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NL162816C - METHOD FOR MANUFACTURING A PRESSURE-SWITCHED CARRIER - Google Patents

METHOD FOR MANUFACTURING A PRESSURE-SWITCHED CARRIER

Info

Publication number
NL162816C
NL162816C NL6709035A NL6709035A NL162816C NL 162816 C NL162816 C NL 162816C NL 6709035 A NL6709035 A NL 6709035A NL 6709035 A NL6709035 A NL 6709035A NL 162816 C NL162816 C NL 162816C
Authority
NL
Netherlands
Prior art keywords
manufacturing
pressure
switched carrier
switched
carrier
Prior art date
Application number
NL6709035A
Other languages
Dutch (nl)
Other versions
NL6709035A (en
NL162816B (en
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of NL6709035A publication Critical patent/NL6709035A/xx
Publication of NL162816B publication Critical patent/NL162816B/en
Application granted granted Critical
Publication of NL162816C publication Critical patent/NL162816C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
NL6709035A 1966-06-28 1967-06-28 METHOD FOR MANUFACTURING A PRESSURE-SWITCHED CARRIER NL162816C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56112366A 1966-06-28 1966-06-28

Publications (3)

Publication Number Publication Date
NL6709035A NL6709035A (en) 1967-12-29
NL162816B NL162816B (en) 1980-01-15
NL162816C true NL162816C (en) 1980-06-16

Family

ID=24240722

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6709035A NL162816C (en) 1966-06-28 1967-06-28 METHOD FOR MANUFACTURING A PRESSURE-SWITCHED CARRIER

Country Status (8)

Country Link
JP (3) JPS5110329B1 (en)
AT (2) AT314010B (en)
CH (1) CH504830A (en)
DE (1) DE1665374B1 (en)
ES (1) ES342451A1 (en)
FR (1) FR1605382A (en)
GB (1) GB1186558A (en)
NL (1) NL162816C (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT318048B (en) * 1968-02-09 1974-09-25 Photocircuits Corp Process for the production of electrical circuit boards
JPS5026022B1 (en) * 1970-11-16 1975-08-28
JPS5914882U (en) * 1982-07-19 1984-01-28 川上　規久雄 drainage device
JPS60190403U (en) * 1984-05-30 1985-12-17 川崎製鉄株式会社 Roll cooling device
US4767665A (en) * 1985-09-16 1988-08-30 Seeger Richard E Article formed by electroless plating
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
CA1318416C (en) * 1987-01-14 1993-05-25 Kollmorgen Corporation Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH0748583B2 (en) * 1989-04-03 1995-05-24 喜平 大津 Method for manufacturing electrical inspection jig board for high-density printed wiring board
KR100855528B1 (en) 1998-09-03 2008-09-01 이비덴 가부시키가이샤 Multilayer printed wiring board and method for manufacturing the same
US10765012B2 (en) * 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
JP2025056512A (en) * 2023-09-27 2025-04-08 東洋アルミニウム株式会社 MATERIAL FOR PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
JP2025056521A (en) * 2023-09-27 2025-04-08 東洋アルミニウム株式会社 MATERIAL FOR PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor

Also Published As

Publication number Publication date
JPS5746679B1 (en) 1982-10-05
ES342451A1 (en) 1968-07-16
CH504830A (en) 1971-03-15
GB1186558A (en) 1970-04-02
DE1665374B1 (en) 1971-09-09
JPS5110329B1 (en) 1976-04-03
FR1605382A (en) 1975-02-28
AT314010B (en) 1974-03-11
NL6709035A (en) 1967-12-29
AT310843B (en) 1973-10-25
JPS5031940B1 (en) 1975-10-16
NL162816B (en) 1980-01-15

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
V1 Lapsed because of non-payment of the annual fee