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MY8100339A - A method of electrically connecting an integrated circuit component to circuitry on a substrate - Google Patents

A method of electrically connecting an integrated circuit component to circuitry on a substrate

Info

Publication number
MY8100339A
MY8100339A MY339/81A MY8100339A MY8100339A MY 8100339 A MY8100339 A MY 8100339A MY 339/81 A MY339/81 A MY 339/81A MY 8100339 A MY8100339 A MY 8100339A MY 8100339 A MY8100339 A MY 8100339A
Authority
MY
Malaysia
Prior art keywords
circuitry
substrate
integrated circuit
electrically connecting
circuit component
Prior art date
Application number
MY339/81A
Original Assignee
Suwa Seikosha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha Kk filed Critical Suwa Seikosha Kk
Publication of MY8100339A publication Critical patent/MY8100339A/en

Links

Classifications

    • H10W20/40—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/352—
    • H10W90/724—
MY339/81A 1975-12-26 1981-12-30 A method of electrically connecting an integrated circuit component to circuitry on a substrate MY8100339A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50157565A JPS5279773A (en) 1975-12-26 1975-12-26 Bonding method of ic

Publications (1)

Publication Number Publication Date
MY8100339A true MY8100339A (en) 1981-12-31

Family

ID=15652450

Family Applications (1)

Application Number Title Priority Date Filing Date
MY339/81A MY8100339A (en) 1975-12-26 1981-12-30 A method of electrically connecting an integrated circuit component to circuitry on a substrate

Country Status (5)

Country Link
JP (1) JPS5279773A (en)
DE (1) DE2658302A1 (en)
GB (1) GB1525148A (en)
HK (1) HK8681A (en)
MY (1) MY8100339A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015100B1 (en) 1979-02-26 1983-08-17 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
JPS56114302A (en) * 1980-02-04 1981-09-08 Rte Corp Arrester block assembly
FR2492164B1 (en) * 1980-10-15 1987-01-23 Radiotechnique Compelec METHOD FOR THE SIMULTANEOUS REALIZATION OF MULTIPLE ELECTRICAL LINKS, PARTICULARLY FOR THE ELECTRICAL CONNECTION OF A SEMICONDUCTOR MICRO-WAFER
JPS609349B2 (en) * 1980-10-20 1985-03-09 三菱電機株式会社 Dynamic random access semiconductor memory device
FR2618254B1 (en) * 1987-07-16 1990-01-05 Thomson Semiconducteurs METHOD AND STRUCTURE FOR TAKING CONTACT ON INTEGRATED CIRCUIT PLOTS.
US5074947A (en) * 1989-12-18 1991-12-24 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
DE4032397A1 (en) * 1990-10-12 1992-04-16 Bosch Gmbh Robert METHOD FOR PRODUCING A HYBRID SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE PRODUCED BY THE METHOD
US6077725A (en) * 1992-09-03 2000-06-20 Lucent Technologies Inc Method for assembling multichip modules
DE69421539T2 (en) * 1993-08-17 2000-05-25 Pfc Corp., Billerica METHOD FOR SHAPING ELECTRICALLY CONDUCTING POLYMER COMPOUNDS ON ELECTRONIC SUBSTRATES
US6221752B1 (en) * 1998-08-20 2001-04-24 United Microelectronics Corp. Method of mending erosion of bonding pad

Also Published As

Publication number Publication date
GB1525148A (en) 1978-09-20
DE2658302A1 (en) 1977-07-07
JPS5279773A (en) 1977-07-05
HK8681A (en) 1981-03-20

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