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MY162473A - A laser apparatus and a method of directing laser to a workpiece surface - Google Patents

A laser apparatus and a method of directing laser to a workpiece surface

Info

Publication number
MY162473A
MY162473A MYPI2013002052A MYPI2013002052A MY162473A MY 162473 A MY162473 A MY 162473A MY PI2013002052 A MYPI2013002052 A MY PI2013002052A MY PI2013002052 A MYPI2013002052 A MY PI2013002052A MY 162473 A MY162473 A MY 162473A
Authority
MY
Malaysia
Prior art keywords
laser
workpiece surface
directing
emitting device
imaging device
Prior art date
Application number
MYPI2013002052A
Inventor
Man Chan
Gang Ou
Yu Sze Cheung
Kai Fung Lau
Zhuanyun Zhang
Hua Zhang
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of MY162473A publication Critical patent/MY162473A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

DISCLOSED IS A LASER APPARATUS (200) COMPRISING: I) AN IMAGING DEVICE (202) HAVING AN OPTICAL PATH FOR CAPTURING AN IMAGE OF A WORKPIECE SURFACE; II) AN LASER-EMITTING DEVICE (204, 206) CONFIGURED TO DIRECT LASER ALONG A LASER PATH (210) TO THE WORKPIECE SURFACE, THE LASER PATH (210) OF THE LASER-EMITTING DEVICE (204, 206) BEING SEPARATE FROM THE OPTICAL PATH (214) OF THE IMAGING DEVICE (202); AND III) A CONTROLLER (208) COUPLED TO THE IMAGING DEVICE (202) AND THE LASER-EMITTING DEVICE (204, 206), THE CONTROLLER (208) BEING CONFIGURED TO ADJUST THE LASER PATH (210) OF THE LASER-EMITTING DEVICE (204, 206) BASED ON AN IMAGE OF THE WORKPIECE SURFACE AS CAPTURED BY THE IMAGING DEVICE (202). A METHOD OF DIRECTING LASER TO A WORKPIECE SURFACE IS ALSO DISCLOSED. [FIG. 2B]
MYPI2013002052A 2012-06-19 2013-06-05 A laser apparatus and a method of directing laser to a workpiece surface MY162473A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210209891.2A CN103506757B (en) 2012-06-19 2012-06-19 For by laser alignment in the laser aid of surface of the work and method

Publications (1)

Publication Number Publication Date
MY162473A true MY162473A (en) 2017-06-15

Family

ID=49890470

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002052A MY162473A (en) 2012-06-19 2013-06-05 A laser apparatus and a method of directing laser to a workpiece surface

Country Status (4)

Country Link
KR (1) KR101561895B1 (en)
CN (1) CN103506757B (en)
MY (1) MY162473A (en)
TW (1) TWI592239B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104439698B (en) * 2014-11-26 2016-08-24 北京凌云光技术有限责任公司 Scaling method and device for laser-processing system
US10324126B2 (en) * 2016-06-10 2019-06-18 Asm Technology Singapore Pte Ltd. Method and apparatus for aligning probe pins with respect to positions of electronic devices
US10615044B1 (en) * 2018-10-18 2020-04-07 Asm Technology Singapore Pte Ltd Material cutting using laser pulses
DE102018219129B3 (en) * 2018-11-09 2019-11-07 Trumpf Laser Gmbh Method and computer program product for OCT measurement beam adjustment
TWI692683B (en) * 2018-12-19 2020-05-01 國立臺北科技大學 Automation control system and method
JP6795060B1 (en) * 2019-07-11 2020-12-02 オムロン株式会社 Control device and laser machining system equipped with it, laser machining method
CN110497075B (en) * 2019-09-18 2024-09-27 中国科学院福建物质结构研究所 Galvanometer correction system and galvanometer correction method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3399590B2 (en) * 1993-08-04 2003-04-21 富士通株式会社 Wiring cutting device
JP4124409B2 (en) * 2001-09-18 2008-07-23 株式会社日立製作所 Electron beam welding apparatus and welding method
JP2004148379A (en) * 2002-10-31 2004-05-27 Sunx Ltd System and method for laser marking
CN1269609C (en) * 2003-09-18 2006-08-16 郑州大学 On-line laser stamping machine
CN1640607A (en) * 2004-01-02 2005-07-20 上海工程技术大学 Thin-plate laser cutting-welding machine workpiece positioning photoelectric measuring and controlling device
CN101209641A (en) * 2006-12-29 2008-07-02 深圳富泰宏精密工业有限公司 Laser engraving system and method
CN102211250A (en) * 2010-04-08 2011-10-12 深圳市大族激光科技股份有限公司 Laser processing method and system
CN201721134U (en) * 2010-06-04 2011-01-26 深圳市大族激光科技股份有限公司 Near wavelength coaxial positioning laser marking system

Also Published As

Publication number Publication date
KR101561895B1 (en) 2015-10-20
TW201408410A (en) 2014-03-01
KR20130142928A (en) 2013-12-30
CN103506757A (en) 2014-01-15
TWI592239B (en) 2017-07-21
CN103506757B (en) 2016-12-21

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