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MY198933A - First protective film forming sheet - Google Patents

First protective film forming sheet

Info

Publication number
MY198933A
MY198933A MYPI2019001552A MYPI2019001552A MY198933A MY 198933 A MY198933 A MY 198933A MY PI2019001552 A MYPI2019001552 A MY PI2019001552A MY PI2019001552 A MYPI2019001552 A MY PI2019001552A MY 198933 A MY198933 A MY 198933A
Authority
MY
Malaysia
Prior art keywords
test piece
buffer layer
distortion
curable resin
resin film
Prior art date
Application number
MYPI2019001552A
Other languages
English (en)
Inventor
Masanori Yamagishi
Issei ADACHI
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY198933A publication Critical patent/MY198933A/en

Links

Classifications

    • H10W74/01—
    • H10P52/00—
    • H10W72/30—
    • H10W72/90—
    • H10W72/012—

Landscapes

  • Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Moving Of The Head To Find And Align With The Track (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
MYPI2019001552A 2016-10-05 2017-09-08 First protective film forming sheet MY198933A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016197523 2016-10-05
PCT/JP2017/032468 WO2018066302A1 (ja) 2016-10-05 2017-09-08 第１保護膜形成用シート

Publications (1)

Publication Number Publication Date
MY198933A true MY198933A (en) 2023-10-03

Family

ID=61830909

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001552A MY198933A (en) 2016-10-05 2017-09-08 First protective film forming sheet

Country Status (8)

Country Link
JP (1) JP6344811B1 (zh)
KR (1) KR102412725B1 (zh)
CN (1) CN109791887B (zh)
MY (1) MY198933A (zh)
PH (1) PH12019500713A1 (zh)
SG (1) SG11201902955QA (zh)
TW (1) TWI649195B (zh)
WO (1) WO2018066302A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108821231B (zh) * 2018-06-26 2019-08-09 清华大学 一种基于力学原理的表面具有微结构的高弹性基体及方法
JP2020063362A (ja) * 2018-10-17 2020-04-23 住友ベークライト株式会社 湿式摩擦材用接着剤組成物
JP6859376B2 (ja) * 2019-01-22 2021-04-14 グンゼ株式会社 カバーフィルム
JP6697603B1 (ja) * 2019-03-27 2020-05-20 グンゼ株式会社 カバーフィルム
CN114930503A (zh) * 2019-12-27 2022-08-19 琳得科株式会社 套件及半导体芯片的制造方法
WO2021171898A1 (ja) * 2020-02-27 2021-09-02 リンテック株式会社 保護膜形成用シート、保護膜付きチップの製造方法、及び積層物
JP7614781B2 (ja) * 2020-10-19 2025-01-16 日東電工株式会社 半導体装置の製造方法
KR20240136335A (ko) * 2022-01-12 2024-09-13 린텍 가부시키가이샤 제1 보호막 형성용 시트, 반도체 장치의 제조 방법, 및 시트의 사용

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5830250B2 (ja) * 2011-02-15 2015-12-09 日東電工株式会社 半導体装置の製造方法
JP5666335B2 (ja) 2011-02-15 2015-02-12 日東電工株式会社 保護層形成用フィルム
JP2013004872A (ja) * 2011-06-20 2013-01-07 Hitachi Chem Co Ltd 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
JP5944155B2 (ja) * 2011-12-12 2016-07-05 日東電工株式会社 積層シート、及び、積層シートを用いた半導体装置の製造方法
JP6059499B2 (ja) * 2012-10-05 2017-01-11 リンテック株式会社 表面保護シート
KR20140069508A (ko) * 2012-11-29 2014-06-10 제일모직주식회사 반도체 웨이퍼 표면 보호용 점착 필름
TWI600740B (zh) * 2012-11-30 2017-10-01 琳得科股份有限公司 Sheet having a curable resin film-forming layer, and method of manufacturing the semiconductor device using the same
JP5950869B2 (ja) * 2013-06-20 2016-07-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
KR101634064B1 (ko) * 2013-09-30 2016-06-27 린텍 가부시키가이샤 수지막 형성용 복합 시트
JP2015084352A (ja) * 2013-10-25 2015-04-30 東レ株式会社 回路部材接着用積層シートおよび半導体装置の製造方法
CN105765699A (zh) * 2013-11-22 2016-07-13 琳得科株式会社 切割片用基材膜及基材膜的制造方法
JP6419728B2 (ja) * 2014-01-21 2018-11-07 リンテック株式会社 ウエハ保護用粘着シート
JP6322013B2 (ja) * 2014-03-20 2018-05-09 リンテック株式会社 粘着シート
JP6347657B2 (ja) 2014-04-22 2018-06-27 デクセリアルズ株式会社 保護テープ、及びこれを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
KR102412725B1 (ko) 2022-06-23
SG11201902955QA (en) 2019-05-30
KR20190056385A (ko) 2019-05-24
TWI649195B (zh) 2019-02-01
WO2018066302A1 (ja) 2018-04-12
CN109791887B (zh) 2023-04-28
CN109791887A (zh) 2019-05-21
JP6344811B1 (ja) 2018-06-20
JPWO2018066302A1 (ja) 2018-10-04
PH12019500713A1 (en) 2019-11-11
TW201821270A (zh) 2018-06-16

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