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MY209317A - A blade gripping tool and methods for attaching and detaching cutting blade thereof - Google Patents

A blade gripping tool and methods for attaching and detaching cutting blade thereof

Info

Publication number
MY209317A
MY209317A MYPI2020005829A MYPI2020005829A MY209317A MY 209317 A MY209317 A MY 209317A MY PI2020005829 A MYPI2020005829 A MY PI2020005829A MY PI2020005829 A MYPI2020005829 A MY PI2020005829A MY 209317 A MY209317 A MY 209317A
Authority
MY
Malaysia
Prior art keywords
blade
gripping tool
attaching
cutting blade
methods
Prior art date
Application number
MYPI2020005829A
Other languages
English (en)
Inventor
Yamamoto Naoko
NAKAGAWA Shun
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY209317A publication Critical patent/MY209317A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/026—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade carried by a movable arm, e.g. pivoted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Details Of Cutting Devices (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
MYPI2020005829A 2019-11-27 2020-11-06 A blade gripping tool and methods for attaching and detaching cutting blade thereof MY209317A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019214544A JP7465078B2 (ja) 2019-11-27 2019-11-27 ブレード把持具

Publications (1)

Publication Number Publication Date
MY209317A true MY209317A (en) 2025-07-02

Family

ID=75996495

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020005829A MY209317A (en) 2019-11-27 2020-11-06 A blade gripping tool and methods for attaching and detaching cutting blade thereof

Country Status (6)

Country Link
JP (1) JP7465078B2 (zh)
KR (1) KR102861873B1 (zh)
CN (1) CN112847856A (zh)
MY (1) MY209317A (zh)
SG (1) SG10202011111SA (zh)
TW (1) TWI869491B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115194875B (zh) * 2022-06-30 2025-11-25 江苏通用半导体有限公司 一种晶圆圆切装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0717443U (ja) * 1993-08-31 1995-03-28 株式会社ディスコ ブレードオートチェンジャー
JP2002219648A (ja) * 2001-01-24 2002-08-06 Disco Abrasive Syst Ltd ブレードの装着方法及び切削装置
TWI270429B (en) * 2002-08-29 2007-01-11 Nippon Light Metal Co Method of joining members, method of joining metallic members, radiation member, process for manufacturing the same, jig for the manufacturing and heat sink
KR20040023064A (ko) * 2002-09-10 2004-03-18 현대자동차주식회사 절삭공구의 고정방법 및 이에 사용되는 장치
CN2748217Y (zh) * 2004-06-29 2005-12-28 漳州升源机械工业有限公司 刀杆加热装置
WO2007042104A2 (de) * 2005-10-14 2007-04-19 P + L Gmbh & Co. Kg Vorrichtung und verfahren zum lösbaren spannen eines werkzeugs an einer spindelwelle einer werkzeugmaschine
JP5014892B2 (ja) * 2007-06-25 2012-08-29 株式会社ディスコ ブレード交換工具
JP2009241177A (ja) 2008-03-28 2009-10-22 Disco Abrasive Syst Ltd ブレード交換工具
CN105014135A (zh) * 2014-04-22 2015-11-04 庄增信 可快速替换刀具夹持件的铣床刀杆装置
WO2015161435A1 (zh) * 2014-04-22 2015-10-29 庄增信 可快速替换刀具夹持件的铣床刀杆装置
CN104275676B (zh) * 2014-10-27 2016-03-16 中航工业哈尔滨轴承有限公司 一种角接触球轴承无损拆套方法
JP6698436B2 (ja) * 2016-06-14 2020-05-27 株式会社ディスコ ブレードケース
CN105935892A (zh) * 2016-06-17 2016-09-14 台州市恒大刀刃具有限公司 用于夹紧刀具的夹头
CN110216613A (zh) * 2018-03-02 2019-09-10 山东科瑞泵业有限公司 井下工具安装用摩擦夹紧装置
JP7126749B2 (ja) * 2018-03-19 2022-08-29 株式会社ディスコ 切削装置
JP6657553B2 (ja) * 2018-10-17 2020-03-04 株式会社東京精密 ブレード着脱装置及びブレード着脱方法

Also Published As

Publication number Publication date
CN112847856A (zh) 2021-05-28
JP2021084171A (ja) 2021-06-03
KR102861873B1 (ko) 2025-09-18
TW202120230A (zh) 2021-06-01
KR20210065846A (ko) 2021-06-04
TWI869491B (zh) 2025-01-11
JP7465078B2 (ja) 2024-04-10
SG10202011111SA (en) 2021-06-29

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