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MY134159A - Improvements in or relating to solders - Google Patents

Improvements in or relating to solders

Info

Publication number
MY134159A
MY134159A MYPI20012542A MY134159A MY 134159 A MY134159 A MY 134159A MY PI20012542 A MYPI20012542 A MY PI20012542A MY 134159 A MY134159 A MY 134159A
Authority
MY
Malaysia
Prior art keywords
solders
relating
solder
Prior art date
Application number
Inventor
Hwa Chew Kai
Wei Chih Pan
Original Assignee
Quantum Chemical Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chemical Tech Singapore Pte Ltd filed Critical Quantum Chemical Tech Singapore Pte Ltd
Publication of MY134159A publication Critical patent/MY134159A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

A SOLDER COMPRISING : BETWEEN 87.2AND 89.5TIN; BETWEEN 4.0AND 4.8BISMUTIN; BETWEEN 3.5AND 4.5INDIUM; AND BETWEEN 3.0AND 3.5ILVER.
MYPI20012542 2000-11-16 2001-05-29 Improvements in or relating to solders MY134159A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG2000068411 2000-11-16

Publications (1)

Publication Number Publication Date
MY134159A true MY134159A (en) 2007-11-30

Family

ID=71993755

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20012542 MY134159A (en) 2000-11-16 2001-05-29 Improvements in or relating to solders

Country Status (5)

Country Link
US (1) US20020057986A1 (en)
JP (1) JP2002153991A (en)
CN (1) CN1354065A (en)
HK (1) HK1045824A1 (en)
MY (1) MY134159A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8005880B2 (en) * 2007-08-24 2011-08-23 International Business Machines Corporation Half width counting leading zero circuit
US7654471B2 (en) 2008-01-23 2010-02-02 Bruce Johnson Waterfall apparatus
JP5343566B2 (en) * 2009-01-08 2013-11-13 富士通株式会社 Joining method and reflow apparatus
JP2010219241A (en) * 2009-03-16 2010-09-30 Fujitsu Ltd Method of soldering electronic component, and electronic component
WO2014097390A1 (en) * 2012-12-18 2014-06-26 千住金属工業株式会社 Lead-free solder alloy
KR102339805B1 (en) * 2014-02-21 2021-12-15 덴카 주식회사 Ceramic circuit board
CN105215569A (en) * 2015-10-30 2016-01-06 苏州优诺电子材料科技有限公司 A kind of leadless welding alloy
CN108672979B (en) * 2018-06-06 2020-02-14 上海莜玮汽车零部件有限公司 Lead-free solder alloy, application thereof and glass assembly

Also Published As

Publication number Publication date
US20020057986A1 (en) 2002-05-16
HK1045824A1 (en) 2002-12-13
CN1354065A (en) 2002-06-19
JP2002153991A (en) 2002-05-28

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