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MY162177A - Method for transferring a wafer - Google Patents

Method for transferring a wafer

Info

Publication number
MY162177A
MY162177A MYPI20050837A MYPI20050837A MY162177A MY 162177 A MY162177 A MY 162177A MY PI20050837 A MYPI20050837 A MY PI20050837A MY PI20050837 A MYPI20050837 A MY PI20050837A MY 162177 A MY162177 A MY 162177A
Authority
MY
Malaysia
Prior art keywords
wafer
frame
adhesive sheet
fixed
face
Prior art date
Application number
MYPI20050837A
Inventor
Mochida Kinya
Komiyama Mikio
Watanabe Kenichi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY162177A publication Critical patent/MY162177A/en

Links

Classifications

    • H10P72/0442—

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A METHOD A METHOD FOR TRANSFERRING A WAFER (1), WHOSE CIRCUIT BEARING FACE IS FIXED TO A RING-SHAPED FIRST FRAME (3) VIA A FIRST ADHESIVE SHEET (2), TO A STATE WHEREIN A FACE OF THE WAFER OPPOSITE TO THE CIRCUIT BEARING FACE IS FIXED TO A RING-SHAPED SECOND FRAME (6) VIA A SECOND ADHESIVE SHEET (7), CHARACTERIZED BY THAT, AFTER ABUTTING THE WAFER (1) FIXED TO THE FIRST FRAME (3) ONTO A TRANSFER TABLE (5) HAVING A DIAMETER GREATER THAN THAT OF THE WAFER (1) AND SMALLER THAN AN INNER DIAMETER OF THE FIRST FRAME (3) WITH THE FIRST ADHESIVE SHEET (2) CONTACTING THE TABLE FACE, THE FIRST FRAME (3) IS FORCED DOWNWARD, AND IN THIS STATE THE SECOND FRAME (6) TO WHICH IS ADHERED THE SECOND ADHESIVE SHEET (7) IS PLACED ABOVE THE WAFER (1), AND AFTER ADHERING THE SECOND ADHESIVE SHEET (7) TO THE WAFER (1), THE FIRST ADHESIVE SHEET (2) IS DETACHED FROM THE WAFER (1), WHEREUPON THE WAFER (1) IS TRANSFERRED TO THE SECOND FRAME SIDE.
MYPI20050837A 2004-03-01 2005-03-01 Method for transferring a wafer MY162177A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004055720A JP4768963B2 (en) 2004-03-01 2004-03-01 Wafer transfer method

Publications (1)

Publication Number Publication Date
MY162177A true MY162177A (en) 2017-05-31

Family

ID=34908879

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20050837A MY162177A (en) 2004-03-01 2005-03-01 Method for transferring a wafer

Country Status (6)

Country Link
JP (1) JP4768963B2 (en)
KR (1) KR20060123462A (en)
DE (1) DE112005000448T5 (en)
MY (1) MY162177A (en)
TW (1) TW200532786A (en)
WO (1) WO2005083763A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006229021A (en) * 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd Wafer division method
JP5275553B2 (en) * 2006-06-27 2013-08-28 スリーエム イノベイティブ プロパティズ カンパニー Method for manufacturing divided chips
JP2011091293A (en) * 2009-10-26 2011-05-06 Disco Abrasive Syst Ltd Method for processing wafer
JP5533695B2 (en) * 2011-01-26 2014-06-25 豊田合成株式会社 Semiconductor chip manufacturing method and semiconductor chip mounting method
JP6044986B2 (en) * 2012-11-13 2016-12-14 株式会社ディスコ Cutting equipment
JP5855034B2 (en) * 2013-02-18 2016-02-09 古河電気工業株式会社 Adhesive tape for semiconductor wafer processing and method for dividing semiconductor wafer
JP5657828B1 (en) * 2014-07-17 2015-01-21 大宮工業株式会社 Transfer method and transfer device
JP6695173B2 (en) 2016-03-07 2020-05-20 日東電工株式会社 Substrate transfer method and substrate transfer apparatus
KR102609560B1 (en) * 2017-09-08 2023-12-04 삼성전자주식회사 Semiconductor manufacturing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2893741B2 (en) * 1989-08-02 1999-05-24 日本電気株式会社 Electrostrictive effect element
JPH063321B2 (en) * 1989-10-13 1994-01-12 貞一 阿部 Hot water boiler
JP2877997B2 (en) * 1991-08-29 1999-04-05 日東電工株式会社 Semiconductor wafer processing method
JP2001110757A (en) * 1999-10-06 2001-04-20 Toshiba Corp Method for manufacturing semiconductor device
JP2001257222A (en) * 2000-03-09 2001-09-21 Hitachi Ltd Semiconductor mounting device and method of manufacturing the same
JP3408805B2 (en) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 Cutting origin region forming method and workpiece cutting method
JP2003086540A (en) * 2001-09-07 2003-03-20 Toshiba Corp Semiconductor device manufacturing method and its manufacturing apparatus
JP3624909B2 (en) * 2002-03-12 2005-03-02 浜松ホトニクス株式会社 Laser processing method

Also Published As

Publication number Publication date
JP4768963B2 (en) 2011-09-07
JP2007220693A (en) 2007-08-30
KR20060123462A (en) 2006-12-01
TW200532786A (en) 2005-10-01
DE112005000448T5 (en) 2007-03-29
TWI354325B (en) 2011-12-11
WO2005083763A1 (en) 2005-09-09

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