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MY162137A - Method and apparatus for mounting conductive balls - Google Patents

Method and apparatus for mounting conductive balls

Info

Publication number
MY162137A
MY162137A MYPI20082098A MYPI20082098A MY162137A MY 162137 A MY162137 A MY 162137A MY PI20082098 A MYPI20082098 A MY PI20082098A MY PI20082098 A MYPI20082098 A MY PI20082098A MY 162137 A MY162137 A MY 162137A
Authority
MY
Malaysia
Prior art keywords
conductive balls
ball
mount
mounting
holding
Prior art date
Application number
MYPI20082098A
Inventor
Ikeda Kazunari
Original Assignee
Shibuya Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co Ltd filed Critical Shibuya Kogyo Co Ltd
Publication of MY162137A publication Critical patent/MY162137A/en

Links

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A CONDUCTIVE BALL MOUNTING METHOD FOR MOUNTING CONDUCTIVE BALLS (1) ON A MOUNT (2) USING AN ARRAYING MASK (3), IN WHICH THE MOUNT INCLUDES MOUNTING POSITIONS FORMED IN A PREDETERMINED PATTERN, AND THE ARRAYING MASK IS PROVIDED ABOVE THE MOUNT AND INCLUDES THROUGH HOLES (31) PROVIDED IN POSITIONS CORRESPONDING TO THE MOUNTING POSITIONS. THE METHOD INCLUDES PROVIDING A BALL SUCTION UNIT (5) FOR SUCKING SOLDER BALLS, THE BALL SUCTION UNIT INCLUDING A BALL HOLDING MEMBER (52) CAPABLE OF HOLDING THE CONDUCTIVE BALLS, SUCKING UP THE CONDUCTIVE BALLS BELOW THE BALL SUCTION UNIT, HOLDING THE CONDUCTIVE BALLS ON A LOWER SURFACE OF THE BALL HOLDING MEMBER WHILE SUCKING UP THE CONDUCTIVE BALLS, AND AFTER THE HOLDING THE CONDUCTIVE BALLS, FALLING THE CONDUCTIVE BALLS HELD BY THE BALL HOLDING MEMBER TO THE MOUNT.
MYPI20082098A 2006-12-15 2008-06-12 Method and apparatus for mounting conductive balls MY162137A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006338146A JP4899125B2 (en) 2006-12-15 2006-12-15 Method and apparatus for mounting conductive ball

Publications (1)

Publication Number Publication Date
MY162137A true MY162137A (en) 2017-05-31

Family

ID=39655225

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20082098A MY162137A (en) 2006-12-15 2008-06-12 Method and apparatus for mounting conductive balls

Country Status (3)

Country Link
JP (1) JP4899125B2 (en)
MY (1) MY162137A (en)
TW (1) TWI409013B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027765A (en) * 2008-07-17 2010-02-04 Shibuya Kogyo Co Ltd Ball loading apparatus
JP5453636B2 (en) * 2009-11-30 2014-03-26 澁谷工業株式会社 Conductive ball mounting device
JP5639360B2 (en) * 2009-12-21 2014-12-10 アスリートＦａ株式会社 Ball guiding device, ball guiding method, and ball mounting device
JP5598705B2 (en) * 2010-06-03 2014-10-01 澁谷工業株式会社 Conductive ball feeder
JP6069723B2 (en) 2012-06-06 2017-02-01 澁谷工業株式会社 Repair equipment for workpieces with small balls
KR101576722B1 (en) * 2014-01-13 2015-12-10 미나미 가부시키가이샤 Conductive Ball Mounting Head

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
JPH1126630A (en) * 1997-07-02 1999-01-29 Shinko Electric Ind Co Ltd Mounting method of spherical body for forming external connection terminal and mounting device
JP2003273146A (en) * 2002-03-13 2003-09-26 Sekisui Chem Co Ltd Apparatus for manufacturing conductive particle-arranged film
JP3933560B2 (en) * 2002-11-14 2007-06-20 シャープ株式会社 Ball mounting apparatus and ball mounting method
JP4118283B2 (en) * 2004-08-04 2008-07-16 イビデン株式会社 Solder ball mounting method and solder ball mounting apparatus

Also Published As

Publication number Publication date
TW200952586A (en) 2009-12-16
TWI409013B (en) 2013-09-11
JP2008153336A (en) 2008-07-03
JP4899125B2 (en) 2012-03-21

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