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MY173457A - Semiconductor device measurement method - Google Patents

Semiconductor device measurement method

Info

Publication number
MY173457A
MY173457A MYPI2016700330A MYPI2016700330A MY173457A MY 173457 A MY173457 A MY 173457A MY PI2016700330 A MYPI2016700330 A MY PI2016700330A MY PI2016700330 A MYPI2016700330 A MY PI2016700330A MY 173457 A MY173457 A MY 173457A
Authority
MY
Malaysia
Prior art keywords
sheet
adhered
semiconductor devices
temperature measurement
semiconductor device
Prior art date
Application number
MYPI2016700330A
Inventor
Ito Tomoaki
Original Assignee
Tesec Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesec Kk filed Critical Tesec Kk
Publication of MY173457A publication Critical patent/MY173457A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dicing (AREA)

Abstract

Electrical characteristics of a plurality of semiconductor devices can efficiently be measured in a high-temperature measurement environment. A sheet (11) adhered on a ring frame (12) is heated and then cooled by using a sheet preheating apparatus (3). After that, a measurement apparatus (6) measures the electrical characteristics of a plurality of semiconductor devices (14) adhered on the sheet (11) in a high-temperature measurement environment. Since the sheet (11) is heated and cooled in advance, the sheet (11) is expanded with no slack. Even when the sheet (11) is placed in the high-temperature measurement environment after that, therefore, expansion of the sheet (11) by heat is suppressed. Accordingly, the positions and angles of the plurality of semiconductor devices (14) adhered on the sheet (11) are not changed but maintained.
MYPI2016700330A 2015-02-03 2016-01-29 Semiconductor device measurement method MY173457A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015019112A JP6626254B2 (en) 2015-02-03 2015-02-03 Semiconductor device measurement method

Publications (1)

Publication Number Publication Date
MY173457A true MY173457A (en) 2020-01-26

Family

ID=56570172

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016700330A MY173457A (en) 2015-02-03 2016-01-29 Semiconductor device measurement method

Country Status (5)

Country Link
JP (1) JP6626254B2 (en)
CN (1) CN105842601A (en)
MY (1) MY173457A (en)
PH (1) PH12016000039B1 (en)
TW (1) TWI588500B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754065B (en) * 2017-06-23 2022-02-01 日商三井化學東賽璐股份有限公司 Parts manufacturing apparatus and parts manufacturing method
US11573266B2 (en) * 2019-12-30 2023-02-07 Texas Instruments Incorporated Electronic device temperature test on strip film frames
JP7759759B2 (en) * 2021-10-11 2025-10-24 三井化学Ictマテリア株式会社 Electronic component manufacturing apparatus and electronic component manufacturing method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4968657A (en) * 1972-11-06 1974-07-03
JPS59120423A (en) * 1982-12-28 1984-07-12 Nitto Electric Ind Co Ltd Manufacture of slide sheet
CA2101293C (en) * 1992-08-05 2004-06-29 David A. Nicholas Articulating endoscopic surgical apparatus
JP3410202B2 (en) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 Adhesive sheet for attaching wafer and method for manufacturing semiconductor device using the same
JP2837829B2 (en) * 1995-03-31 1998-12-16 松下電器産業株式会社 Inspection method for semiconductor device
JP3496347B2 (en) * 1995-07-13 2004-02-09 株式会社デンソー Semiconductor device and manufacturing method thereof
US8076216B2 (en) * 2008-11-11 2011-12-13 Advanced Inquiry Systems, Inc. Methods and apparatus for thinning, testing and singulating a semiconductor wafer
CN100334690C (en) * 2002-03-27 2007-08-29 三井化学株式会社 Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
JP4471563B2 (en) * 2002-10-25 2010-06-02 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
WO2005103731A1 (en) * 2004-04-27 2005-11-03 Jsr Corporation Sheet-shaped probe, manufacturing method thereof and application thereof
JP4721834B2 (en) * 2005-09-06 2011-07-13 日東電工株式会社 Adhesive sheet and product processing method using the adhesive sheet
JP2007101373A (en) * 2005-10-05 2007-04-19 Renesas Technology Corp Probe sheet bonding holder, probe card, semiconductor inspection device, and method of manufacturing semiconductor device
JP2007178132A (en) * 2005-12-27 2007-07-12 Matsushita Electric Ind Co Ltd Semiconductor inspection apparatus and semiconductor inspection method
JP4781185B2 (en) * 2006-07-18 2011-09-28 日東電工株式会社 Heat-resistant dicing tape or sheet
JP5313036B2 (en) * 2009-05-11 2013-10-09 株式会社ディスコ How to expand adhesive tape
TWI518340B (en) * 2009-08-27 2016-01-21 李諾工業股份有限公司 Socket for testing semiconductor chip
JP2011077482A (en) * 2009-10-02 2011-04-14 Disco Abrasive Syst Ltd Tape expanding device
US8710859B2 (en) * 2011-09-23 2014-04-29 Powertech Technology Inc. Method for testing multi-chip stacked packages
JP2014229635A (en) * 2013-05-17 2014-12-08 株式会社東芝 Semiconductor inspection method and semiconductor inspection device
WO2014199993A1 (en) * 2013-06-14 2014-12-18 電気化学工業株式会社 Heat-resistant adhesive sheet for semiconductor inspection

Also Published As

Publication number Publication date
PH12016000039A1 (en) 2018-01-29
TWI588500B (en) 2017-06-21
JP2016142649A (en) 2016-08-08
JP6626254B2 (en) 2019-12-25
TW201631324A (en) 2016-09-01
CN105842601A (en) 2016-08-10
PH12016000039B1 (en) 2018-12-21

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