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MY8600544A - A semiconductor device and a process for producing the same - Google Patents

A semiconductor device and a process for producing the same

Info

Publication number
MY8600544A
MY8600544A MY544/86A MY8600544A MY8600544A MY 8600544 A MY8600544 A MY 8600544A MY 544/86 A MY544/86 A MY 544/86A MY 8600544 A MY8600544 A MY 8600544A MY 8600544 A MY8600544 A MY 8600544A
Authority
MY
Malaysia
Prior art keywords
producing
same
semiconductor device
semiconductor
Prior art date
Application number
MY544/86A
Other languages
English (en)
Inventor
Kouichi Nagasawa
Yoshio Sakai
Osamu Minato
Toshiaki Masuhara
Satoshi Meguro
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of MY8600544A publication Critical patent/MY8600544A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/15—Static random access memory [SRAM] devices comprising a resistor load element
    • H10D64/0113—
    • H10W20/0698—
    • H10W20/40—
    • H10W20/4451—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903—FET configuration adapted for use as static memory cell
MY544/86A 1980-08-15 1986-12-30 A semiconductor device and a process for producing the same MY8600544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11170580A JPS5736844A (en) 1980-08-15 1980-08-15 Semiconductor device

Publications (1)

Publication Number Publication Date
MY8600544A true MY8600544A (en) 1986-12-31

Family

ID=14568057

Family Applications (1)

Application Number Title Priority Date Filing Date
MY544/86A MY8600544A (en) 1980-08-15 1986-12-30 A semiconductor device and a process for producing the same

Country Status (6)

Country Link
US (2) US4792841A (xx)
JP (1) JPS5736844A (xx)
DE (1) DE3131240A1 (xx)
GB (2) GB2082387B (xx)
HK (1) HK44286A (xx)
MY (1) MY8600544A (xx)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0618213B2 (ja) * 1982-06-25 1994-03-09 松下電子工業株式会社 半導体装置の製造方法
JPS5919354A (ja) * 1982-07-24 1984-01-31 Fujitsu Ltd 半導体装置
GB2131604B (en) * 1982-12-03 1986-01-29 Itt Ind Ltd Semiconductor memories
JPS607172A (ja) * 1983-06-24 1985-01-14 Mitsubishi Electric Corp 半導体メモリセル
DE3572423D1 (en) * 1984-11-02 1989-09-21 Hitachi Ltd Semiconductor device having a polycrystalline silicon interconnection layer and method for its manufacture
US4740479A (en) * 1985-07-05 1988-04-26 Siemens Aktiengesellschaft Method for the manufacture of cross-couplings between n-channel and p-channel CMOS field effect transistors of static write-read memories
JPH062349B2 (ja) * 1985-11-25 1994-01-12 松下電工株式会社 樹脂含浸シ−ト状材料の製法およびその実施に用いる装置
JPS63239674A (ja) * 1987-03-27 1988-10-05 Hitachi Ltd ダイナミツク型ｒａｍ
JPH0680733B2 (ja) * 1987-11-12 1994-10-12 株式会社東芝 半導体装置の配線接続部
US5194749A (en) * 1987-11-30 1993-03-16 Hitachi, Ltd. Semiconductor integrated circuit device
JPH01147829A (ja) * 1987-12-04 1989-06-09 Toshiba Corp 半導体装置の製造方法
US5166763A (en) * 1988-07-20 1992-11-24 Mitsubishi Denki Kabushiki Kaisha Static type semiconductor memory device and method of manufacturing thereof
US5200918A (en) * 1988-07-20 1993-04-06 Mitsubishi Denki Kabushiki Kaisha Static semiconductor memory with polysilicon source drain transistors
US5068707A (en) * 1990-05-02 1991-11-26 Nec Electronics Inc. DRAM memory cell with tapered capacitor electrodes
US5225376A (en) * 1990-05-02 1993-07-06 Nec Electronics, Inc. Polysilicon taper process using spin-on glass
US5210429A (en) * 1990-06-29 1993-05-11 Sharp Kabushiki Kaisha Static RAM cell with conductive straps formed integrally with thin film transistor gates
EP0465170B1 (en) * 1990-06-29 1997-01-08 Sharp Kabushiki Kaisha Static RAM cell
KR920010633A (ko) * 1990-11-30 1992-06-26 김광호 반도체 메모리 장치의 기준전압 발생회로
EP0501884B1 (en) * 1991-03-01 1999-04-28 Fujitsu Limited Semiconductor memory device having thin film transistor and method of producing the same
EP0504006B1 (en) * 1991-03-08 2000-07-12 Fujitsu Limited Semiconductor memory device having thin film transistor and method of producing the same
JP2675713B2 (ja) * 1991-05-10 1997-11-12 株式会社東芝 半導体装置及びその製造方法
US5128738A (en) * 1991-05-16 1992-07-07 At&T Bell Laboratories Integrated circuit
US5204279A (en) * 1991-06-03 1993-04-20 Sgs-Thomson Microelectronics, Inc. Method of making SRAM cell and structure with polycrystalline p-channel load devices
KR940006676B1 (ko) * 1991-10-14 1994-07-25 삼성전자 주식회사 시험회로를 내장한 기억용 반도체 집적회로
US5705437A (en) * 1996-09-25 1998-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Trench free process for SRAM
US6549447B1 (en) * 2001-10-31 2003-04-15 Peter Fricke Memory cell structure
US6707087B2 (en) 2002-06-21 2004-03-16 Hewlett-Packard Development Company, L.P. Structure of chalcogenide memory element

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321989B2 (xx) * 1973-10-12 1978-07-06
JPS522166A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Method of pulling out wiring from highly inpure dope layer
JPS5286083A (en) * 1976-01-12 1977-07-16 Hitachi Ltd Production of complimentary isolation gate field effect transistor
JPS5414690A (en) * 1977-07-06 1979-02-03 Hitachi Ltd Semiconductor device and its manufacture
JPS5363982A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Production of silicon gate type mis semiconductor
US4125854A (en) * 1976-12-02 1978-11-14 Mostek Corporation Symmetrical cell layout for static RAM
JPS583380B2 (ja) * 1977-03-04 1983-01-21 株式会社日立製作所 半導体装置とその製造方法
US4123300A (en) * 1977-05-02 1978-10-31 International Business Machines Corporation Integrated circuit process utilizing lift-off techniques
US4234889A (en) * 1977-05-31 1980-11-18 Texas Instruments Incorporated Metal-to-moat contacts in N-channel silicon gate integrated circuits using discrete second-level polycrystalline silicon
JPS5440580A (en) * 1977-09-07 1979-03-30 Hitachi Ltd Wiring contact structure of semiconductor device
JPS5910581B2 (ja) * 1977-12-01 1984-03-09 富士通株式会社 半導体装置の製造方法
JPS54111792A (en) * 1978-02-22 1979-09-01 Hitachi Ltd Semiconductor device and its manufacture
US4178674A (en) * 1978-03-27 1979-12-18 Intel Corporation Process for forming a contact region between layers of polysilicon with an integral polysilicon resistor
JPS559490A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Production method of insulating gate type semiconductor device
US4198695A (en) * 1978-07-19 1980-04-15 Texas Instruments Incorporated Static semiconductor memory cell using data lines for voltage supply
DE2947311C2 (de) * 1978-11-24 1982-04-01 Hitachi, Ltd., Tokyo Integrierte Halbleiterschaltung
US4246593A (en) * 1979-01-02 1981-01-20 Texas Instruments Incorporated High density static memory cell with polysilicon resistors
US4475964A (en) * 1979-02-20 1984-10-09 Tokyo Shibaura Denki Kabushiki Kaisha Method of manufacturing a semiconductor device
JPS55156370A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Manufacture of semiconductor device
JPS5572069A (en) * 1979-06-12 1980-05-30 Hitachi Ltd Semiconductor device
US4291322A (en) * 1979-07-30 1981-09-22 Bell Telephone Laboratories, Incorporated Structure for shallow junction MOS circuits
US4453175A (en) * 1979-09-19 1984-06-05 Tokyo Shibaura Denki Kabushiki Kaisha MOS Static RAM layout with polysilicon resistors over FET gates
US4395723A (en) * 1980-05-27 1983-07-26 Eliyahou Harari Floating substrate dynamic RAM cell with lower punch-through means
DE3123348A1 (de) * 1980-06-19 1982-03-18 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Halbleiterbaustein und verfahren zu dessen herstellung
JPS57130461A (en) * 1981-02-06 1982-08-12 Hitachi Ltd Semiconductor memory storage
EP0077813B1 (en) * 1981-05-04 1986-02-05 Motorola, Inc. Low resistivity composite metallization for semiconductor devices and method therefor

Also Published As

Publication number Publication date
GB2082387A (en) 1982-03-03
US4792841A (en) 1988-12-20
HK44286A (en) 1986-06-27
GB2141871A (en) 1985-01-03
GB2082387B (en) 1985-07-31
JPS5736844A (en) 1982-02-27
GB8403595D0 (en) 1984-03-14
US5028975A (en) 1991-07-02
DE3131240A1 (de) 1982-06-09

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