NL2003489C2 - Illumination-improving structure for led or smd led lights. - Google Patents
Illumination-improving structure for led or smd led lights. Download PDFInfo
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- NL2003489C2 NL2003489C2 NL2003489A NL2003489A NL2003489C2 NL 2003489 C2 NL2003489 C2 NL 2003489C2 NL 2003489 A NL2003489 A NL 2003489A NL 2003489 A NL2003489 A NL 2003489A NL 2003489 C2 NL2003489 C2 NL 2003489C2
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- Netherlands
- Prior art keywords
- led
- light
- lamp
- smd
- edge
- Prior art date
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- 238000005286 illumination Methods 0.000 description 6
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
ILLUMINATION-IMPROVING STRUCTURE FOR LED OR SMD LED LIGHTS
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an illumination-improving structure, and more particularly to an illumination-improving structure that eliminates flare, improves light 5 uniformity and luminance and regulates projecting angles.
2. Description of Related Art
Theoretically, light emitting diode (LED) is a light source has longest lifespan, lowest heat, lowest chemical pollution and electricity consumption so that application of LED is the major trend of present illumination having environmental and energy-saving efficiency.
10 However, taking LEDs to make a conventional bulb still has some drawbacks as below: 1. The conventional LED bulb is a spot light source and thus usually performs flare phenomenon. Unlike halide bulb and tungsten bulb which are line light sources or high-pressure sodium lamp or fluorescent lamp (such as fluorescent light tube, compact 15 fluorescent lamp), HID bulbs which are activated by sodium, mercury or xenon elements to perform planar light source, the spot light source of LED causes uneven LUX with great drops to the projecting surfaces it projects thereto and has poor illumination uniformity in comparison with the fluorescent light tube, compact fluorescent lamp and tungsten bulb especially serving as reading lights (as shown in Figs. 1 to 4).
20 2. The conventional LED illumination lights all embed one or multiple LED units into one or multiple V-shaped recesses in a heat sink base. Although the V-shaped recesses adjust the projecting angles of the light from LED units, wide-angle light is also interrupted and transformed to refraction light. In other words, light from LED spot light source out of direct light range within the V-shaped recess will be refracted by sidewalls therein to cause 25 irregular and uneven fraction light which also damps the uniformity in illumination (as shown in Figs. 5 and 6).
3. The conventional LED bulbs or lamps with high lumens all need heat sink base to disperse heat, wherein LED lamps having low watts (take 1W for example) can sufficiently disperse or conduct heat by attaching heat sink base (as shown in Figs. 5 and 6). However, 30 LED lamps having high watts (for example, 3W or 5W) or a small substrate collecting multiple 1W LED units can not sufficiently disperse the high heat even by attaching the heat sink base made of copper or aluminum boards. Therefore, the conventional LED lamps cannot protect 2 the LED units with chips within the limitation temperature (60 to 65°C) to decrease their decay and thus to stabilize their lifespan.
SUMMARY OF THE INVENTION
5 A main objective of the present invention is to provide an illumination-improving structure for LED or SMD LED lights that eliminates flare, improves light uniformity and luminance and regulates projecting angles.
To achieve the foregoing objective, the illumination-improving structure comprises: a lamp base being a funnel shape mounted on the lamp head and having an enlarged 10 top edge with an annular cutout defined near the enlarged top edge; a substrate engaged the annular cutout and having at least one LED or SMD LED units each with at least one thermal conducting base and at least one hole defined on the substrate to receive the at least one thermal conducting base correspondingly; a light-adjusting lens mounted over the LED or SMD LED units and having an outer 15 convex arc performing a plane with edge surface, wherein the plane and the outer convex arc are connected in form of a sharp angle attachment; an inner concave arc or an inner planar surface treated with foggy treatment or coated with foggy paper; and a rim mounted on the substrate around the at least one LED or SMD LED unit.
20 Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
25 Fig. 1 is a schematic drawing showing the light uniformity rate of a surface light source being a T26 fluorescent light tube of 60 cm from side and corresponding top at different projecting angles in accordance with the prior art;
Fig. 2 is a schematic drawing showing the light uniformity rate of a line light source being a E27 60 W tungsten-filament bulb from side and corresponding top at different 30 projecting angles in accordance with the prior art;
Fig. 3 is a schematic drawing showing the light uniformity rate of a surface light source being a 26 W helical energy-saving compact fluorescent lamp from side and corresponding top at different projecting angles in accordance with the prior art;
Fig. 4 is a schematic drawing showing the light uniformity rate of a spot light source 35 being a 1 W LED lamp from side and corresponding top at different projecting angles in accordance with the prior art;
Fig. 5 is a schematic side drawing showing the light projection of refracting light, RL, and direct light, DL, of a spot light source being an LED unit within a V-shaped recess of a 3 heat sink having a thermal dispensing base, TDB, and a thermal conducting substrate, TCS, in accordance with the prior art;
Fig. 6 is a schematic side drawing showing the light projection refracting light, RL, and direct light, DL, of a spot light source being an LED unit within one of multiple V-shaped 5 recesses of a heat sink having a thermal dispensing base, TDB, and a thermal conducting substrate, TCS, in accordance with the prior art;
Fig. 7 is a cross-sectional side view of a illumination-improving structure (projecting bulb) for LED or SMD LED lights served as a spotlight in accordance with the present invention; 10 Fig. 8 is an exploded perspective view of the LED unit, substrate and thermal dispersing body in accordance with the present invention;
Fig. 9 is a cross-sectional side view of a illumination-improving structure for LED or SMD LED lights served as a wide-angle light in accordance with the present invention;
Fig. 9-1 is cross-sectional view of the illumination-improving structure mounted on a 15 fluorescent light tube;
Fig. 9-2 is cross-sectional view of the illumination-improving structure mounted on a dual-socket light tube;
Fig. 10 is a partially cross-sectional view of a planar connector of an adjusting lens to combine with a convex; 20 Fig. 11 is a schematic cross-sectional view showing the radial dispersion of the thermal dispersing body and a post combined into a set;
Fig. 12 is a partially cross-sectional view of the illumination-improving structure showing a rim around multiple LED units or multiple SMD LED units;
Fig. 12-1 is a top view of the illumination-improving structure showing the rim around 25 the multiple LED units or the multiple SMD LED units;
Fig. 13 is a cross-sectional side view of a metal socket in accordance with the present invention;
Fig. 14 is a schematic drawing showing LUX and light uniformity rate of LED or SMD LED lamp (spot light source) in accordance with the present invention;
30 Fig. 15 is a schematic drawing showing LUX and light uniformity rate of LED or SMD
LED lamp (surface light source) with a convex light-adjusting lens served as a wide-angle light in accordance with the present invention;
Fig. 16 is a schematic drawing showing LUX and light uniformity rate of LED or SMD LED lamp (surface light source) with a concave-convex light-adjusting lens served as a wide-35 angle light in accordance with the present invention;
Fig. 16-1 is a schematic drawing showing LUX and light uniformity rate of LED or SMD LED lamp (surface light source) with a concave-convex light-adjusting lens served as a spotlight in accordance with the present invention; 4
Fig. 17 is a cross-sectional side view of the illumination-improving structure attached to a singular light of a car lamp;
Fig. 18 is a cross-sectional side view of the illumination-improving structure attached to a car headlamp combination; 5 Fig. 18-1 is a cross-sectional side view of the car headlamp combination along line A- A’;
Fig. 19 is a cross-sectional side view of the illumination-improving structure attached to a two-way projection light;
Fig. 19-1 is a cross-sectional side view of the two-way projection light; 10 Fig. 20 is a cross-sectional side view of the illumination-improving structure attached to a road light or a decorative projecting lamp;
Fig. 20-1 is a bottom view of the road light or the decorative projecting lamp; and
Fig. 20-2 is a cross-sectional side view of the road light or the decorative projecting lamp.
15
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
An illumination-improving structure for LED or SMD LED lights in the present invention is to mount a lamp base at a light head. The lamp base is funnel-shaped and has an interior annular cutout near its top edge. A substrate engages the annular cutout to carry one or 20 multiple LED or SMD LED units at a center or other proper locations. Moreover, a rim is formed on the substrate to surround the LED or SMD LED units. The lamp base further has a light-adjusting lens mounted over the LED or SMD LED units. The light-adjusting lens has an outer convex arc performing a plane with edge surface and has an inner concave arc or an inner planar surface. The plane and the outer convex arc are connected in form of sharp 25 angle attachment. The inner concave arc or the inner planar surface are treated with foggy treatment or coated with foggy paper. By having above features and adjusting distance between the LED or SMD LED units and the light adjusting lens, the illumination-improving structure enables to eliminate flare, improve light uniformity or luminance and regulate projecting angles.
30 As shown in Figs. 7 and 9, a preferred embodiment of the illumination-improving structure is to mount a lamp base 2 to a lamp head 1 which has a vertoro driver 11. The lamp base 2 is funnel-shaped and has an enlarged top edge and an annular cutout 21 defined near the enlarged top edge inside the lamp base 2. A substrate 3 is received inside the annular cutout 21 and has at least one LED or SMD LED units 31 at its center or other proper 35 locations thereon. The substrate 3 has multiple holes 32 corresponding to multiple thermal conducting bases 311 under the LED or SMD LED units 31. Moreover, a thermal dispersing body 4 is secured under the substrate 3 and is made of conductive material in any shapes or size. The thermal dispersing body 4 in Fig. 8 has multiple posts 41 with high thermal 5 conductive efficiency penetrating the holes 32 corresponding to the thermal conducting bases 311 of the LED or SMD LED units 31. Each post 41 has a height slightly higher than a thickness of the substrate 3 and has an outer diameter slightly smaller than an inner diameter of a corresponding hole 32 of the substrate 3. Moreover, the periphery of the posts 41 is 5 coated with thermal conductive glue and the thermal dispersing body 4 is secured on the substrate 3. As shown in Figs. 12 and 12-1, a rim 33 is formed on the substrate 3 around the LED or SMD LED units 31 and is selectively shaped to different variation according to arrangements of LED or SMD LED units 31. The rim 33 has a top slope inclined inwardly and having its top end higher than a top level of the LED or SMD LED units 31 and its bottom end 10 lower than the top level of the LED or SMD LED units 31. The light-conducting glue 34 is filled within the rim 33 over the LED or SMD LED units 31, wherein the light-conducting glue 34 performs a layer having a top surface higher than the top level of the LED or SMD LED units 31. Thereby, light emitting from spot light source of the LED or SMD LED units 31 is reflected and collected by the light-conducting glue 34 and inner surfaces of the rim 33 to perform initial 15 surface light source to increase luminance and improve light uniformity. Moreover, the lamp base 2 has a top and a light-adjusting lens 5 mounted at the top over the LED or SMD LED units 31. The light-adjusting lens 5 selectively has an outer convex arc 51 at its upper surface and an inner concave arc 52 at its lower surface as shown in Fig. 7. Otherwise, as shown in Fig. 9, the lower surface of the light-adjusting lens is an inner planar surface. The inner 20 concave arc 52 and the inner planar surface 53 (shown in Fig. 20-2) both are treated with foggy treatment or laminated with foggy paper. Moreover, distance D between the lightadjusting lens 5 and the LED or SMD LED units 31 is adjustable (as shown in Figs. 7 and 9). For example, (as shown in Figs. 16 and 16-1), when the distances D2, D3 between the lightadjusting lens 5 and the LED or SMD LED units 31 are 3 to 10 mm, the light-adjusting lens 5 25 creates lighting efficiency as a spotlight. As shown in Fig. 15, when the distances D1 between the light-adjusting lens 5 and the LED or SMD LED units 31 is 0 to 2.5 mm, the light-adjusting lens 5 creates lighting efficiency as a wide-angle lamp. Additionally, as shown in Fig. 9-1, the illumination-improving structure in this invention is operationally applied to a single-socket light tube or, as shown in Fig. 9-2, applied to a dual-socket light tube.
30 As shown in Fig. 10, the outer convex arc 51 of the light-adjusting lens 5 has its edge performing a planar connector 511, wherein the connection between the outer convex arc 51 and the planar connector 511 is a sharp attachment 512. Thereby, luminance outside the projecting angle range is increased.
As shown in Fig. 11, the high-conductive posts 41 on the thermal dispersing body 4 35 are separately created as a sleeving set, i.e. the thermal dispersing body 4 further has multiple engaging holes 42 aligning to the holes 32 on the substrate 3 under the thermal conducting base 311 of LED or SMD LED units 31. Moreover, a cross-shaped thermal conducting post 41’ is clamped between the substrate 3 and the thermal dispersing body 4 6 and connects to the holes 32 and the engaging holes 42 respectively to service as interface to sufficiently conduct and disperse heat. The described cross-shaped thermal conducting post 41’ is made of thermal dispersing material with excellent thermal conducting efficiency and the thermal dispersing body 4 is selectively made of thermal dispersing material with less 5 thermal conducting efficiency than the one of thermal conducting post 41 Thereby, heat generated by the LED or SMD LED units is radially dispersed by large surface of the steric periphery of the thermal conducting post 41 ’ and then remained heat is quickly passed to and dispersed by large surface of the thermal dispersing body 4. Unlike conventional LED light only has small thermal transmitting spot, the thermal dispersing structure with thermal 10 conducting post 41’ enables to rapidly conduct and disperse high heat along X, Y, Z axles.
As shown in Fig. 13, the lamp base 2 is integrally made of metal thermal dispersing base and contains an enlarged thermal conducting post 41” to make the largest surface and largest volume for thermal dispersion for high illumination or combination of large quantity of LED or SMD LED units 31 with high power consumption.
15 The foregoing light head 1 is selectively in form of a threaded type, a wedging type, a plug type or a T-shaped rotation lock (such as T-shaped rotation lock in the fluorescent light tube) etc.
The foregoing thermal dispersing body 4, the posts 41, the thermal conducting post 41’, 41 ”, or the metal lamp base 2 are made of thermal dispersing material such as aluminum, 20 copper or nano-ferric ceramic in one-piece or in a sleeving piece.
As shown in Fig. 17, the illumination-improving structure for LED or SMD LED lights in the present invention constitutes a single bulb for car lamp 10. Additionally, as shown in Figs. 18 and 18-1, the illumination-improving structure constitutes a long-distance projecting lamp 6, auxiliary projecting lamp 7, fog lamp 8 or day-light signal lamp 9 on a combination of car 25 head lamp 10’.
As shown in Figs. 19 and 19-1, the illumination-improving structure in this invention is applied to dual-way projecting lamp.
The illumination-improving structure in this invention also enables to be applied to assembled LED lamps such as LED road lamp combination or decorative projecting LED 30 lamps etc. (as shown in Figs. 20, 20-1 or 21-2).
According to above description, the illumination-improving structure for LED or SMD LED lamps in this invention has the following advantages: 1. The illumination-improving structure in this invention sufficiently conduct and disperse heat generated by the LED or SMD LED units 31 having high watts power to keep 35 the LED or SMD LED units 31 working normally and to extend lifespan thereof.
2. By constructing the rim 33, one or multiple LED or SMD LED units 31 are sealed and collected therein to perform an approximate surface light source (as shown in Fig. 12).
7 3. The light-adjusting lens 5 with the inner planar surface or the inner concave surface processes the projecting light from the approximate surface light source to enlarge the light source to serve as secondary light-collecting. The foggy treatment of the inner planar surface and the inner concave surface enables to eliminate the dark difference outside the projecting 5 light range of the light-adjusting lens, to achieve a surface light source, to have functions of high LUX, light uniformity, and to regulate projecting angle. Thereby, flare can be eliminated and light uniformity and light enhancement to maximum are achieved.
4. The sharp angle constituted by the outer convex arc and the planar connector is located at edge having the weakest projecting light but performs light-collecting ring to 10 enhance the illumination. Moreover, the foggy treatment makes the light even and the performance of the sharp angle cooperates with the LUX at the projecting center to increase the light uniformity degree.
5. The distance D between the LED or SMD LED units 31 and the light-adjusting lens 5 is adjusted to regulate the projecting angle for the secondary stages and to enhance 15 luminance and to improve light uniformity (as shown in Figs. 14, 15, 16 and 16-1). Adjustment of the distance D instead of making different molds for lamps to achieve the same function is simple and easy to save cost in manufacture.
Although this invention has been described in its preferred form with a certain degree of particularity, it is understood that the present invention of the preferred form has been 20 made only by way of example and that numerous changes in the details of construction and the combination and arrangement of parts any be resorted to without departing from the spirit and scope of the invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2003489A NL2003489C2 (en) | 2009-09-14 | 2009-09-14 | Illumination-improving structure for led or smd led lights. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2003489 | 2009-09-14 | ||
| NL2003489A NL2003489C2 (en) | 2009-09-14 | 2009-09-14 | Illumination-improving structure for led or smd led lights. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2003489C2 true NL2003489C2 (en) | 2011-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2003489A NL2003489C2 (en) | 2009-09-14 | 2009-09-14 | Illumination-improving structure for led or smd led lights. |
Country Status (1)
| Country | Link |
|---|---|
| NL (1) | NL2003489C2 (en) |
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| DE202005012652U1 (en) * | 2005-08-11 | 2005-11-10 | Kotzolt, Michael | Power light diode module has light diode on carrier plate having a hole through which a cooling body is inserted to contact the rear face of the diode and cool it |
| US20060131602A1 (en) * | 2004-12-21 | 2006-06-22 | Ouderkirk Andrew J | Illumination assembly and method of making same |
| US20060198147A1 (en) * | 2001-12-29 | 2006-09-07 | Shichao Ge | LED and LED lamp |
| US20070075325A1 (en) * | 2005-10-04 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
| US20080180014A1 (en) * | 2007-01-29 | 2008-07-31 | Tennrich International Corp. | LED heat sink |
| EP2009345A2 (en) * | 2007-06-30 | 2008-12-31 | Osram Sylvania, Inc. | LED lamp module |
| US20090159905A1 (en) * | 2007-12-24 | 2009-06-25 | Kuei-Fang Chen | Light Emitting Assembly |
-
2009
- 2009-09-14 NL NL2003489A patent/NL2003489C2/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060198147A1 (en) * | 2001-12-29 | 2006-09-07 | Shichao Ge | LED and LED lamp |
| US20060131602A1 (en) * | 2004-12-21 | 2006-06-22 | Ouderkirk Andrew J | Illumination assembly and method of making same |
| DE202005012652U1 (en) * | 2005-08-11 | 2005-11-10 | Kotzolt, Michael | Power light diode module has light diode on carrier plate having a hole through which a cooling body is inserted to contact the rear face of the diode and cool it |
| US20070075325A1 (en) * | 2005-10-04 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
| US20080180014A1 (en) * | 2007-01-29 | 2008-07-31 | Tennrich International Corp. | LED heat sink |
| EP2009345A2 (en) * | 2007-06-30 | 2008-12-31 | Osram Sylvania, Inc. | LED lamp module |
| US20090159905A1 (en) * | 2007-12-24 | 2009-06-25 | Kuei-Fang Chen | Light Emitting Assembly |
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