic devices, mainly through the cooling medium flowing in the channels which exchanging heat with the internal walls of the heat exchanger and thus removing the heat generated by the heat source. The structure of the heat exchanger will significantly affect the cooling effect of the cooling system.
[0004]Traditional liquid cooling channels often achieve better heat exchange effects through structural design such as channel size optimization, shape optimization, and topology optimization. The design cycle is long, and the channel design fixed in advance cannot adapt to local temperature change by automatic adjustment and thus is short of versatility and universality.
[0005]The heat exchange efficiency of conventional liquid cooling channels is affected by temperature gradients, causing uneven temperature distribution of the fluid as it flows over the heat exchange surface. This results in some areas being too hot while others are too cold, affecting the overall heat exchange effect. Due to the uneven flow of the fluid 1 in the liquid cooling channels, hot spots are likely to occur on the heat exchange surface, causing local overheating and affecting the stability and lifespan of the equipment.
[0006]The control system of traditional liquid cooling channels is limited by external conditions and set parameters for using mechanical valves, pumps, or solenoids to regulate fluid flow,and is difficult to achieve real-time adjustment and adaptive control of fluid flow. The above-mentioned control system with a relatively slow response speed cannot meet the requirements of some conditions that require rapid adjustment, and easily leads to temperature fluctuations and instability.
[0007]In summary, the existing non-contact liquid cooling heat exchanger design methods have three issues as follows:
[0008](1)Different heat source distributions of various electronic components need different designs of heat exchanger. Traditional liquid cooling heat exchangers usually have fixed flow paths, which means that the cooling medium cannot be optimally distributed according to actual needs when flowing through the channels and some parts or the heat exchangers are overcooled while others are not sufficiently cooled, which reducing the overall cooling efficiency of the system.
[0009](2) The flow channel designs in traditional liquid cooling heat exchangers typically use rigid materials to construct the flow channel structure, limiting the adaptability and flexibility of the flow channels when facing different working conditions.
Therefore, the flow channels in traditional liquid cooling systems struggle to adaptively adjust their structure and shape to adapt to different cooling demands or changes in the working environment, leading to decreased cooling efficiency and performance.
[0010](3) Heat exchangers that use topology-optimized flow channels involve complex mathematical models and computational methods. Optimizing the flow channel structure requires considering multiple factors, such as fluid dynamics, heat conduction, and material mechanics, necessitating substantial computational resources, software, and a lengthy period to complete the optimization process. This leads to a long design cycle, which is not conducive to rapid development and application; the results of topology- optimized flow channel design highly depend on initial conditions and parameter settings.
Different initial conditions and parameter choices may lead to different optimization outcomes, thus requiring experienced engineers to guide and adjust the optimization process to ensure that the optimal flow channel structure can meet practical needs. For some complex geometric shapes and flow channel structures, advanced manufacturing technologies and processes are needed, increasing manufacturing cost and difficulty. Due 2 to the diversity of different flow channel design needs, each application scenario requires specific optimization methods and tools, increasing the complexity and difficulty of flow channel design, and lacking universality.
[0011]Shape memory alloy technology brings unique advantages to jet impingement heat exchangers, especially in enhancing temperature uniformity and achieving adaptive control. These advantages make shape memory alloy driven jet impingement heat exchanger to be a highly efficient and reliable heat exchange equipment, expected to play a significant role in various industrial applications.
[0012]Chinese patent 201811003373.9 proposes a shape memory alloy driven self- regulating flow channel heat exchanger and method. This patent discloses a shape memory alloy driven self-regulating flow channel cold plate and self-regulating method.
The exchanger includes an upper cover plate, a lower cover plate, and a flow channel plate located between them, also includes a double-layer structure of flow channels formed on the upper and lower surfaces of the flow channel plate, with several component slots on the upper flow channel for placing flow channel regulating components which include a push rod, a shape memory alloy spring on the push rod, and a spring, also includes a movable flow channel wall fixed on the push rod; the inner surface of the upper cover plate 1s equipped with a thermal conduction mechanism that fits with the component slots; the component slots are filled with cooling medium. Heat transfers from the thermal conduction mechanism and cooling medium to the shape memory alloy spring, thus the spring changes its elasticity and thereby drives the push rod to move the movable flow channel wall correspondingly to open and close the branch flow channels of the upper flow channel, and finally the temperature distribution is regulated on the surface of the cold plate. This patent solves the problem of uneven heat dissipation of heating devices and uncontrollable cold plate temperature due to the non- automatic adjustability of the cold plate flow channel structure.
[0013]However, the flow channel adjustment components in the aforementioned technologies can only achieve open and close control, and cannot precisely control the jet flow rate according to temperature changes. Hence, there are issues of low control precision and poor temperature uniformity.
[0014]This invention solves the technical problems, such as the poor uniformity of temperature, the lack of precise control over jet impingement, and low heat exchange efficiency, and provides a multi-stage control jet impingement heat exchanger driven by 3 shape memory alloy.
[0015]According to the embodiment of the present invention, a multi-stage control jet impingement heat exchanger driven by memory alloy includes: a lower cover plate, a coupling flow channel plate, an heat insulation plate, a jet plate, and an upper cover plate sequentially stacked.
[0016]The multi-stage control jet impingement heat exchanger has a jet impingement flow path and multi-stage jet regulating components which control the flow of cooling medium in the jet impingement flow path based on the induction temperature of the memory alloy parts.
[0017]When the induction temperature of the memory alloy part is lower than the first temperature threshold, the multi-stage jet regulating components are in a closed state, and there is no cooling medium flowing in the jet impingement channel.
[0018]When the induction temperature of the memory alloy part is higher than or equal to the first temperature threshold and lower than the second temperature threshold, the multi-stage jet regulating components are in a first open state, and the cooling medium flows with a first flow rate in the jet impingement channel.
[0019]When the induction temperature of the memory alloy part is higher than or equal to the second temperature threshold and lower than the third temperature threshold, the multi-stage jet regulating components are in a second open state, and the cooling medium flows with a second flow rate in the jet impingement channel.
[0020]When the induction temperature of the memory alloy part is higher than or equal to the third temperature threshold, the multi-stage jet regulating components are in a third open state, and the cooling medium flows with a third flow rate in the impingement channel.
[0021]Wherein, the first flow rate, the second flow rate, and the third flow rate are in a sequence of proportional growth.
[0022]In some embodiments of the invention, the coupling flow channel plate is provided with a circular nested channel, which includes multiple matrix-arranged sub-circular channels, where any two adjacent sub-circular channels are interconnected.
[0023]In some embodiments of the invention, the jet impingement channel includes:
[0024]Multiple upper impingement holes, which penetrate the jet plate along the thickness direction.
[0025]Multiple jet through holes, which penetrate the heat insulation plate along the thickness direction, and arranged in one-to-one correspondence to the multiple upper 4 impingement holes.
[0026]Multiple lower impingement holes, which penetrate the coupling flow channel plate along the thickness direction to the annular nested channel, and arranged in one-to- one correspondence to the said multiple jet through holes.
[0027]In some embodiments of the invention, the coupling flow channel plate is provided with multiple mounting slots for installing the multi-stage jet regulating components, and the multiple mounting slots are arranged in one-to-one correspondence to the multiple lower holes.
[0028]In some embodiments of the present invention, the multi-stage jet regulating components in the mounting slot are submerged by the liquid working medium.
[0029]In some embodiments of the present invention, the multi-stage jet regulating component includes:
[0030]Valve plate, which is provided with multiple matrix-arranged regulating holes. [003 1]Adjusting spring, which rests against one end of the valve plate.
[0032]Memory alloy parts, which includes a primary memory spring, a secondary memory spring, and a tertiary memory spring that rest against the other end of the valve plate.
[0033]In some embodiments of the invention, the regulating holes are arranged in three rows and three columns, totaling nine. When the induction temperature of the shape memory alloy part is below the first temperature threshold, all nine regulating holes are located outside the jet impingement channel.
[0034]When the induction temperature of the primary memory spring is higher than or equal to the first temperature threshold and lower than the second temperature threshold, the primary memory spring extends and drives one column of regulating holes to extend into the jet impingement channel.
[0035]When the induction temperature of the secondary memory spring is higher than or equal to the second temperature threshold and lower than the third temperature threshold, the secondary memory spring extends and drives two columns of regulating holes to extend into the jet impingement channel;
[0036]When the induction temperature of the tertiary memory spring is higher than the third temperature threshold, the tertiary memory spring extends and drives three columns of regulating holes to extend into the jet impingement channel.
[0037]In some embodiments of the invention, the multi-stage control jet impingement heat exchanger further includes a control component which is electrically connected to 5 the memory alloy component.
[0038]In some embodiments of the invention, the heat insulation plate is aerogel, insulation film, or insulation cotton.
[0039]In some embodiments of the invention, the heat insulation plate is bonded to the coupling flow channel plate, and the lower cover plate is welded to the coupling flow channel plate, and the coupling flow channel plate is welded to the jet plate, and the jet plate is welded to the upper cover plate.
[0040]Compared with the existing technology, this invention has the following effects:
[0041]1) This invention solves multiple issues such as the single channel structure of traditional heat exchangers, fixed channel flow, complex restrictions of topology optimized channel structures, and lack of precise control over jet flow. A new type of channel structure has been designed, and precise control over the jet flow has been implemented, further enhancing the versatility and intelligence of the heat exchanger, improving its heat exchange capabilities, and significantly enhancing temperature uniformity.
[0042]2) This invention adopts a structural shape channel design involving a multi-stage jet regulating component with three-level shape memory alloy springs coupled with circular nested flow channels, which transforming the heat exchanger from a conventional passive one to an active, adaptive, smart heat exchanger with precise flow control. By adjusting the phase transition temperature and heat treatment process of the shape memory alloy components, intelligent structure enables precise adaptive control with temperature changes. This adaptive control capability allows the heat exchanger to automatically adjust the jet speed and impingement intensity according to actual working conditions and demands, achieving optimal heat exchange performance. At the same time, it significantly reduces pressure drop, thereby reducing pump power consumption, further enhancing its cooling performance, and improving heat exchange efficiency.
[0043]3) This invention achieves transfixion between the upper and lower flow channels with jet impingement channel. A three-stage flow control device is designed referring to the properties of shape memory alloys to effectively optimize the flow characteristics of the jet, allowing the cooler medium with lower temperature to be directed quantitatively to the heat-generating areas based on the temperature levels, and rapidly reducing the temperature of these heat-generating areas, achieving a more uniform temperature distribution, and thus realizing temperature equilibrium during the heat exchange process.
This uniformity in temperature ensures that the temperatures of various parts of the heat 6 exchanger are essentially consistent during operation, effectively enhancing the heat exchange efficiency and uniformity of the heat exchanger.
[0044]JFIG. 1 is a structural schematic diagram of a multi-stage control jet impingement heat exchanger driven by shape memory alloy according to embodiments of the present invention.
[0045]FIG. 2 is an exploded diagram of a multi-stage control jet impingement heat exchanger driven by shape memory alloy according to embodiments of the present invention.
[0046]FIG. 3 is a schematic diagram of the jet plate structure of a multi-stage regulated jet impingement heat exchanger according to embodiments of the present invention.
[0047]FIG. 4 is a schematic diagram of the heat insulation plate of a multi-stage control jet impingement heat exchanger according to embodiments of the present invention.
[0048]FIG. 5 is a sectional diagram of the partial structure of a multi-stage regulated jet impingement heat exchanger according to embodiments of the present invention.
[0049]FIG. 6 is an exploded diagram of the partial structure of a multi-stage regulated jet impingement heat exchanger according to embodiments of the present invention. [OOSOJFIG. 7 is a schematic diagram of the partial structure of a multi-stage regulated jet impingement heat exchanger according to embodiments of the present invention.
[0051]FIG. 8 is an exploded diagram of the coupling flow channel plate according to embodiments of the present invention.
[0052]FIG. 9 is a sectional diagram of the coupling flow channel plate according to embodiments of the present invention.
[0053]FIG. 10 is a combined schematic diagram of the coupling flow channel plate and the heat insulation plate according to embodiments of the present invention.
[0054]FIG. 11 is a structural chematic diagram of the coupling flow channel plate according to embodiments of the present invention. [00S5TFIG. 12 is a side view of the coupling flow channel plate according to embodiments of the present invention.
[0056]FIG. 13 is a schematic diagram of the A-A section shown in FIG. 12.
[0057]FIG. 14 is a schematic diagram of the multi-stage jet regulating component of the multi-stage regulated jet impingement heat exchanger according to embodiments of the present invention. 7
[005S8]FIG. 15 is a schematic diagram of the multi-stage jet regulating component in closed state according to embodiments of the present invention.
[0059]FIG. 16 is a schematic diagram of the multi-stage jet regulating component in the first open state according to embodiments of the present invention. [O0060]JFIG. 17 1s a schematic diagram of the multi-stage jet regulating component in the second open state according to embodiments of the present invention.
[0061]FIG. 18 is a schematic diagram of the multi-stage jet regulating component in the third open state according to embodiments of the present invention.
[0062]FIG. 19 is a flow direction diagram of the cooling medium in the heat exchanger according to embodiments of the present invention.
[0063]FIG. 20 is a flow chart of the operating principle of the multi-stage control jet impingement heat exchanger according to embodiments of the present invention.
[0064]REFERENCE MARKS IN FIGURES
[0065]Heat exchanger 100.
[0066]Lower cover plate 10.
[0067]Coupling flow channel plate 20, multi-stage jet regulating components 210, valve plate 211, regulating spring 212, memory alloy part 213, primary memory spring 2131, secondary memory spring 2132, tertiary memory spring 2133, circular nested flow channel 220, sub-circular flow channel 221, inlet main flow channel 231, outlet main flow channel 232, lower impingement hole 240, fluid inlet joint 251, fluid outlet joint 252.
[0068]Heat insulation plate 30, jet hole 310.
[0069]Jet plate 40, upper impingement hole 410, upper flow channel 420.
[0070]Upper cover plate 50. [0071 ]Jet impingement flow path S1.
[0072]In order to better illustrate the technological process and effect of the present application,, preferred embodiments combined with the drawings are showed to provide a detailed description of the invention as follows.
[0073]The description of the method process in the specification of this invention and the steps in the flowcharts in the drawings of this invention are not limited to be strictly followed according to the step numbers. The order of method steps can be changed.
Moreover, some steps can be omitted, multiple steps can be combined into one, and/or one step can be divided into multiple steps. 8
[0074]With the rapid development of new generation communication, early warning, laser weapons, phased array radars, and other high-end electronic equipment towards high power, miniaturization, and high density, the power of electronic modules/components is increasing, and excessive temperature has an undeniable influence on the performance and even the lifespan of electronic devices. The well- known '10°C rule' also states that 'for every 10°C increase in temperature of semiconductor devices, their reliability decreases by 50%’, highlighting the increasingly prominent issue of heat dissipation in electronic devices.
[0075]This invention proposes a multi-stage control jet impingement heat exchanger 100 driven by shape memory alloy, aiming to solve the problems of poor heat exchange uniformity, imprecise flow control of jet impingement, and low heat exchange efficiency in traditional liquid-cooled heat exchangers.
[0076]As shown in FIG. 1 and 2, according to embodiments of the present invention, the multi-stage control jet impingement heat exchanger 100 driven by shape memory alloy includes: a lower cover plate 10, a coupling flow channel plate 20, an heat insulation plate 30, a jet plate 40, and an upper cover plate 50, which are sequentially stacked.
Wherein, the lower cover plate 10 can be on the side close to the heat dissipation component.
[0077]As shown in FIG. 6, the multi-stage control jet impingement heat exchanger 100 has a jet impingement flow path S1 and multi-stage jet regulating component 210, which controls the flow of cooling medium in the jet impingement flow path S1 based on the induction temperature of the memory alloy part 213 (as shown in FIG. 20). [0078Wherein, when the induction temperature of the memory alloy part 213 is lower than the first temperature threshold, the multi-stage jet regulating component 210 is in a closed state, and there is no cooling medium flowing in the jet impingement channel S1.
As shown in FIG. 15, the multi-stage jet regulating component 210 is in closed state.
[0079]When the induction temperature of the shape memory alloy part 213 is higher than or equal to the first temperature threshold and lower than the second temperature threshold, the multi-stage jet regulating component 210 is in the first open state, and the jetimpingement channel S1 contains a cooling medium with the first flow rate. As shown in FIG. 16, the multi-stage jet regulating component 210 is in the first open state.
[0080]When the induction temperature of the shape memory alloy part 213 is higher than or equal to the second temperature threshold and lower than the third temperature threshold, the multi-stage jet regulating components 210 are in the second open state, 9 and the jet impingement channel Sl contains a cooling medium with the second flow rate. As shown in FIG. 17, the multi-stage jet regulating components 210 are in the second open state. [008 1 [When the induction temperature of the shape memory alloy part 213 is higher than or equal to the third temperature threshold, the multi-stage jet regulating components 210 are in the third open state, and the cooling medium with the third flow rate is in the impingement channel. As shown in FIG. 18, the multi-stage jet regulating components 210 are in the third open state.
[0082]Wherein, the first flow rate, the second flow rate, and the third flow rate are in a sequence of proportional growth.. For example, when the first flow rate is 3 units of flow, the second and third flow rate can be 6 units of flow and 9 units of flow respectively.
This facilitates precise quantitative control of the cooling medium flow.
[0083]It should be noted that the use of forced convection heat transfer is currently the most reliable and commonly used cooling strategy for high heat flux electronic devices.
The liquid cooling heat exchanger is one of the most critical devices in this technology.
This technology involves the cooling medium flowing in the channel and exchanging heat with the internal walls of the heat exchanger, thereby removing the heat generated by the heat source. Obviously, the structure of the heat exchanger will significantly affect the cooling effect of the cooling system.
[0084]The design of traditional liquid-cooled heat exchanger improves heat exchange effects through optimization of channel dimensions and shapes. This kind of design often relies mainly on engineering experience, lacks theoretical basis, has a long design cycle, and is relatively random. [0085 Moreover, flow paths, tube diameters, valves, distributors, and other elements of the traditional heat exchangers are preset and usually only suitable for specific cooling scenarios and demands, lacking versatility. They can only regulate the fluid inlet flow and speed, and cannot adaptively adjust according to the actual heat source distribution.
This makes them less flexible in applications requiring precise control or significant flow adjustments, and lacking of precise temperature control capabilities in different areas of the heat exchanger. When the heat output of different modules changes, it is difficult to quickly direct cooling and control the temperature difference in various areas of the heat exchanger within the required range.
[0086]The invention proposed a shape memory alloy driven multi-stage control jet impingement heat exchanger 100, which can sense the surrounding temperature changes 10 through the shape memory alloy part 213, and achieve precise control of the cooling medium flow rate in the jet impingement channel S1. Compared with existing shape memory alloy driven flow control valves that can only control the opening and closing of the channel based on temperature changes without precise flow control, this invention achieves multi-stage control through the shape memory alloy part 213. The higher the temperature, the greater the flow of cooling medium in the jet impingement channel S1, thereby enhancing the cooling effect. Thus, it is possible to achieve precise control of jet flow corresponding to different temperatures, further controlling temperature and improving consistency, which helps to enhance the intelligence of the entire system's heat dissipation and avoids the problems of excessive or insufficient cooling.
[0087]Moreover, the multi-stage control jet impingement heat exchanger 100 creats strong convective heat transfer between the fluid and the heat exchange surface based on the high-speed flow characteristics of jet impingement, and thereby achieves an efficient heat exchange process. Compared to traditional heat exchangers, the multi-stage control jet impingement heat exchanger 100 can achieve higher heat transfer coefficients and enhance heat exchange efficiency.
[0088]Additionally, in this invention, the flow rate of the cooling medium in the jet impingement channel S1 increases proportionally corresponding to the rise of surrounding temperature. This facilitates precise quantitative control of the total flow rate of the cooling medium, further enhancing the control accuracy of the cooling medium flow rate.
[0089]It is emphasized that the impact of temperature on the performance of electronic components is not a linear relationship, but there is a temperature critical value usually.
This invention sets three temperature thresholds, and the flow rate of cooling medium adjusts exponentially corresponding to three thresholds which can make the heat exchanger 100 more in line with the actual cooling needs of electronic components, thereby further improving the performance and stability of electronic components.
[0090]According to some embodiments of the invention, as shown in FIG. 13, the coupling flow channel plate 20 is provided with a circular nested flow channel 220, which includes multiple matrix-arranged sub-circular flow channels 221, any two adjacent sub-circular flow channels 221 are interconnected.
[0091]It is emphasized that the requirements for the temperature consistency of components are becoming increasingly stringent currently.. For example, the temperature uniformity of active components of phased array antennas is an important 11 indicator, generally requiring a temperature difference AT < 5°C. Research shows that the thermal flux density of the chips inside active components can reach up to 200W/cm?.
Long-term overheating or uneven thermal stress can lead to failures or malfunctions.
Analysis reports indicate that 55% of active component failures are caused by temperature, and excessive temperature differences will lead to significant thermal stress, which in turn causes mechanical damage affecting the functionality of the equipment.
[0092]The annular nested flow channel 220 used in this invention can significantly reduce the highest temperature and improve temperature uniformity. It can reduce the highest temperature and achieve uniformity through the annular nested flow channel 220 before the temperature of the heating element/module reaches the phase transition temperature of the shape memory alloy part 213. Through experimental testing, compared to traditional flow channels, it can achieve a lower average temperature and the smallest temperature difference.
[0093]In some embodiments of the present invention, as shown in FIG. 6, the jet impingement channel S1 includes: multiple upper impingement holes 410, multiple jet through holes 310, and multiple lower impingement holes 240.
[0094]Wherein, multiple upper impingement holes 410 penetrate the jet plate 40 along the thickness direction, multiple jet through holes 310 penetrate the heat insulation plate 30 along the thickness direction, multiple jet through holes 310 are arranged in one-to- one correspondence to the upper impingement holes 410, multiple lower impingement holes 240 penetrate the coupling flow channel plate 20 along the thickness direction to the circular nested flow channel 220, multiple lower impingement holes 240 are arranged in one-to-one correspondence to jet through holes 310.
[0095]Thus, the cooling medium in the jet plate 40 can pass through the upper impingement hole 410 and the corresponding jet hole 310 through the heat insulation plate 30 into the lower impingement hole 240 of the coupling flow channel plate 20, and be jetted through the lower impingement hole 240 to the annular nested flow channel 220, so that the medium inside the annular nested flow channel 220 is cooled to dissipate the heat by impingement.
[0096]According to some embodiments of the invention, the coupling flow channel plate 20 is equipped with multiple mounting slots for installing multi-stage jet regulating components 210, and the multiple mounting slots are arranged in one-to-one correspondence to multiple lower impingement holes 240. Thus, the flow of the cooling medium passing through the lower impingement holes 240 can be precisely controlled 12 by the multi-stage jet regulating components 210.
[0097]In some embodiments of the invention, the multi-stage jet regulating components 210 are immersed in liquid medium. The mounting slots can be set as an independent cavity, and the liquid medium can use a high thermal conductivity liquid medium, which can regulate the temperature correspondingly to external temperature changes, thereby causing the shape memory alloy part 213 of the immersed multi-stage jet regulating components 210 to deform accordingly. Thus, when the surrounding environment heats up, the cooling medium in the mounting slot also heats up, the multi-stage jet regulating components 210 move, increasing the number of opening holes, and the cooling medium flows into the annular nested flow channel 220.
[0098]In other embodiments of the invention, multiple mounting slots can also be connected to the annular nested channel 220. As a result, the cooling medium can flow into the mounting slots, contact the multi-stage jet regulating components 210 set in the mounting slots, and the multi-stage jet regulating components 210 adjust their state according to the temperature of the cooling medium in the mounting slots.
[0099]It is emphasized that the multiple multi-stage jet regulating components 210 in this invention are set independently. As a result, the multi-stage jet regulating component 210 in each installation slot can independently control the cooling medium at the corresponding location based on their respective induction temperatures. For example, the multi-stage jet regulating components 210 at the first temperature threshold can automatically switch to the first open state. Meanwhile, the multi-stage jet regulating components 210 that have not reached the first temperature threshold remains in the closed state. Thus, precise cooling and heat dissipation control can be achieved.
[0100]According to some embodiments of the present invention, as shown in FIG. 14 the multi-stage jet regulating components 210 include: a valve plate 211, a regulating spring 212, and a memory alloy part 213. [0101 Wherein, the valve plate 211 1s equipped with multiple adjustment holes arranged in a matrix. The regulating spring 212 rests against one end of the valve plate 211. The memory alloy part 213 includes a primary memory spring 2131, a secondary memory spring 2132, and a tertiary memory spring 2133, which rest against the other end of the valve plate 211.
[0102]In some embodiments of the present invention, as shown in FIG. 14, the regulating holes are arranged in three rows and three columns, totaling nine. When the induction temperature of the shape memory alloy part 213 is below the first temperature threshold, 13 all nine regulating holes are located outside the jet impingement flow channel S1. [0103 ]When the induction temperature of the primary memory spring 2131 is higher than or equal to the first temperature threshold and lower than the second temperature threshold, the primary memory spring 2131 extends and drives one column of regulating holes to extend into the jet impingement flow channel S1.
[0104]When the induction temperature of the secondary memory spring 2132 is higher than or equal to the second temperature threshold and lower than the third temperature threshold, the secondary memory spring 2132 extends and drives the two columns of regulating holes to extend into the jet impingement flow channel S1.
[0105]When the sensing temperature of the level three memory spring 2133 exceeds the third temperature threshold, the tertiary memory spring 2133 extends and drives the three columns of regulating holes to extend into the jet impingement flow channel S1.
[0106]According to some embodiments of the invention, the multistage regulated jet impingement heat exchanger 100 also includes: a control component (not shown in the figure), which is electrically connected to the shape memory alloy part 213. That is to say, the invention can also set a control component to control the deformation state of the shape memory alloy part 213, and control the deformation of the shape memory alloy part 213 through electric heating. Thus, the control of the cooling medium flow can be more flexible and autonomous. The control component can either control all the multi- stage jet regulating components 210 uniformly, or each of the multistage jet regulating components 210 can have its own control component, achieving more precise and flexible control.
[0107]In some embodiments of the present invention, the heat insulation plate 30 is aerogel, insulation film, or insulation cotton. In practical use, the heat insulation plate 30 can be selected according to actual needs.
[0108]In some embodiments of the present invention, the heat insulation plate 30 is bonded to the coupling channel plate 20, and there are welded connections between the lower cover plate 10 and the coupling channel plate 20, between the coupling channel plate 20 and the jet plate 40, and between the jet plate 40 and the upper cover plate 50.
[0109]In summary, this invention solves the problems as follows:
[0110](1) Multi-level adaptive temperature regulation: this invention utilizes multi-stage jet regulating components 210 and coupled annular nested flow channels 220 with turbulence technology, which can achieve adaptive flow adjustment of the cooling medium. Shape memory alloy parts 213 have characteristics such as shape memory effect 14 and superelasticity, which can respond quickly and change shape when stimulated externally. The multi-stage jet regulating components 210 based on shape memory alloy can quickly and precisely adjust the opening size of the jet impingement flow channel
S1 according to actual needs, thereby improving the fluid flow efficiency and heat 5S dissipation performance to achieve precise temperature control.
[0111](2) High reliability and temperature stability: memory alloy part 213 has good stability and durability, capable of maintaining stable performance over long-term use.
The use of multi-stage jet regulating components 210 and coupled ring nested flow channels 220 can enhance reliability and stability of the system and reduce faults and maintenance costs, and extend service life of the equipments .
[0112]Compared with the existing technology, this invention has effects as follows:
[0113]1) This invention solves multiple issues such as the single flow channel structure of traditional heat exchangers, fixed channel flow, complex restrictions of topology optimized flow channel structures, and lack of precise control over jet flow. A new type of flow channel structure has been designed, and precise control over the jet flow has been implemented, further enhancing the versatility and intelligence of the heat exchanger 100, improving its heat exchange capabilities, and significantly enhancing its temperature uniformity.
[0114]2) This invention adopts a multi-stage jet regulating component 210 coupled with a circular nested channel 220 structure using three-stage shape memory alloy springs, transforming the heat exchanger from a conventional passive one to an active, adaptive, and precise flow control smart heat exchanger. By adjusting the phase transition temperature and heat treatment process of the shape memory alloy parts 213, it achieves precise adaptive control with temperature changes. This adaptive control capability allows the heat exchanger 100 to automatically adjust the jet speed and impingement intensity according to actual working conditions and demands, achieving optimal heat exchange effects. At the same time, it significantly reduces pressure drop, thereby reducing pump power consumption and further enhancing its cooling performance, improving heat exchange efficiency.
[0115]3) This invention connects the upper and lower channels through the jet impingement channel S1 and utilizes the characteristics of shape memory alloys to design a three-stage flow control device, effectively optimizing the flow characteristics of the jet. Thereby, the cooling medium with lower temperature in the upper layer is directed quantitatively to the heating parts according to the temperature levels, and rapidly 15 reduces the temperature of the heating parts to achieve a more uniform temperature distribution and realize temperature equilibrium during the heat exchange process. This uniformity in temperature ensures that the temperatures of various parts of the heat exchanger 100 are essentially consistent during operation, effectively improving the heat exchange efficiency and uniformity of the heat exchanger 100.
[0116]The invention is described in detail below with reference to the drawings in a specific embodiment. It should be understood that the following description is merely illustrative and should not be construed as a specific limitation on the present invention,
[0117]As shown in FIGs. 1-2, the shape memory alloy-driven multi-stage control jet impingement heat exchanger 100 includes: a lower cover plate 10, a coupling flow channel plate 20, a heat insulation plate 30, a jet plate 40, and an upper cover plate 50 sequentially stacked. The heat insulation plate 30 is bonded to the coupling flow channel plate 20, and there are welded connections between the lower cover plate 10 and the coupling channel plate 20, between the coupling channel plate 20 and the jet plate 40, and between the jet plate 40 and the upper cover plate 50.
[0118]As shown in FIGs 3-13, to achieve multi-stage adjustment of jet impingement heat transfer capabilities, this invention utilizes annular nested channels 220 for preliminary heat exchange and temperature equalization, and then utilizes multi-stage jet regulating components 210 to achieve precise control of jet impingement flow rate of cooling medium flowing through the jet impingement channel S1 ‚to achieve better heat exchange capabilities and temperature uniformity. The cooling medium can be water or liquid metal.
[0119]Wherein, as shown in FIG. 3, the jet plate 40 includes an upper flow channel 420 formed on its upper surface and multiple upper impingement holes 410.
[0120]As shown in FIG 4, the heat insulation plate 30, made of aerogel, insulation film, or insulation cotton, is installed on the upper surface of the coupling flow channel plate 20 and isolates the temperature between the jet plate 40 and the coupling flow channel plate 20. As shown in FIG 6, the heat insulation plate 30 has upper impingement holes 410, lower impingement holes 240 and conreponding jet through holes 310, which together constitute the complete jet impingement flow channel S1.
[0121]As shown in FIGs. 5 to 10, the coupling flow channel plate 20 includes a flow channel plate, multi-stage jet regulating components 210, a fluid inlet joint 251, and a fluid outlet joint 252. Utilizing shape memory effects and superelasticity, the multi-stage jet regulating components 210 are used to automatically control the opening and closing 16 of the jet impingement flow channel S1. The flow channel plate is equipped with an inlet main channel 231, an outlet main channel 232, and circular nested flow channels 220 (located inside the flow channel plate), installation slots, lower impingement holes 240.
The coupling flow channel plate 20 is welded to the lower cover plate 10. The cross- 5S sectional area of the inlet main channel 231 is 8 to 10 times that of the circular nested flow channels 220, ensuring cooling medium has consistent flow velocity at each entrance of the circular nested flow channels 220, and the inlet main channel 231 and outlet main channel 232 are respectively fitted with fluid inlet joint 251 and fluid outlet joint 252.
[0122]As shown in FIG. 14, the multi-stage jet regulating component 210 include: a push rod, a rectangular nine-hole valve plate 211, a regulating spring 212 and a shape memory alloy part 213 which includes primary memory spring 2131, secondary memory spring 2132 and tertiary memory spring 2133. The multi-stage jet regulating component 210 is installed in installation slot and completely immersed in cooling medium. Through cooling medium heat transfer, when the temperature rises, elastic deformation with phase change of the primary memory spring 2131, secondary memory spring 2132, and tertiary memory spring 2133 occurs in turn, pushing the rectangular nine-hole valve plate to open with different sizes, thereby making the cooling medium in the jet plate 40 upper channel 420 enter the annular nested channel 220 which need to be cooled through the jet impingement channel S1, and thus lowering the module temperature. The flow direction of cooling medium is shown in FIG. 19, and the control of flow rate of cooling medium in the jet impingement channel S1 controled by the multi-stage jet regulating component 210 is shown in FIG.20.
[0123]Primary memory spring 2131, secondary memory spring 2132, and tertiary memory spring 2133 arranged in installation slots need to undergo different shape memory phase transition temperature tests and heat treatment process, and are, equipped with two-way shape memory function.
[0124]There are several heating modules of different heat outputs attached to the surface of the lower cover plate 10 via thermal interface material, which is thermal conductive silicone grease or thermal conductive pad.
[0125]As shown in FIG. 20, the cooling and heat dissipation method of the shape memory alloy driven multi-stage control jet impingement heat exchanger 100 in this invention is shown as follows: 17
[0126]1) Primary memory spring 2131, secondary memory spring 2132, tertiary memory spring 2133 are set as control springs for the jet impingement flow channel S1 with different temperature thresholds T1, T2, T3 (wherein T1<T2<T3), and installed on the push rod and connected with the regulating spring 212 installed in installation slot.
Primary memory spring 2131, secondary memory spring 2132, tertiary memory spring 2133 need to undergo phase transition temperature tests and heat treatment process.
[0127]2) The lower cover plate 10 is attached to the heating module, and the heating module can be powered on. The heat from different heating modules is transferred to the installation slots of annular nested flow channel 220 through the thermal conductive pad, and then transferred to the multi-stage jet regulating components 210 through the cooling medium. When the temperature reaches the phase transition temperature of the primary memory spring 2131, secondary memory spring 2132, and tertiary memory spring 2133, causing their elastic deformation to push the jet impingement flow channel S1 to open at different sizes, allowing the cooling medium to flow from the jet impingement flow channel S1 to the lower annular nested flow channel 220 and mix with the original cooling medium in the annular nested flow channel 220, and then flow futher into the main channel, and finally flow out of the heat exchanger 100 through the fluid outlet joint 252.
[0128]Specifically, combining FIGs 15-20 as shown:
[0129]Injecting cooling medium into heat exchanger 100 through fluid inlet joint 251, when the temperature of the cooling medium passing through installation slot which heat is transferred from the module does not reach the first temperature threshold TI, as shown in FIG 15, the rectangular nine-hole valve plate 211 does not move laterally, and the jet impingement channel S1 is completely closed, therefor cooling medium evenly flows out of the circular nested channel 220 in the coupling flow plate 20.
[0130]When the temperature T of the cooling medium passing through installation slot which heat is transferred from the module reaches T1<T<T2, as shown in FIG 16, the primary memory spring 2131 extends and pushes the rectangular nine-hole valve plate 211 to move laterally to open the jet impingement channel S1 by 1/3, the cooling medium in the jet plate 40 flows into the circular nested flow channel 220 of the lower coupling flow channel plate 20 through the jet impingement flow channel S1, increasing the flow rate and improving the heat exchange efficiency. [0131TWhen the temperature T of the cooling medium passing through installation slot which heat is transferred from the module reaches T2<<T<T3, the secondary memory 18 spring 2132 extends and pushes the rectangular nine-hole valve plate 211 to further move laterally to open the jet impingement flow channel S1 by 2/3, he cooling medium in the jet plate 40 flows into the circular nested flow channel 220 of the lower coupling flow channel plate 20 through the jet impingement flow channel S1, further increasing the flow rate and enhancing the heat exchange efficiency.
[0132]When the temperature T of the cooling medium passing through installation slot which heat is transferred from the module reaches T=T3, the tertiary memory spring 2133 undergoes thermal elastic deformation to extend, and pushes the rectangular nine- hole valve plate 211 to further move laterally, the jet impingement channel S1 is fully opened, the jet impingement flow rate reaches its maximum, and the heat exchange efficiency is maximized.
[0133]In summary, the invention proposes a multi-stage control jet impingement heat exchanger 100 with a circular nested flow channel 220 coupled with shape memory alloy.
Directional temperature control and overall flow rate adjustment for the heat from different heating modules can be achieved through a three-stage memory alloy spring control valve, thus achieving overall temperature reduction and temperature uniformity.
[0134]Wherein, the circular nested flow channel 220 is designed to significantly reduce the highest temperature and improve temperature uniformity, thus reducing the highest temperature and improving temperature uniformity through the heat exchanger 100 before the temperature of the heating element/module reaches the phase transition temperature of the shape memory alloy.
[0135]The jet impingement coupled annular nested flow channel 220 is design to penetrate in upward and downward directions to improve the heat transfer efficiency: the jet impingement heat exchanger 100 utilizes the high-speed flow characteristics of jet impingement to cause intense convective heat transfer between the fluid and the heat transfer surface, thereby achieving an efficient heat transfer process. Compared to traditional heat exchangers, it can achieve higher heat transfer coefficients and improve heat transfer efficiency.
[0136]Compared to traditional jet impingement heat exchangers, this invention can adaptively adjust the opening and closing of the jet impingement according to the temperature distribution of the components, controlled by shape memory alloy triple springs, enabling precise control of jet flow rate corresponding to different temperatures, thereby further controlling temperature and improving consistency. This helps enhancing 19 the intelligence of the entire system heat dissipation, avoiding issues of excessive or insufficient cooling.
[0137]Through the description of specific embodiments, one should be able to gain a deeper and more concrete understanding of the technical means and effects adopted by this invention to achieve the predetermined objectives. However, the accompanying drawings are provided for reference and explanation only, and are not intended to limit the scope of this invention.
Claims (9)
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| CN118647189A (en) | 2024-09-13 |
| CN118647189B (en) | 2024-12-17 |
| NL2038830B1 (en) | 2025-10-13 |
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