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NL2001029A1 - Resin forming machine and method for forming resin. - Google Patents

Resin forming machine and method for forming resin.

Info

Publication number
NL2001029A1
NL2001029A1 NL2001029A NL2001029A NL2001029A1 NL 2001029 A1 NL2001029 A1 NL 2001029A1 NL 2001029 A NL2001029 A NL 2001029A NL 2001029 A NL2001029 A NL 2001029A NL 2001029 A1 NL2001029 A1 NL 2001029A1
Authority
NL
Netherlands
Prior art keywords
resin
forming
machine
forming machine
forming resin
Prior art date
Application number
NL2001029A
Other languages
Dutch (nl)
Other versions
NL2001029C2 (en
Inventor
Fumio Miyajima
Yoshio Watanabe
Tetsuya Nishizawa
Hiroaki Yamagishi
Mitsugi Yoshino
Takashi Katayama
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of NL2001029A1 publication Critical patent/NL2001029A1/en
Application granted granted Critical
Publication of NL2001029C2 publication Critical patent/NL2001029C2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C2033/727—Cleaning cleaning during moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
NL2001029A 2006-11-22 2007-11-22 RESIN FORMING MACHINE AND METHOD FOR FORMING RESIN. NL2001029C2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006316075 2006-11-22
JP2006316075 2006-11-22
JP2007279723A JP5314876B2 (en) 2006-11-22 2007-10-27 Resin molding apparatus and resin molding method
JP2007279723 2007-10-27

Publications (2)

Publication Number Publication Date
NL2001029A1 true NL2001029A1 (en) 2008-05-23
NL2001029C2 NL2001029C2 (en) 2010-09-16

Family

ID=39652407

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2001029A NL2001029C2 (en) 2006-11-22 2007-11-22 RESIN FORMING MACHINE AND METHOD FOR FORMING RESIN.

Country Status (3)

Country Link
JP (2) JP5314876B2 (en)
KR (1) KR100916177B1 (en)
NL (1) NL2001029C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083782A1 (en) * 2012-11-30 2014-06-05 アピックヤマダ株式会社 Resist film forming device and method, conductive film forming and circuit forming device and method, electromagnetic wave shield forming device and method, shortwave high-transmissibility insulation film forming device and method, fluorescent light body film forming device and method, trace material combining device and method, resin molding device, resin molding method, thin film forming device, organic electroluminescence element, bump forming device and method, wiring forming device and method, and wiring structure body

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JP5159595B2 (en) * 2008-12-25 2013-03-06 アピックヤマダ株式会社 Semiconductor device manufacturing equipment
JP5286152B2 (en) * 2009-04-27 2013-09-11 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP5285514B2 (en) * 2009-06-24 2013-09-11 東京エレクトロン株式会社 Template processing apparatus, imprint system, release agent processing method, program, and computer storage medium
JP5285515B2 (en) * 2009-06-24 2013-09-11 東京エレクトロン株式会社 Template processing apparatus, imprint system, release agent processing method, program, and computer storage medium
JP6054698B2 (en) * 2012-10-01 2016-12-27 株式会社クラレ Manufacturing method of fine structure
JP2014157897A (en) * 2013-02-15 2014-08-28 Apic Yamada Corp Resist film formation device and method, conductive film formation and circuit formation device and method, electromagnetic wave shield formation device and method, short wavelength high transmittance insulating film deposition device and method, phosphor deposition device and method, and trace material synthesis device and method
JP6006626B2 (en) * 2012-11-30 2016-10-12 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
JP6333039B2 (en) 2013-05-16 2018-05-30 キヤノン株式会社 Imprint apparatus, device manufacturing method, and imprint method
JP6315904B2 (en) 2013-06-28 2018-04-25 キヤノン株式会社 Imprint method, imprint apparatus, and device manufacturing method
JP6364228B2 (en) * 2014-05-09 2018-07-25 株式会社ブリヂストン Release agent removing method and tire
JP6495594B2 (en) * 2014-08-01 2019-04-03 住友ゴム工業株式会社 Tire mold cleaning method
JP6820237B2 (en) * 2017-06-15 2021-01-27 オリンパス株式会社 Mold release film, optical element molding mold, optical element molding mold manufacturing method, and optical element manufacturing method
JP2020006600A (en) 2018-07-10 2020-01-16 Ｔｏｗａ株式会社 Mold cleaning device and method, resin molding apparatus, and manufacturing method of resin molded article
JP7238555B2 (en) * 2019-04-03 2023-03-14 住友ゴム工業株式会社 Laser cleaning method for mold surface
JP7441511B2 (en) * 2020-09-02 2024-03-01 アピックヤマダ株式会社 Resin sealing device and its cleaning method
CN112497662A (en) * 2020-11-13 2021-03-16 安徽朗迪叶轮机械有限公司 Forming die is used in axial flow fan blade production and processing
KR20220099669A (en) * 2021-01-07 2022-07-14 (주)심플스틱 Cosmetic composition used for skin lifting for anti-aging and method of thermal skin care using the same
JP7506928B2 (en) * 2021-03-22 2024-06-27 將 北川 Mold cleaning method and mold cleaning device
CN113320060B (en) * 2021-04-22 2023-04-25 昆山市益瑞凯包装科技有限公司 Forming device capable of manufacturing lipstick die at multiple stations and application method thereof
CN113517214B (en) * 2021-07-08 2023-06-06 深圳市强生光电科技有限公司 Laser demolding device and demolding method for LED packaging product
WO2023188339A1 (en) * 2022-03-31 2023-10-05 將 北川 Mold cleaning method and mold cleaning device
JP2025136266A (en) * 2024-03-07 2025-09-19 Ｔｏｗａ株式会社 Resin molding device and method for manufacturing resin molded product
JP2025136952A (en) * 2024-03-08 2025-09-19 Ｔｏｗａ株式会社 Spray mechanism, resin molding device, and method for manufacturing resin molded product

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JPS5831293B2 (en) * 1979-03-15 1983-07-05 株式会社日立製作所 Molding mold for insert resin sealing
JPS60250915A (en) * 1984-05-28 1985-12-11 Polyplastics Co How to remove mold deposits
JPH01122417A (en) * 1987-11-06 1989-05-15 Rohm Co Ltd Cleaning method for mold for synthetic resin molding
JPH07136599A (en) * 1993-11-12 1995-05-30 Meiki Co Ltd Metal mold cleaning device
JP3165009B2 (en) * 1995-08-02 2001-05-14 松下電子工業株式会社 Method for manufacturing semiconductor device
SG78282A1 (en) * 1997-12-18 2001-02-20 Advanced Systems Automation A method for removing surface contaminants on moulds used in semiconductor packaging tools
KR19990074698A (en) * 1998-03-13 1999-10-05 윤종용 Mold cleaning device
JP2000102929A (en) * 1998-09-29 2000-04-11 Towa Corp Method for processing mold for molding resin seal of electronic part
JP2000108141A (en) * 1998-10-07 2000-04-18 Shinozaki Seisakusho:Kk Method for removing resin residue from mold and residue removing device
JP2002134535A (en) * 2000-10-19 2002-05-10 Towa Corp Method of semiconductor resin molding
JP4090005B2 (en) * 2001-04-18 2008-05-28 Ｔｏｗａ株式会社 Cleaning method
JP2003043228A (en) * 2001-07-27 2003-02-13 Hitachi Chem Co Ltd Diffuse reflection plate and its transfer pattern, method for manufacturing the same and base film using the same, transfer film, and diffuse reflection plate manufacturing method using these
JP2003251634A (en) * 2002-03-04 2003-09-09 Mitsubishi Rayon Co Ltd Mold for producing fly-eye lens sheet and method for producing the same
JP2004193379A (en) * 2002-12-12 2004-07-08 Apic Yamada Corp Molding metal die and method for manufacturing the same
JP4123983B2 (en) * 2003-03-07 2008-07-23 株式会社竹屋 Pachinko island stand control device
JP2004290750A (en) * 2003-03-26 2004-10-21 National Institute Of Advanced Industrial & Technology Processed wood material having metallic luster and method for producing the same
JP4117681B2 (en) * 2003-11-19 2008-07-16 ブラザー工業株式会社 Mold, punch for pressing, mold manufacturing method and molding method
JP4257848B2 (en) * 2003-12-26 2009-04-22 独立行政法人産業技術総合研究所 Mold and manufacturing method thereof
JP4369764B2 (en) * 2004-01-26 2009-11-25 住友重機械工業株式会社 Mold cleaning device
JP2007321855A (en) * 2006-05-31 2007-12-13 Nsk Ltd Rolling sliding member and rolling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083782A1 (en) * 2012-11-30 2014-06-05 アピックヤマダ株式会社 Resist film forming device and method, conductive film forming and circuit forming device and method, electromagnetic wave shield forming device and method, shortwave high-transmissibility insulation film forming device and method, fluorescent light body film forming device and method, trace material combining device and method, resin molding device, resin molding method, thin film forming device, organic electroluminescence element, bump forming device and method, wiring forming device and method, and wiring structure body

Also Published As

Publication number Publication date
JP5314876B2 (en) 2013-10-16
JP2008149705A (en) 2008-07-03
JP2012206521A (en) 2012-10-25
NL2001029C2 (en) 2010-09-16
KR20080046583A (en) 2008-05-27
KR100916177B1 (en) 2009-09-08

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Legal Events

Date Code Title Description
AD1A A request for search or an international type search has been filed
MM Lapsed because of non-payment of the annual fee

Effective date: 20161201