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NL2002693A1 - Solder plating method for copper pads or wafer. - Google Patents

Solder plating method for copper pads or wafer.

Info

Publication number
NL2002693A1
NL2002693A1 NL2002693A NL2002693A NL2002693A1 NL 2002693 A1 NL2002693 A1 NL 2002693A1 NL 2002693 A NL2002693 A NL 2002693A NL 2002693 A NL2002693 A NL 2002693A NL 2002693 A1 NL2002693 A1 NL 2002693A1
Authority
NL
Netherlands
Prior art keywords
wafer
plating method
solder plating
copper pads
pads
Prior art date
Application number
NL2002693A
Other languages
Dutch (nl)
Other versions
NL2002693C2 (en
Inventor
Wei-Hua Lu
Original Assignee
Nat Pingtung University Of Sci
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Pingtung University Of Sci filed Critical Nat Pingtung University Of Sci
Publication of NL2002693A1 publication Critical patent/NL2002693A1/en
Application granted granted Critical
Publication of NL2002693C2 publication Critical patent/NL2002693C2/en

Links

Classifications

    • H10W72/012—
    • H10W72/01231—
    • H10W72/01235—
    • H10W72/01251—
    • H10W72/01255—
    • H10W72/20—
    • H10W72/251—
    • H10W72/29—
    • H10W72/923—
    • H10W72/952—
NL2002693A 2008-04-03 2009-03-31 Solder plating method for copper pads of wafer. NL2002693C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097112408A TWI353645B (en) 2008-04-03 2008-04-03 Tin processing method for copper pads of wafer
TW97112408 2008-04-03

Publications (2)

Publication Number Publication Date
NL2002693A1 true NL2002693A1 (en) 2009-10-06
NL2002693C2 NL2002693C2 (en) 2010-11-02

Family

ID=41397322

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2002693A NL2002693C2 (en) 2008-04-03 2009-03-31 Solder plating method for copper pads of wafer.

Country Status (2)

Country Link
NL (1) NL2002693C2 (en)
TW (1) TWI353645B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551931B1 (en) * 2000-11-07 2003-04-22 International Business Machines Corporation Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
JP3679001B2 (en) * 2000-12-22 2005-08-03 シャープ株式会社 Semiconductor device and manufacturing method thereof
US7078796B2 (en) * 2003-07-01 2006-07-18 Freescale Semiconductor, Inc. Corrosion-resistant copper bond pad and integrated device

Also Published As

Publication number Publication date
TW200943444A (en) 2009-10-16
NL2002693C2 (en) 2010-11-02
TWI353645B (en) 2011-12-01

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