MY190168A - Method of manufacturing tin-plated copper terminal material - Google Patents
Method of manufacturing tin-plated copper terminal materialInfo
- Publication number
- MY190168A MY190168A MYPI2018702110A MYPI2018702110A MY190168A MY 190168 A MY190168 A MY 190168A MY PI2018702110 A MYPI2018702110 A MY PI2018702110A MY PI2018702110 A MYPI2018702110 A MY PI2018702110A MY 190168 A MY190168 A MY 190168A
- Authority
- MY
- Malaysia
- Prior art keywords
- tin
- zinc
- copper
- layer
- nickel alloy
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052802 copper Inorganic materials 0.000 title abstract 4
- 239000010949 copper Substances 0.000 title abstract 4
- 239000000463 material Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 4
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 abstract 4
- 238000007747 plating Methods 0.000 abstract 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C18/00—Alloys based on zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A method of manufacturing tin-plated copper terminal material (1) as a terminal (10) crimped to a terminal end of an electric wire (12) made of an aluminum wire material, using a base member (2) of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer (4) having a nickel content of 5 mass% to 50 mass% inclusive and a thickness of 0.1 ?m to 5.0 ?m inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer (5) by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40?C to 160?C inclusive for 30 minutes or longer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015244311 | 2015-12-15 | ||
| JP2016150740A JP6226037B2 (en) | 2015-12-15 | 2016-07-29 | Manufacturing method of copper terminal material with tin plating |
| PCT/JP2016/087137 WO2017104682A1 (en) | 2015-12-15 | 2016-12-14 | Method for manufacturing tin-plated copper terminal material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY190168A true MY190168A (en) | 2022-03-31 |
Family
ID=59056761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2018702110A MY190168A (en) | 2015-12-15 | 2016-12-14 | Method of manufacturing tin-plated copper terminal material |
Country Status (2)
| Country | Link |
|---|---|
| MY (1) | MY190168A (en) |
| WO (1) | WO2017104682A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3660190A4 (en) * | 2017-07-28 | 2021-04-28 | Mitsubishi Materials Corporation | Tin plated copper terminal material, terminal, and wire end structure |
| JP6489257B1 (en) * | 2018-03-14 | 2019-03-27 | 日立金属株式会社 | Tin-plated copper wire, method of manufacturing the same, insulated wire, cable |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0841681A (en) * | 1994-07-25 | 1996-02-13 | Kobe Steel Ltd | Production of nickel-zinc alloy-plated steel sheet |
| JP3953169B2 (en) * | 1997-12-26 | 2007-08-08 | 株式会社神戸製鋼所 | Manufacturing method of plating material for mating type connection terminal |
| JP2000144482A (en) * | 1998-09-11 | 2000-05-26 | Nippon Mining & Metals Co Ltd | Metal material |
| JP2000169996A (en) * | 1998-09-28 | 2000-06-20 | Nippon Mining & Metals Co Ltd | Metallic material |
| JP4043834B2 (en) * | 2002-05-02 | 2008-02-06 | 古河電気工業株式会社 | Plating material, manufacturing method thereof, and electric / electronic parts using the same |
| JP2013227630A (en) * | 2012-04-26 | 2013-11-07 | Autonetworks Technologies Ltd | Plated terminal for connector |
| JP2014164927A (en) * | 2013-02-23 | 2014-09-08 | Furukawa Electric Co Ltd:The | Crimp terminal and connection structure |
-
2016
- 2016-12-14 MY MYPI2018702110A patent/MY190168A/en unknown
- 2016-12-14 WO PCT/JP2016/087137 patent/WO2017104682A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017104682A1 (en) | 2017-06-22 |
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