NL2024239A - Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate - Google Patents

Abstract

A substrate support is configured to support a substrate. The substrate support comprises a plurality of burls protruding from a base surface of the substrate support. The burls have distal ends in a plane for supporting a lower surface of the substrate with a gap between the base surface of the substrate support and the lower surface of the substrate. The substrate support comprises a liquid supply channel for supplying a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, thereby allowing charge to pass between the substrate support and the substrate. The substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate can be manipulated.

Description

FIELD [0001] The present invention relates to a substrate support, a lithographic apparatus, a method for manipulating charge distribution and a method for preparing a substrate.

BACKGROUND [0002] A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs).

[0003] The substrate is positioned on a substrate table for the desired pattern to be applied to the substrate. The substrate table can degrade over time, particularly in immersion lithography. [0004] It is desirable to reduce degradation of the substrate table,

SUMMARY [0005] According to an aspect of the invention, there is provided a substrate support configured to support a substrate, the substrate support comprising: a plurality of burls protruding from a base surface of the substrate support, the burls having distal ends in a plane for supporting a lower surface of the substrate with a gap between the base surface of the substrate support and the lower surface of the substrate; and a liquid supply channel for supplying a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, thereby allowing charge to pass between the substrate support and the substrate; wherein the substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate can be manipulated.

[0006] According to an aspect of the invention, there is provided a method for manipulating charge distribution of a lower surface of a substrate, the method comprising: supporting a lower surface of the substrate on a plurality of burls protruding from a base surface of a substrate support, the burls having distal ends in a plane, with a gap between the base surface of the substrate support and the lower surface of the substrate; and supplying a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, thereby allowing charge to pass between the substrate support and the substrate; wherein the substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate is manipulated.

[0007] According to an aspect of the invention, there is provided a method for preparing a substrate for being exposed by a patterned radiation beam, the method comprising: entering the substrate into a lithographic apparatus; supporting the substrate on a substrate support; drying a lower surface of the substrate; and moving the dried substrate to a substrate table where an upper surface of the substrate opposite to the lower surface is to undergo exposure by the patterned radiation beam.

BRIEF DESCRIPTION OF THE DRAWINGS [0008] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

[0009] Figure 1 depicts a lithographic apparatus according to an embodiment of the invention;

[0010] Figure 2 depicts part of a lithographic apparatus according to an embodiment of the invention;

[0011] Figure 3 depicts part of a lithographic apparatus according to an embodiment of the invention;

[0012] Figure 4 depicts a substrate on a substrate support according to an embodiment of the invention.

[0013] Figures 5 and 6 depict an arrangement of the substrate on the substrate support; [0014] Figures 7 and 8 depict another arrangement of the substrate on the substrate support;

[0015] Figures 9 and 10 depict conductive liquid being removed from the arrangement shown in Figures 5 and 6;

[0016] Figures 11 and 12 depict conductive liquid being removed from the arrangement shown in Figures 7 and 8;

[0017] Figure 13 depicts a substrate on a substrate support according to an embodiment of the invention; and [0018] Figures 14 and 15 depict drying of the lower surface of the substrate on a substrate support according to an embodiment of the invention.

DETAILED DESCRIPTION [0019] Figure 1 schematically depicts a lithographic apparatus 100 according to an embodiment of the invention. The lithographic apparatus 100 includes an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or any other suitable radiation), a mask support structure (e.g. a mask table) MT constructed to support a patterning device (e.g. a mask) MA and connected to a first positioning device PM configured to accurately position the patterning device MA in accordance with certain parameters. The lithographic apparatus 100 also includes a substrate table (e.g. a wafer table) WT constructed to hold a substrate (e.g. a resist coated wafer) W and connected to a second positioning device PW configured to accurately position the substrate W in accordance with certain parameters. The lithographic apparatus 100 further includes a projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. including one or more dies) of the substrate W.

[0020] The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.

[0021] The mask support structure MT supports, i.e. bears the weight of, the patterning device MA. The mask support structure MT holds the patterning device MA in a manner that depends on the orientation of the patterning device MA, the design of the lithographic apparatus 100, and other conditions, such as for example whether or not the patterning device MA is held in a vacuum environment. The mask support structure MT can use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The mask support structure MT may be a frame or a table, for example, which may be fixed or movable as required. The mask support structure MT may ensure that the patterning device MA is at a desired position, for example with respect to the projection system PS. Any use of the terms “reticle” or “mask” herein may be considered synonymous with the more general term “patterning device.” [0022] The term “patterning device” used herein should be broadly interpreted as referring to any device that can be used to impart the radiation beam B with a pattern in its cross-section so as to create a pattern in a target portion C of the substrate W. It should be noted that the pattern imparted to the radiation beam B may not exactly correspond to the desired pattern in the target portion C of the substrate W, for example if the pattern includes phase-shifting features or so called assist features. Assist features may be placed on the patterning device MA to enable isolated and/or semi-isolated design features to be patterned as though they were more dense than they actually are. Generally, the pattern imparted to the radiation beam B will correspond to a particular functional layer in a device being created in the target portion C, such as an integrated circuit.

[0023] The patterning device MA may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in lithography, and include mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted so as to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in a radiation beam which is reflected by the minor matrix.

[0024] The term “projection system” used herein should be broadly interpreted as encompassing any type of projection system PS, including refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system”.

[0025] The illumination system IL may include an adjuster AD configured to adjust the angular intensity distribution of the radiation beam B. Generally, at least the outer and/or inner radial extent (commonly referred to as σ-outer and σ -inner, respectively) of the intensity distribution in a pupil plane of the illumination system IL can be adjusted. In addition, the illumination system IL may include various other components, such as an integrator IN and a condenser CN. The illumination system IL may be used to condition the radiation beam B, to have a desired uniformity and intensity distribution in its cross section. The illumination system IL may or may not be considered to form part of the lithographic apparatus 100. For example, the illumination system IL may be an integral part of the lithographic apparatus 100 or may be a separate entity from the lithographic apparatus 100. In the latter case, the lithographic apparatus 100 may be configured to allow the illumination system IL to be mounted thereon. Optionally, the illumination system IL is detachable and may be separately provided (for example, by the lithographic apparatus manufacturer or another supplier).

[0026] As here depicted, the lithographic apparatus 100 is of a transmissive type (e.g. employing a transmissive mask). Alternatively, the lithographic apparatus 100 may be of a reflective type (e.g. employing a programmable mirror array of a type as referred to above, or employing a reflective mask).

[0027] The lithographic apparatus 100 may be of a type having two (dual stage) or more substrate tables WT (and/or two or more mask support structures MT, e.g. mask tables). In such a ‘‘multiple stage” lithographic apparatus 100 the additional substrate tables WT and/or mask support structures MT may be used in parallel, or preparatory steps may be carried out on one or more substrate tables WT and/or mask support structures MT while one or more other substrate tables WT and/or mask support structures MT are being used for exposure.

[0028] The patterning device MA is held on the mask support structure MT. The radiation beam B is incident on the patterning device MA. The radiation beam B is patterned by the patterning device MA. After being reflected from the patterning device MA, the radiation beam B passes through the projection system PS. The projection system PS focuses the radiation beam B onto a target portion C of the substrate W. The first positioner PM and a first position sensor (e.g., an interferometric device, linear encoder or capacitive sensor) can be used to accurately position the patterning device MA with respect to the path of the radiation beam B. The first position sensor is not explicitly shown in Figure 1. With the aid of the second positioner PW and a second position sensor PS2 (e.g., an interferometric device, linear encoder or capacitive sensor), the substrate table WT can be moved accurately, e.g., so as to position different target portions C in the path of the radiation beam B.

[0029] In general, movement of the mask support structure MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioning device PM. Similarly, movement of the substrate table WT may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner) the mask support structure MT may be connected to a short-stroke actuator only, or may be fixed. The patterning device MA may be aligned using mask alignment marks Mt, Mi. The substrate W may be aligned using substrate alignment marks Pi, Pj. Although the substrate alignment marks Pi, P2 as illustrated occupy dedicated target portions C, they may be located between target portions C (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one die is provided on the patterning device MA, the mask alignment marks Mi, M2 may be located between the dies.

[0030] Immersion techniques can be used to increase the numerical aperture NA of the projection system PS. As depicted in Figure 1, in an embodiment the lithographic apparatus 100 is of a type wherein at least a portion of the substrate W may be covered by a liquid having a relatively high refractive index, e.g. water, so as to fill a space between the projection system PS and the substrate W. An immersion liquid may also be applied to other spaces in the lithographic apparatus 100, for example, between the patterning device MA and the projection system PS. The term “immersion” as used herein does not mean that a structure, such as the substrate W, must be submerged in liquid, but rather only means that a liquid is located between the projection system PS and the substrate W during exposure.

[0031] Referring to Figure 1, the illuminator IL receives a radiation beam from a source module SO. The source module SO and the lithographic apparatus 100 may be separate entities, for example when the source module SO is an excimer laser. In such cases, the source module SO is not considered to form part of the lithographic apparatus 100 and radiation is passed from the source module SO to the illumination system IL with the aid of a beam delivery system BD. In an embodiment the beam delivery system BD includes, for example, suitable directing mirrors and/or a beam expander. In other cases the source module SO may be an integral part of the lithographic apparatus 100, for example when the source module SO is a mercury lamp. The source module SO and the illumination system IL, together with the beam delivery system BD if required, may be referred to as a radiation system.

[0032] Arrangements for providing liquid between a final element of the projection system PS and the substrate W can be classed into three general categories. These are the bath type arrangement, the so-called localized immersion system and the all-wet immersion system. In a bath type arrangement substantially the whole of the substrate W and optionally part of the substrate table WT is submersed in a bath of liquid.

[0033] As depicted in Figure 1 the liquid supply system is provided with a liquid confinement structure IH which extends along at least a part of a boundary of the space between the final element of the projection system PS and the substrate W, substrate table WT or both. Such an arrangement is illustrated in Figure 2. The arrangement illustrated in Figure 2 and described below may be applied to the lithographic apparatus described above and illustrated in Figure 1.

[0034] Figure 2 schematically depicts a localized liquid supply system or fluid handling system with a liquid confinement structure IH, which extends along at least a part of a boundary of the space 11 between the final element of the projection system PS and the substrate table WT or substrate W. (Please note that reference in the following text to the surface of the substrate W also refers in addition or in the alternative to a surface of the substrate table WT, unless expressly stated otherwise.) In an embodiment, a seal is formed between the liquid confinement structure IH and the surface of the substrate W. The seal may be a contactless seal such as a gas seal 16 (such a system with a gas seal is disclosed in European patent application publication no. EP-A-1,420,298) or a liquid seal.

[0035] The liquid confinement structure IH at least partly contains liquid in the space 11 between the final element of the projection system PS and the substrate W. The space 11 is at least partly formed by the liquid confinement structure IH positioned below and surrounding the final element of the projection system PS. Liquid is brought into the space 11 below the projection system PS and within the liquid confinement structure IH by a liquid inlet/outlet 13. The liquid may be removed by a liquid inlet/outlet 13. In an embodiment one of two liquid inlet/outlets 13 supplies the liquid while the other liquid inlet/outlet 13 removes the liquid depending on the scanning direction. [0036] The liquid may be contained in the space 11 by the gas seal 16. During use, the gas seal 16 is formed between the bottom of the liquid confinement structure IH and the surface of the substrate W. The gas in the gas seal 16 is provided under pressure via an inlet 15 to the gap between the liquid confinement structure 1Ή and substrate W. The gas is extracted via an outlet 14. The overpressure on the gas inlet 15, vacuum level on the outlet 14 and geometry of the gap are arranged so that there is a high-velocity gas flow inwardly that confines the liquid. The force of the gas on the liquid between the liquid confinement structure IH and the substrate W contains the liquid in the space 11. Such a system is disclosed in United States patent application publication no. US 20040207824, which is hereby incorporated by reference in its entirety. In an embodiment, the liquid confinement structure IH does not have a gas seal.

[0037] In a localized area liquid supply system, the substrate W is moved under the projection system PS and the liquid supply system. When an edge of the substrate W is to be imaged, an edge of the substrate W (or other object) will pass under the space 11. When a sensor on the substrate table WT (or on a measurement table) is to be imaged, an edge of the substrate W (or other object) will pass under the space 11. A dummy substrate or so-called closing plate can be positioned under the liquid supply system to enable, for example, substrate swap to take place. When the substrate table WT is to be moved such that a dummy substrate or so-called closing plate can be positioned under the liquid supply system, an edge of the substrate W (or other object) will pass under the space 11. Liquid may leak into the gap between the substrate W and substrate table WT. This liquid may be forced in under hydrostatic or hydrodynamic pressure or the force of a gas knife or other gas flow creating device.

[0038] Figure 3 is a side cross sectional view that depicts a further liquid supply system or fluid handling system according to an embodiment. The arrangement illustrated in Figure 3 and described below may be applied to the lithographic apparatus 100 described above and illustrated in Figure 1. The liquid supply system is provided with a liquid confinement structure IH, which extends along at least a part of a boundary of the space 11 between the final element of the projection system PS and the substrate table WT or substrate W. (Please note that reference in the following text to surface of the substrate W also refers in addition or in the alternative to a surface of the substrate table WT, unless expressly stated otherwise.) [0039] The liquid confinement structure IH at least partly contains liquid in the space 11 between the final element of the projection system PS and the substrate W. The space 11 is at least partly formed by the liquid confinement structure IH positioned below and surrounding the final element of the projection system PS. In an embodiment, the liquid confinement structure IH comprises a main body member 53 and a porous member 83. The porous member 83 is plate shaped and has a plurality of holes (i.e., openings or pores). In an embodiment, the porous member 83 is a mesh plate wherein numerous small holes 84 are formed in a mesh. Such a system is disclosed in United States patent application publication no. US 2010/0045949 Al, which is hereby incorporated by reference in its entirety.

[0040] The main body member 53 comprises supply ports 72, which are capable of supplying the liquid to the space 11, and a recovery port 73, which is capable of recovering the liquid from the space 11. The supply ports 72 are connected to a liquid supply apparatus 75 via passageways 74. The liquid supply apparatus 75 is capable of supplying the liquid to the supply ports 72. The liquid that is fed from the liquid supply apparatus 75 is supplied to each of the supply ports 72 through the corresponding passageway 74. The supply ports 72 are disposed in the vicinity of the optical path at prescribed positions of the main body member 53 that face the optical path. The recovery port 73 is capable of recovering the liquid from the space 11. The recovery port 73 is connected to a liquid recovery apparatus 80 via a passageway 79. The liquid recovery apparatus 80 comprises a vacuum system and is capable of recovering the liquid by suctioning it via the recovery port 73. The liquid recovery apparatus 80 recovers the liquid LQ recovered via the recovery port 23 through the passageway 29. The porous member 83 is disposed in the recovery port 73.

[0041] In an embodiment, to form the space 11 with the liquid between the projection system PS and the liquid confinement structure IH on one side and the substrate W on the other side, liquid is supplied from the supply ports 72 to the space 11 and the pressure in a recovery chamber 81 in the liquid confinement structure IH is adjusted to a negative pressure so as to recover the liquid via the holes 84 (i.e., the recovery port 73) of the porous member 83. Performing the liquid supply operation using the supply ports 72 and the liquid recovery operation using the porous member 83 forms the space 11 between the projection system PS and the liquid confinement structure IH on one side and the substrate W on the other side.

[0042] In use of the lithographic apparatus 100, a substrate W undergoes different lithography steps and process steps. A substrate W may be cleaned, for example by a wet chemical treatment. The substrate W may be heated to a temperature sufficient to drive off any moisture that may be present on the surface of the substrate W. The substrate W may be covered with a layer of resist (e.g. photoresist). The substrate W may be prebaked to drive off excess photoresist solvent. The substrate W is then exposed so that a pattern in the radiation beam B is transferred onto the substrate W. The substrate W may then undergo developing, etching and removal of the resist. These steps may be repeated for a further layer on the substrate W.

[0043] As depicted in Figure 1, in an embodiment the lithographic apparatus 100 comprises a substrate table WT. The substrate table WT is configured to support a substrate W for an exposure process. In an exposure process, the substrate W is exposed to a radiation beam B to form a pattern on the substrate W via a liquid (i.e. immersion liquid).

[0044] In an embodiment the lithographic apparatus 100 comprises a store unit. The store unit may be part of a substrate handler that controls movement of the substrate through the lithographic apparatus 100. When a substrate W is entered into a lithographic apparatus 100, the substrate W is positioned first on the store unit. Subsequently, the substrate W is moved from the store unit, after which the substrate W is positioned on the substrate table WT for an exposure process. Hence, the substrate W is positioned on the store unit before it is moved onto the substrate table WT.

[0045] In an embodiment the store unit comprises a substrate support 20. Figure 4 depicts a substrate W on the substrate support 20. The substrate support 20 is configured to support the substrate W.

[0046] As shown in Figure 4, the substrate support 20 comprises a main body 21. The main body 21 has a plate-like shape and may be approximately the same shape as the substrate W. For example, when the substrate W is circular, the main body 21 may correspondingly be circular. However, the shape of the main body 21 is not particularly limited. The main body 21 has an upper surface which forms a base surface 23 of the substrate support 20. In an embodiment, the base surface 23 of the substrate support 20 is electrically conductive. In an embodiment the substrate support 20 comprises a coating for the base surface 23. The coating has a reasonably low electrical resistance. In an embodiment the coating is electrically dissipative. For example, in an embodiment the coating has a resistance of at most 100ΜΩ. In an embodiment the coating has an electrical resistance of at least 1 OkQ. In an embodiment the coating comprises a diamond-like carbon, a silicon carbide (e.g. silicon infiltrated silicon carbide) and/or chromium nitride.

[0047] As shown in Figure 4, in an embodiment, the substrate support 20 comprises a plurality of burls 22. The burls 22 protrude from the base surface 23 of the substrate support 20. The burls 22 have distal ends 24. The distal ends 24 are at the opposite end of the burls 22 from where the burls 22 connect to the base surface 23 of the substrate support 20. The distal ends 24 of the burls 22 are in a plane for supporting the lower surface 25 of the substrate W.

[0048] The lower surface 25 of the substrate W remains Hat, regardless of whether the base surface 23 of the substrate support 20 is flat. If the base surface 23 of the substrate support 20 is flat, then all of the burls 22 may have the same height. In an alternative embodiment, the base surface 23 is not flat. For example, the base surface 23 may have a conical shape or a bowl-shape. When the base surface 23 is not flat, then the burls 22 may have different heights depending on their position on the base surface 23.

[0049] As shown in Figure 4, in an embodiment a gap 26 is formed between the base surface 23 of the substrate support 20 and the lower surface 25 of the substrate W. The burls 22 extend across the gap 26 between the base surface 23 of the substrate support 20 and the lower surface 25 of the substrate W. The gap 26 is present between the burls 22.

[0050] In an embodiment the substrate W is configured to be clamped onto the burls 22 by an underpressure, e.g. a vacuum, A gap 26 may have a lower pressure compared to the pressure above the substrate W. The difference in pressure above and below the substrate W tends to clamp the substrate W onto the substrate support 20. The size of the gap 26 is not particularly limited. Merely as an example, the gap 26 may be in the range of from about 5 pm to about 200 pm. The size of the gap 26 may correspond to the height of the burls 22.

[0051] As shown in Figure 4, in an embodiment the substrate support 20 comprises a liquid supply channel 28. The liquid supply channel 28 is for supplying a conductive liquid 27 to the gap 26. The conductive liquid 27 bridges the gap 26 between the base surface 23 of the substrate support 20 and the lower surface 25 of the substrate W. This allows electrical charge to pass between the substrate support 20 and the substrate W. Electrical charge can pass between different parts of the lower surface 25 of the substrate W, via the conductive liquid 27. The charge distribution at the lower surface 25 of the substrate W can change as a result of the presence of the conductive liquid 27. The charge distribution can tend to even out across the lower surface 25 of the substrate W. In an embodiment the liquid supply channel 28 is configured to supply a gas that condenses a conductive medium to the lower surface 25 of the substrate W.

[0052] In an embodiment the substrate support 20 has a controlled electrical potential such that the charge distribution at the lower surface 25 of the substrate W can be manipulated. For example, as shown in the left hand side of Figure 4, in an embodiment the substrate support 20 is electrically grounded. As charge passes between the substrate support 20 and the substrate W, the lower surface 25 of the substrate W tends to reach the same potential as the substrate support 20. For example, the lower surface 25 of the substrate W may reach ground potential where the electrical charge can pass through the conductive liquid 27 to/from the substrate support 20.

[0053] Electrical charge can be removed from the lower surface 25 of the substrate W via the conductive liquid 27 bridging the gap 26, with the substrate support 20 electrically grounded.

However, it is not essential for the substrate support 20 to be electrically grounded. In an alternative embodiment, the substrate support 20 is electrically biased. A redistributed electrical charge can be imposed on the lower surface 25 of the substrate W via the conductive liquid 27 bridging the gap 26, with the substrate support 20 being electrically biased. It is possible to manipulate the charge distribution of the lower sur face 25 of the substrate W by controlling the electrical potential of the substrate support 20. In an embodiment the substrate support 20 is controlled to have the same electrical potential as the pedestal or pins that support the substrate W when the substrate W is being loaded onto, or unloaded from, the substrate support 20.

[0054] When the substrate W is moved onto the substrate table WT (e.g. for an exposure process), its lower surface 25 has a substantially grounded electrical charge (or otherwise redistributed electrical charge). This reduces the possibility of the substrate table WT being oxidized when the substrate W is placed on the substrate table WT.

[0055] In an embodiment, the substrate table WT comprises burls for supporting the lower surface 25 of the substrate W. The top of the burls of the substrate table WT can undergo oxidation when moisture and electrical charge are present. By reducing the electrical charge at the lower surface 25 of the substrate W, the oxidation process is reduced. An embodiment of the invention is expected to reduce degradation of the substrate table WT.

[0056] In an embodiment, the substrate support 20 comprises a thermal conditioner configured to thermally condition the substrate W. In an embodiment, the substrate W resides on the substrate support 20 while it is being thermally conditioned. For example, the substrate W may reside on the substrate support 20 for in the region of ten seconds for thermal conditioning. In an embodiment, the process of manipulating the charge distribution via the conductive liquid 27 at the lower surface 25 of the substrate W is performed while the substrate W is being thermally conditioned. The substrate W is thermally conditioned in preparation of an exposure process. For example, the substrate W may be heated, cooled or may have its temperature evened out across its lower surface 25.

[0057] Figures 5 and 6 depict a substrate W on a substrate support 20 according to an embodiment of the invention. Figure 5 shows a plan view from above the substrate support 20. The substrate W is not shown in Figure 5. Figure 6 shows a side on view of a radius of the substrate W and the substrate support 20. In Figure 6, the axis Q represents the center point of the substrate W and the substrate support 20.

[0058] As shown in Figures 5 and 6, in an embodiment the substrate support 20 has a hole at its center. The hole may be used for allowing a cylinder to pass through the hole for raising and lowering the substrate W relative to the substrates support 20 (e.g. for loading and unloading of the substrate W). However, it is not essential for such a hole to be provided at the center of the substrate support 20. In an alternative embodiment, the center of the substrate support 20 is filled in, and a plurality of holes are provided at a certain radius of the substrate support 20. The holes may be used for allowing pins to control loading and unloading of the substrate W.

[0059] As shown in Figure 6, in an embodiment the substrate support 20 comprises a chamber 33. The chamber 33 is configured to be filled with a sufficient amount of the conductive liquid 27. The conductive liquid 27 is stored in the chamber 33 and released when the conductive liquid 27 is injected into the gap 26.

[0060] As shown in Figures 5 and 6, in an embodiment the conductive liquid 27 bridges the gap 26 across most of the lower surface 25 of the substrate W. As shown in Figure 5 and 6, in an embodiment, conductive liquid 27 is injected to create a full conductive layer between the substrate W and the substrate support 20. The conductive layer forms a conductive bridge between the substrate W and the substrate support 20. In an embodiment, the conductive liquid 27 bridges the gap 26 across substantially all of the lower surface 25 of the substrate W. Of course, there may be a small portion of the lower surface 25 of the substrate W that is not covered by the conductive liquid 27. For example, at the very outer periphery or that the center of the lower surface 25, there may be no conductive liquid present. The electrical charge can be evened out across substantially all of the lower surface 25 of the substrate W. An embodiment of the invention is expected to reduce degradation across most of, or substantially all of, the substrate table WT.

[0061] As mentioned above, in an embodiment, the substrate W is clamped onto the substrate support 20. In an embodiment the conductive liquid 27 is applied in between the substrate W and the substrate support 20 before the substrate W is clamped onto the substrate support 20 (e.g. by applying an underpressure to the gap 26). Additionally or alternatively, in an embodiment, the conductive liquid 27 is applied during clamping of the substrate W onto the substrate support 20. The conductive liquid 27 can be applied either before loading/clamping of a substrate W and/or can be supplied during the clamping of the substrate W via the liquid supply channel 28.

[0062] As shown in Figure 6, in an embodiment the substrate support 20 comprises a gas supply channel 31. The gas supply channel 31 is configured to supply gas to the gap 26. For example, gas may be supplied to the gap 26 so as to displace the conductive liquid 27 from the gap 26. In an embodiment, the gas supply channel 31 is configured to supply gas to dry the lower surface 25 of the substrate W.

[0063] As shown in Figure 6, in an embodiment the liquid supply channel 28 and the gas supply channel 31 share a common opening 32 in the base surface 23 of the substrate support 20. The channels can be controlled so as to control whether the gas or the conductive liquid 27 is supplied to the gap 26 through the common opening 32. However, it is not essential for a common opening 32 to be provided. In an alternative embodiment, separate supply channels are provided for supplying gas and for supplying conductive liquid 27.

[0064] As shown in Figure 6, in an embodiment the substrate support 20 comprises valves 34 to 36 for controlling the conductive liquid 37 and the gas supplied to the common opening 32. For example, as shown in Figure 6, in an embodiment the substrate support 20 comprises a first valve 34 at the upstream end of the chamber 33. The first valve 34 is configured to control a flow of conductive liquid 27 into the chamber 33 where the conductive liquid 27 is stored. The first valve 34 may be called a liquid droplet generator. In an embodiment the substrate support 20 comprises a second valve 35. The second valve 35 is positioned at the downstream end of the chamber 33. The second valve 35 controls a flow of conductive liquid 27 from the chamber 33 to the common opening 32. In an embodiment the substrate support 20 comprises a third valve 36. The third valve 36 is configured to control a flow of gas to the common opening 32.

[0065] In an alternative embodiment, the liquid supply channel 28 and the gas supply channel 31 do not share a common opening. The liquid supply and the gas supply may come from separate supplies. In such an alternative embodiment the arrangement of valves may be different from the arrangement shown in Figure 6. Valves may be provided for controlling the supply of liquid and the supply of gas independently.

[0066] As mentioned above, in an embodiment the conductive liquid 27 is supplied before clamping of the substrate W onto the substrate support 20. For example, in an embodiment the amount of conductive liquid 27 is supplied to the gap 26 by briefly closing the third valve 36 and opening the first valve 34 and the second valve 35. The liquid supply channel 28 may have an overpressure to form a annular rivulet of the conductive liquid 27 in the region of the common opening 32. The supply of conductive liquid 27 can be stopped by closing the first valve 34 and the second valve 35. Subsequently, the substrate W is clamped onto the substrate support 20 which results in the annular rivulet of conductive liquid 27 being squeezed so that the conductive liquid 27 spreads along the lower surface 25 of the substrate W.

[0067] Alternatively, the substrate W may be clamped to the substrate support 20 before the conductive liquid 27 is supplied to the gap 26. For example, as shown in Figures 5 and 6, in an embodiment the substrate support 20 comprises an inner extraction channel 29 and an outer extraction channel 30. The inner extraction channel 29 and the outer extraction channel 30 are connected to an underpressure so as to remove matter from the gap 26, for example for clamping. In an embodiment, the extraction channels 29, 30 are used to clamp the substrate W to the substrate support 20 while the second valve 35 and the third valve 36 are closed. Subsequently, the first valve 34 and the second valve 35 are opened briefly so as to supple an amount of the conductive liquid 27 in the gap 26. The conductive liquid 27 spreads in the gap 26 across the lower surface 25 of the substrate W. The second valve 35 and optionally also the first valve 34 are then closed so as to stop the supply of conductive liquid 27. This results in a complete or partial wetted area between the substrate W and the substrate support 20 as shown in Figures 5 and 6.

[0068] In an arrangement that is alternative to the one shown in Figures 5 and 6, the conductive liquid 27 is injected to create a conductive annular liquid layer forming a conductive bridge between the substrate W and the substrate support 20. Figures 7 and 8 depict such an arrangement with the substrate W positioned on the substrate support 20.

[0069] In either of the arrangements, in the areas where the conductive liquid 27 bridges the gap between the lower surface of the substrate W and the substrate support 20, electrical charge can drain to the substrate support 20. The flow of electrical charge depends on the bias potential and the conductivity of the conductive liquid. In an embodiment, the conductive liquid 27 is sufficiently conductive for the electrical charge to drain substantially completely towards a ground store unit. In an alternative embodiment, a bias potential is imposed on the substrate support 20 such that a leftover net charge is uniformly distributed across the areas where the conductive liquid 27 bridges the gap 26. The average net charge corresponds to the potential imposed on the substrate support 20. For example, in an embodiment the substrate W is charged to guarantee a net potential above the electrochemical open circuit open potential, such that oxidation does not occur. An embodiment is expected to reduce or eliminate oxidation of the substrate table WT.

[0070] As shown in Figures 7 and 8, in an embodiment an annular layer of the conductive liquid 27 is positioned radially inward and radially outward or the common opening 32 of the liquid supply channel 28. As shown in Figures 7 and 8, the gap 26 remains unbridged across most of the lower surface 25 of the substrate W. The unbridged sections 37 are shown in Figures 7 and 8. As shown in Figures 7 and 8, in an embodiment an unbridged section 37 is radially inward of the annular layer of the conductive liquid 27. As shown in Figures 7 and 8, in an embodiment an unbridged section 37 is radially outward of the annular layer of the conductive liquid 27. However, this is not necessarily the case. In an alternative embodiment, the annular layer of the conductive liquid 27 is at the outer periphery of the lower surface 25 of the substrate W such that there is no significant unbridged section radially outward of the annular layer. In a further alternative embodiment, the annular layer of the conductive liquid 27 is towards the center of the lower surface 25 of the substrate W such that there is no significant unbridged section radially inward of the annular layer of the conductive layer 27.

[0071] In an embodiment, conductive liquid 27 is supplied to the gap 26 to form one or more controlled segments where the gap 26 is bridged by the conductive liquid 27. For example, in an embodiment conductive liquid 27 is supplied to form a plurality of concentric rings. The position of the segments may be controlled based on where it is known that electrical charge at the lower surface 25 of the substrate W is undesirable. It may be that other parts of the lower surface 25 of the substrate W are not charged, for example, or the charge is acceptably low. An embodiment of the invention is expected to reduce the time required to sufficiently manipulate the electrical charge at the lower surface 25 of the substrate W.

[0072] In an embodiment, the conductive liquid 27 remains substantially stationary while the charge is flowing between the substrate W and substrate support 20. This means that the areas where the conductive liquid 27 bridges the gap 26 do not substantially change during manipulation of the charge distribution at the lower surface 25 of the substrate W. However, this is not necessarily the case. In an alternative embodiment, the conductive liquid 27 moves. For example, in an embodiment the conductive liquid 27 moves radially in the gap 26 along the lower surface 25 of the substrate W. The conductive liquid 27 is sufficiently conductive for the charge to flow between the substrate W and the substrate support 20 while the conductive liquid 27 bridges the gap 26 in each area. For example, in an embodiment gas 38 is supplied to the gap 26 so as to move the conductive liquid 27 in the gap 26 radially. Charge passes between charged locations of the lower surface 25 of the substrate W and the base surface 23 of the substrate support 20 as the conductive liquid 27 moves into contact with the charged locations. For example, the conductive liquid 27 may be removed by injection of a gas 38 subsequent to the injection of the conductive liquid 27. The gas 38 forms an annular bubble pushing the conductive liquid 27 radially. For example, the bubble may push the conductive liquid 27 radially inwards and outwards towards the inner extraction channel 29 and the outer extraction channel 30 of the substrate support 20.

[0073] As mentioned above and shown in Figures 5 and 6, in an embodiment, a full conductive layer may be formed between the substrate W and the substrate support 20. Electrical charge can drain towards the substrate support 20 from the moment that an area is wetted between the lower surface 25 of the substrate W and the substrate support 20. Alternatively, when an annular layer of conductive liquid 27 is formed (as shown in Figures 7 and 8) the charge drain happens once then annular layer of conductive liquid 27 is pushed through the gap 26.

[0074] In an embodiment, a substrate W is prepared for being exposed by a patterned radiation beam. The method comprises entering the substrate W into the lithographic apparatus 100. The substrate W is then supported on a substrate support 20. In an embodiment the substrate support 20 is stationary. The substrate support 20 is not part of the lithographic apparatus 100 that is controlled to move during use.

[0075] As explained in further detail below, in an embodiment, the method comprises drying the lower surface 25 of the substrate W before the dried substrate W is then moved to the substrate table WT where the upper surface of the substrate W opposite to the lower surface 25 is to undergo exposure by the patterned radian beam. By drying the lower surface 25 of the substrate W before the substrate W is positioned onto the substrate table WT, the substrate W has less moisture on its lower surface 25. Less moisture comes into contact with the substrate table WT when the substrate W is loaded onto the substrate table WT. An embodiment of the invention is expected to reduce degradation of the substrate table WT. In particular, an embodiment of the invention is expected to reduce oxidation of the substrate table WT.

[0076] In an embodiment, the lower surface 25 of the substrate W is dried by application of a deep vacuum in the gap 26 between the substrate W and the substrate support 20. Optionally, the gap 26 may be purged with a humidity free gas for better removal of humidity. For example, the humidity free gas may be supplied from the gas supply channel 31. In an embodiment, the deep vacuum is applied by extracting gas through the inner extraction channel 29 and/or the outer extraction channel 30. The deep vacuum is a lower pressure than the pressure required to clamp the substrate W to the substrate support 20. When the substrate W is clamped onto the substrate support 20, an underpressure is provided in the gap 26. However, the underpressure is not a sufficiently low pressure to remove water from the lower surface 25 of the substrate W. In contrast, when the deep vacuum is applied, moisture is removed from the lower surface 25. The drying is achieved by applying an underpressure to the gap 26 between the lower surface 25 of the substrate W and the base surface 23 of the substrate support 20 so as to remove liquid droplets from the lower surface 25 of the substrate W. The drying may be pressure induced. In an embodiment, an underpressure is applied to the gap 26 so as to remove all liquid (e.g. water) from the lower surface 25 of the substrate W. For example, a liquid film may be removed from the lower surface 25 of the substrate W.

[0077] In an embodiment, the process of manipulating charge distribution is performed without also drying the substrate W. In an alternative embodiment, the drying process is performed without also manipulating the charge distribution. In a further alternative embodiment, both the charged distribution manipulation and the drying process are performed. In such an embodiment, the manipulation of the charged disruption is performed first using the conductive liquid 27. The conductive liquid 27 is then removed. For example, a gas 38 may be provided through the gas supply channel 31 to remove the conductive liquid 27 from the gap 26. In an embodiment, the gas 38 supplied to the gap 26 is extreme clean dry air, nitrogen or a humidity free gas.

[0078] In the Figures, the gas supply channel 31 is shown at an intermediate radius. However, this is not necessarily the case. In an alternative embodiment the gas supply channel 31 may be near the center of the substrate support 20 or at an outer periphery of the substrate support 20. [0079] In an embodiment, the conductive liquid 27 is pushed towards the inner extraction channel 29 and/or the outer extraction channel 30. Figures 9 and 10 depict a gas 38 pushing the conductive liquid 27 towards the extraction channels 29, 30. The liquid 27 is removed through the extraction channels 29, 30 away from the gap 26.

[0080] Figure 13 depicts a further possible feature of the arrangement between the substrate

W and the substrate support 20. As shown in Figure 13, in an embodiment the base surface 23 of the substrate support 20 is shaped such that the gap 26 narrow's towards the extraction channel 30. This enables capillary effects to facilitate or simplify the motion of the conductive liquid 27 towards an extraction channel, e.g. the outer extraction channel 30. In an embodiment, the base surface 23 is hydrophilic. In an embodiment, the lower surface 25 of the substrate W is hydrophilic. As shown in Figure 13, in an embodiment a geometry configuration such as a wedge is formed for the gap 26. [0081] Figures 11 and 12 depict gas 38 being supplied to push the conductive liquid 27 out from the gap 26. Figures 11 and 12 show the conductive liquid 27 being pushed through the gap 26 when the conductive liquid forms an annular layer, as shown in Figures 7 and 8. In contrast Figures 9 and 10 correspond to the arrangement in which a full layer of conductive liquid '27 is formed, as shown in Figures 5 and 6.

[0082] In an embodiment, drying of the lower surface '25 of the substrate W may be flow induced. In an embodiment, the drying is by supplying a gas flow from the substrate support 20 to the gap 26 between the lower surface 25 of the substrate W and the base surface 23 of the substrate support 20. For example, a strong flow of humidity free gas may dry the substrate W. The gas may be supplied through the gas supply channel 31.

[0083] In an embodiment, the gas flow provides a gas film for supporting the substrate W above the substrate support 20 without contact between the substrate W and the substrate support 20. Above a certain flow rate, a gas bearing is formed in which the substrate W detaches from the burls 22 of the substrate support 20. The substrate W levitates on the gas film above the burls 22. In an embodiment, gas is continued to be extracted through the extraction channels 29, 30 so as to maintain a sufficiënt underpressure to hold the substrate W onto the burls 22 or to hold the substrate W at a limited flying height above the burls 22, In an embodiment, gas is extracted through the extraction channels 29, 30 so as to extract all of the flow supplied. By providing the gas film for supporting the substrate W without contact with the substrate support 20, any influence of the burls 22 on the charge distribution or drying of the substrate W can be reduced. In an embodiment, the substrate support W is designed as a gas bearing in which a pure large radial flow of gas dries the lower surface '25 of the substrate W.

[0084] As mentioned above, in an embodiment the substrate support 20 comprises burls 22. However, this is not necessarily the case. In an alternative embodiment, the substrate support 20 does not have burls 22, Tire substrate support 20 may have the form of a flat plate with only supply and extraction channels. The substrate support 20 is configured to not contact the substrate W during use. In an embodiment, the substrate support 20 is configured to thermally condition the substrate W and to dry the lower surface of the substrate W. The substrate support 20 may not be configured to manipulate the charge distribution by using a conductive liquid 27. This reduces the risk of capillary clamping which might otherwise make it more difficult to remove the liquid in a short time span. [0085] As mentioned above, in an embodiment, the conductive liquid 21 is removed by the injection of a gas subsequent to the injection of the conductive liquid 27. Tire gas 38 pushes the conductive liquid 27 through the gap 26. In an embodiment, the gas 38 comprises a vapor of organic liquid soluble in the conductive liquid 27 such that the vapor dissolves into a meniscus 39 (shown in Figure 12, for example) of the conductive liquid 27 while the meniscus 39 moves across the lower surface 25 of the substrate W. This promotes drying of the lower surface 25 of the substrate W. For example, in an embodiment, isopropyl alcohol (IPA) vapor is added to the gas 38. This creates a Marangoni drying pocket adjacent to the meniscus 39. The Marangoni drying promotes better drying of the lower surface 25 of the substrate W. Tire IPA (or other alcohol solvent) lowers the surface tension of the meniscus 39. In an embodiment, the solvent used is easily vaporized.

[0086] In an embodiment, the charge manipulation and drying of the substrate W occur while the substrate W is being thermally conditioned on the substrate support 20. An embodiment of the invention is expected to reduce degradation of the substrate table WT without significantly decreasing throughput. In an alternative embodiment the thermal conditioning is performed after the charge removal and/or the drying.

[0087] In an embodiment, the conductive liquid 27 is water saturated with carbon dioxide. In an alternative embodiment, the conductive liquid 27 is IPA.

[0088] In the embodiments shown in the Figures, the supply channels 28, 30 are provided at an intermediate radius, with extraction channels 29, 30 radially inward and radially outward. However, other configurations are possible. In an embodiment, the supply and extraction channels are provided so as to promote radial flow over the lower surface 25 of the substrate W. The flow rate and pressure can be controlled.

[0089] In an embodiment, a device is manufactured by a device manufacturing method comprising using the lithographic apparatus 100 as described above. The lithographic apparatus 100 transfers a pattern from the patterning device MA to the substrate W. In an embodiment, the device manufacturing method comprises the method of

Manipulating charge distribution and/or the method of drying a substrate W as described above. [0090] Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion, respectively. The substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.

[0091] The terms “radiation” and “beam” used herein encompass all types of electromagnetic radiation, including ultraviolet (UV) radiation (e.g. having a wavelength of or about 365, 248, 193, 157 or 126 nm) and extreme ultra-violet (EUV) radiation (e.g. having a wavelength in the range of 5-20 nm), as well as particle beams, such as ion beams or electron beams.

While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the clauses set out below. Other aspects of the invention tire set out as in the following numbered clauses:

1. A substrate support configured to support a substrate, the substrate support comprising:

a plurality of burls protruding from a base surface of the substrate support, the burls having distal ends in a plane for supporting a lower surface of the substrate with a gap between the base surface of the substrate support and the lower surface of the substrate; and a liquid supply channel for supplying a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, thereby allowing charge to pass between the substrate support and the substrate;

wherein the substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate can be manipulated.

2. The substrate support of clause 1, further comprising a gas supply channel for supplying gas to the gap so as to displace the conductive liquid from the gap.

3. The substrate support of clause 2, wherein the liquid supply channel and the gas supply channel share a common opening in the base surface.

4. The substrate support of clause 3, comprising valves for controlling the conductive liquid and the gas supplied to the common opening.

5. The substrate support of any preceding clause, wherein the substrate support is electrically grounded.

6. The substrate support of any of clauses 1 to 4, wherein the substrate support is electrically biased.

7. The substrate support of any preceding clause, comprising:

one or more extraction channels for extracting at least one of gas and liquid from the gap;

wherein the base surface is shaped such that the gap narrows towards the one or more extraction channels.

8. The substrate support of any preceding clause, comprising a thermal conditioner configured to thermally condition the substrate.

9. The substrate support of any preceding clause, wherein the conductive liquid comprises at least one selected from a group consisting of CO? saturated water and isopropyl alcohol.

10. A lithographic apparatus comprising the substrate support of any preceding clause, wherein the substrate support is stationary.

11. A method for manipulating charge distribution of a lower surface of a substrate, the method comprising:

supporting a lower surface of the substrate on a plurality of burls protruding from a base surface of a substrate support, the burls having distal ends in a plane, with a gap between the base surface of the substrate support and the lower surface of the substrate; and supplying a conductive liquid to the gap so as to bridge the gap between the base surface of the substrate support and the lower surface of the substrate, thereby allowing charge to pass between the substrate support and the substrate;

wherein the substrate support has a controlled electrical potential such that charge distribution at the lower surface of the substrate is manipulated.

12. The method of clause 11, wherein the conductive liquid bridges the gap across most of the lower surface of the substrate.

13. The method of clause 11, wherein the conductive liquid bridges the gap to form an annular layer of the conductive liquid, leaving the gap unbridged across most of the lower surface of the substrate.

14. The method of any of clauses 11 to 13, comprising supplying gas to the gap so as to move the conductive liquid in the gap radially, such that charge passes between charged locations of the lower surface of the substrate and the base surface of the substrate support as the conductive liquid moves into contact with the charged locations.

15. The method of any of clauses 11 to 14, comprising supplying gas to the gap so as to displace the conductive liquid from the gap, wherein the gas comprises a vapour of an organic liquid soluble in the conductive liquid such that vapour dissolves into a meniscus of the conducti ve liquid while the meniscus moves across the lower surface of the substrate, so as to promote drying of the lower surface.

16. The method of any of clauses 11 to 15, performed while the substrate is being thermally conditioned in preparation of an exposure process.

17. A method for preparing a substrate for being exposed by a patterned radiation beam, the method comprising:

entering the substrate into a lithographic apparatus;

supporting the substrate on a substrate support;

drying a lower surface of the substrate; and moving the dried substrate to a substrate table where an upper surface of the substrate opposite to the lower surface is to undergo exposure by the patterned radiation beam.

18. The method of clause 17, comprising:

thermally conditioning the substrate in preparation of the exposure process;

wherein the drying process is performed while the thermal conditioning is performed.

19. The method of clause 17 or 18, wherein the drying is by applying an underpressure to a gap between the lower surface of the substrate and a base surface of the substrate support so as to remove moisture from the lower surface of the substrate.

20. The method of clause 17 or 18, wherein the drying is by supplying a gas flow from the substrate support to a gap bet ween the lower surface of the substrate and a base surface of the substrate support.

21. The method of clause 20, wherein the gas flow provides a gas film for supporting the substrate above the substrate support without contact between the substrate and the substrate support.

22. The method of clause 20 or 21, comprising extracting gas from the gap through one or more extraction channels of the substrate support.

23. The method of clause 22, wherein the gap narrows towards the one or more gas extraction channels such that capillary effects promote flow towards the one or more extraction channels.

Claims (1)

CONCLUSION A device adapted to illuminate a substrate. 1/8