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NL1012004C2 - Werkwijze voor het verplaatsen van wafers alsmede ring. - Google Patents

Werkwijze voor het verplaatsen van wafers alsmede ring. Download PDF

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Publication number
NL1012004C2
NL1012004C2 NL1012004A NL1012004A NL1012004C2 NL 1012004 C2 NL1012004 C2 NL 1012004C2 NL 1012004 A NL1012004 A NL 1012004A NL 1012004 A NL1012004 A NL 1012004A NL 1012004 C2 NL1012004 C2 NL 1012004C2
Authority
NL
Netherlands
Prior art keywords
ring
wafer
space
heat treatment
transport
Prior art date
Application number
NL1012004A
Other languages
English (en)
Dutch (nl)
Inventor
Christianus Gerardus Ma Ridder
Vladimir Ivanovich Kuznetsov
Ernst Hendrik August Granneman
Theodorus Gerardus Oosterlaken
Original Assignee
Asm Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL1012004A priority Critical patent/NL1012004C2/nl
Application filed by Asm Int filed Critical Asm Int
Priority to AU46260/00A priority patent/AU4626000A/en
Priority to CNB008072035A priority patent/CN1157761C/zh
Priority to KR1020017014141A priority patent/KR100667718B1/ko
Priority to US10/009,851 priority patent/US7048488B1/en
Priority to EP00927958A priority patent/EP1177571B1/en
Priority to PCT/NL2000/000297 priority patent/WO2000068977A1/en
Priority to JP2000617480A priority patent/JP4632551B2/ja
Priority to DE60030968T priority patent/DE60030968T2/de
Priority to TW089110988A priority patent/TW452840B/zh
Application granted granted Critical
Publication of NL1012004C2 publication Critical patent/NL1012004C2/nl

Links

Classifications

    • H10P72/0434—
    • H10P72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H10P72/36—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL1012004A 1999-05-07 1999-05-07 Werkwijze voor het verplaatsen van wafers alsmede ring. NL1012004C2 (nl)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL1012004A NL1012004C2 (nl) 1999-05-07 1999-05-07 Werkwijze voor het verplaatsen van wafers alsmede ring.
CNB008072035A CN1157761C (zh) 1999-05-07 2000-05-08 传输晶片的方法,热处理装置和环圈组合
KR1020017014141A KR100667718B1 (ko) 1999-05-07 2000-05-08 웨이퍼 및 링의 운반 방법
US10/009,851 US7048488B1 (en) 1999-05-07 2000-05-08 Apparatus for transferring wafer and ring
AU46260/00A AU4626000A (en) 1999-05-07 2000-05-08 Method for transferring wafers and ring
EP00927958A EP1177571B1 (en) 1999-05-07 2000-05-08 Method for transferring wafers and ring
PCT/NL2000/000297 WO2000068977A1 (en) 1999-05-07 2000-05-08 Method for transferring wafers and ring
JP2000617480A JP4632551B2 (ja) 1999-05-07 2000-05-08 ウエハおよびリングの移送方法、熱処理設備リングの組み合せ、及びウエハとリングのセット
DE60030968T DE60030968T2 (de) 1999-05-07 2000-05-08 Transfermethode für halbleiterscheiben und haltering
TW089110988A TW452840B (en) 1999-05-07 2000-06-05 Method for transferring wafers and ring

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1012004A NL1012004C2 (nl) 1999-05-07 1999-05-07 Werkwijze voor het verplaatsen van wafers alsmede ring.
NL1012004 1999-05-07

Publications (1)

Publication Number Publication Date
NL1012004C2 true NL1012004C2 (nl) 2000-11-13

Family

ID=19769156

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1012004A NL1012004C2 (nl) 1999-05-07 1999-05-07 Werkwijze voor het verplaatsen van wafers alsmede ring.

Country Status (10)

Country Link
US (1) US7048488B1 (ja)
EP (1) EP1177571B1 (ja)
JP (1) JP4632551B2 (ja)
KR (1) KR100667718B1 (ja)
CN (1) CN1157761C (ja)
AU (1) AU4626000A (ja)
DE (1) DE60030968T2 (ja)
NL (1) NL1012004C2 (ja)
TW (1) TW452840B (ja)
WO (1) WO2000068977A1 (ja)

Cited By (1)

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US6877250B2 (en) * 1999-12-29 2005-04-12 Asm International N.V. Apparatus, method and system for the treatment of a wafer

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US6835039B2 (en) 2002-03-15 2004-12-28 Asm International N.V. Method and apparatus for batch processing of wafers in a furnace
US6843201B2 (en) 2002-05-08 2005-01-18 Asm International Nv Temperature control for single substrate semiconductor processing reactor
US7427329B2 (en) 2002-05-08 2008-09-23 Asm International N.V. Temperature control for single substrate semiconductor processing reactor
US7256375B2 (en) 2002-08-30 2007-08-14 Asm International N.V. Susceptor plate for high temperature heat treatment
US6788991B2 (en) 2002-10-09 2004-09-07 Asm International N.V. Devices and methods for detecting orientation and shape of an object
US6950774B2 (en) 2003-01-16 2005-09-27 Asm America, Inc. Out-of-pocket detection system using wafer rotation as an indicator
US20040182315A1 (en) * 2003-03-17 2004-09-23 Tokyo Electron Limited Reduced maintenance chemical oxide removal (COR) processing system
US7033126B2 (en) 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US7410355B2 (en) 2003-10-31 2008-08-12 Asm International N.V. Method for the heat treatment of substrates
US7022627B2 (en) 2003-10-31 2006-04-04 Asm International N.V. Method for the heat treatment of substrates
US6940047B2 (en) 2003-11-14 2005-09-06 Asm International N.V. Heat treatment apparatus with temperature control system
US20060286807A1 (en) * 2005-06-16 2006-12-21 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
US20060004493A1 (en) * 2004-06-30 2006-01-05 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
US7217670B2 (en) 2004-11-22 2007-05-15 Asm International N.V. Dummy substrate for thermal reactor
US9492768B2 (en) * 2005-02-22 2016-11-15 Baldwin Filters, Inc. Filter apparatus
US8057669B2 (en) 2005-02-22 2011-11-15 Baldwin Filters, Inc. Filter element and filter assembly including locking mechanism
JP4755498B2 (ja) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法
US8002463B2 (en) * 2008-06-13 2011-08-23 Asm International N.V. Method and device for determining the temperature of a substrate
US8128819B2 (en) * 2008-06-16 2012-03-06 Baldwin Filters Inc. Fluid filter, fluid filter assembly, and mounting method
US8241493B2 (en) 2008-06-16 2012-08-14 Baldwin Filters, Inc. Filter with ejection mechanism
US8815090B2 (en) * 2008-06-16 2014-08-26 Baldwin Filters, Inc. Filter with water separation device
US20110097491A1 (en) * 2009-10-27 2011-04-28 Levy David H Conveyance system including opposed fluid distribution manifolds
CN102087986B (zh) * 2009-12-04 2012-02-22 无锡华润上华半导体有限公司 晶片传送装置
EP2444993A1 (en) * 2010-10-21 2012-04-25 Applied Materials, Inc. Load lock chamber, substrate processing system and method for venting
CN102569142B (zh) * 2012-02-03 2017-04-26 上海华虹宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
US8991619B2 (en) 2012-03-26 2015-03-31 Baldwin Filters, Inc. Filter assembly with water evacuation and methods
WO2014107412A1 (en) 2013-01-04 2014-07-10 Baldwin Filters, Inc. Three-part end cap and filter element including same
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
US9776905B2 (en) 2014-07-31 2017-10-03 Corning Incorporated Highly strengthened glass article
US11097974B2 (en) 2014-07-31 2021-08-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
US10611664B2 (en) 2014-07-31 2020-04-07 Corning Incorporated Thermally strengthened architectural glass and related systems and methods
US12338159B2 (en) 2015-07-30 2025-06-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
KR101952085B1 (ko) 2016-01-12 2019-05-21 코닝 인코포레이티드 얇은, 열적 및 화학적으로 강화된 유리-계 제품
US11795102B2 (en) 2016-01-26 2023-10-24 Corning Incorporated Non-contact coated glass and related coating system and method
GB2553792A (en) * 2016-09-14 2018-03-21 Rec Solar Pte Ltd Tray for holding at least one wafer
CN110035813A (zh) 2016-10-03 2019-07-19 帕克-汉尼芬公司 带扭锁的过滤元件及组件
CN110769913B (zh) 2017-05-31 2021-11-16 帕克-汉尼芬公司 带有扭锁和/或滑动活塞的过滤元件、组件和方法
US11485673B2 (en) 2017-08-24 2022-11-01 Corning Incorporated Glasses with improved tempering capabilities
KR102538177B1 (ko) * 2017-11-16 2023-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
TWI785156B (zh) 2017-11-30 2022-12-01 美商康寧公司 具有高熱膨脹係數及對於熱回火之優先破裂行為的非離子交換玻璃
KR20210154825A (ko) 2019-04-23 2021-12-21 코닝 인코포레이티드 확정 응력 프로파일을 갖는 유리 라미네이트 및 그 제조방법
KR20220044538A (ko) 2019-08-06 2022-04-08 코닝 인코포레이티드 균열을 저지하기 위한 매장된 응력 스파이크를 갖는 유리 적층물 및 이를 제조하는 방법
US11764101B2 (en) * 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
CN114378751B (zh) * 2020-10-20 2022-11-01 长鑫存储技术有限公司 晶圆用承载环的安装夹具

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EP0821403A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Semiconductor wafer support with graded thermal mass

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6877250B2 (en) * 1999-12-29 2005-04-12 Asm International N.V. Apparatus, method and system for the treatment of a wafer

Also Published As

Publication number Publication date
KR100667718B1 (ko) 2007-01-15
EP1177571A1 (en) 2002-02-06
TW452840B (en) 2001-09-01
CN1157761C (zh) 2004-07-14
CN1349656A (zh) 2002-05-15
JP2002544664A (ja) 2002-12-24
KR20010112476A (ko) 2001-12-20
WO2000068977A1 (en) 2000-11-16
US7048488B1 (en) 2006-05-23
DE60030968T2 (de) 2007-05-03
JP4632551B2 (ja) 2011-02-16
EP1177571B1 (en) 2006-09-27
DE60030968D1 (de) 2006-11-09
AU4626000A (en) 2000-11-21

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