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MY127482A - Composite foil and its manufacturing process - Google Patents

Composite foil and its manufacturing process

Info

Publication number
MY127482A
MY127482A MYPI20022651A MYPI20022651A MY127482A MY 127482 A MY127482 A MY 127482A MY PI20022651 A MYPI20022651 A MY PI20022651A MY PI20022651 A MYPI20022651 A MY PI20022651A MY 127482 A MY127482 A MY 127482A
Authority
MY
Malaysia
Prior art keywords
foil
composite foil
metallic
manufacturing process
layer
Prior art date
Application number
MYPI20022651A
Inventor
Gales Raymond
Streel Michel
Lanners Rene
Original Assignee
Circuit Foil Luxembourg Trading S A R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Luxembourg Trading S A R L filed Critical Circuit Foil Luxembourg Trading S A R L
Publication of MY127482A publication Critical patent/MY127482A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12937—Co- or Ni-base component next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A PLEELABLE COMPOSITE FOIL COMPRISES A METALLIC CARRIER FOIL; A FIRST BARRIER LAYER ON ONE SIDE OF THE METALLIC CARRIER FOIL; A SECOND METALLIC LAYER ON THE FIRST BARRIER LAYER, THE SECOND METALLIC LAYER COMPRISING A COMBINATION OF A METAL SELECTED FROM THE GROUP COMPRISING ZINC , COOPER AND COBALT, AND OF AT LEAST ONE METAL SELECTED FROM THE GROUP COMPRISING ARSENIC , MANGANESE, TIN, VANADIUM, MOLYBDENUM, ANTIMONY AND TUNGSTEN; AND AN ELECTRODEPOSITED, ULTRA-THIN METAL FOIL ON THE SECOND METALLIC LAYER.A METHOD FOR MANUFACTURING SUCH A COMPOSITE FOIL IS ALSO PRESENTED.
MYPI20022651A 2001-07-18 2002-07-12 Composite foil and its manufacturing process MY127482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LU90804A LU90804B1 (en) 2001-07-18 2001-07-18 Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards

Publications (1)

Publication Number Publication Date
MY127482A true MY127482A (en) 2006-12-29

Family

ID=19732005

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20022651A MY127482A (en) 2001-07-18 2002-07-12 Composite foil and its manufacturing process

Country Status (12)

Country Link
US (1) US7049007B2 (en)
EP (1) EP1407062B1 (en)
JP (1) JP4129429B2 (en)
KR (1) KR100821017B1 (en)
CN (1) CN1276996C (en)
CA (1) CA2454377A1 (en)
DE (1) DE60207720T2 (en)
LU (1) LU90804B1 (en)
MY (1) MY127482A (en)
RU (1) RU2287618C2 (en)
TW (1) TW575668B (en)
WO (1) WO2003008671A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4187465B2 (en) * 2002-05-29 2008-11-26 三井化学株式会社 Polyimide copper clad laminate using ultra-thin copper foil and method for producing the same
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
WO2006105366A2 (en) * 2005-03-30 2006-10-05 The Regents Of The University Of California SMART-CUT OF A THIN FOIL OF POROUS Ni FROM A Si WAFER
JP4934409B2 (en) 2005-12-15 2012-05-16 古河電気工業株式会社 Ultra-thin copper foil with carrier and printed wiring board
CN1984527B (en) * 2005-12-15 2010-12-01 古河电气工业株式会社 Ultrathin copper foil with carrier and printed circuit board
JP4927503B2 (en) 2005-12-15 2012-05-09 古河電気工業株式会社 Ultra-thin copper foil with carrier and printed wiring board
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
TWI367555B (en) * 2007-03-21 2012-07-01 Advanced Semiconductor Eng Conversion substrate for leadframe and the method for making the same
CN102203326A (en) * 2008-09-05 2011-09-28 古河电气工业株式会社 Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
CN102452197B (en) 2010-10-21 2014-08-20 财团法人工业技术研究院 Foil-attached copper foil and method for producing same
US8329315B2 (en) * 2011-01-31 2012-12-11 Nan Ya Plastics Corporation Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
US9090043B2 (en) 2011-08-03 2015-07-28 The Boeing Company Molybdenum composite hybrid laminates and methods
MY177387A (en) * 2012-03-01 2020-09-14 Mitsui Mining & Smelting Ltd Copper foil with attached carrier foil, method for manufacturing copper foil with attached carrier foil, and copper clad laminate board for laser beam drilling obtained by using copper foil with
WO2013192541A1 (en) * 2012-06-21 2013-12-27 Gbc Metals, Llc Double-sided peelable thin foil composite
KR101391811B1 (en) 2012-08-17 2014-05-07 일진머티리얼즈 주식회사 Copper foil attached to the carrier foil, copper-clad laminate and printed circuit board using the same
TWI524825B (en) * 2012-10-29 2016-03-01 財團法人工業技術研究院 Method of transferring carbon conductive film
TWI486260B (en) 2012-11-16 2015-06-01 Nanya Plastics Corp Copper foil structure having a blackening ultra-thin coil and manufacturing method thereof
CN103857178B (en) * 2012-12-03 2017-07-04 南亚塑胶工业股份有限公司 Copper foil structure with black ultra-thin copper foil and manufacturing method thereof
JP5298252B1 (en) * 2013-02-14 2013-09-25 Ｊｘ日鉱日石金属株式会社 Copper foil with carrier, method for producing copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and method for producing printed wiring board
WO2014132947A1 (en) * 2013-02-26 2014-09-04 古河電気工業株式会社 Ultrathin copper foil with carrier, copper-clad laminate, and coreless substrate
JP6236119B2 (en) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 Copper foil with carrier, laminate, laminate production method, printed wiring board production method, and electronic device production method
CN105002530A (en) * 2015-08-10 2015-10-28 灵宝华鑫铜箔有限责任公司 Surface treatment process for improving copper foil high-temperature anti-oxidation performance
CN105666052B (en) * 2016-01-22 2018-08-14 长沙众兴新材料科技有限公司 A kind of preparation method of car condenser fin aluminium alloy brazing composite insulating foil
CN106696387A (en) * 2016-11-24 2017-05-24 苏州华意铭铄激光科技有限公司 Recoverable and durable composite metal product
US12116689B2 (en) 2021-01-26 2024-10-15 Seagate Technology Llc Selective screen electroplating
CN114672855B (en) * 2022-03-29 2023-09-26 电子科技大学 Preparation method of ultrathin copper foil
LU503243B1 (en) * 2022-12-22 2024-06-25 Circuit Foil Luxembourg Method for producing a composite copper foil and composite copper foil obtained therewith
CN116288161B (en) * 2023-03-09 2024-10-25 珠海凯赛奥表面技术有限公司 Preparation method of extremely thin strippable copper
CN118042723B (en) * 2024-02-27 2025-05-02 九江德福科技股份有限公司 A production method of a flexible copper-clad laminate and a peelable copper foil with a carrier

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE443695B (en) * 1973-02-28 1986-03-03 Perstorp Ab PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING
DE2310193C2 (en) 1973-03-01 1974-11-21 Index-Werke Kg Hahn & Tessky, 7300 Esslingen Safety pressure control valve for setting a constant working pressure
JPS6113688A (en) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 Copper foil for printed circuit and method of producing same
US5096522A (en) * 1989-06-23 1992-03-17 Meiko Electronics Co., Ltd. Process for producing copper-clad laminate
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5322975A (en) * 1992-09-18 1994-06-21 Gould Electronics Inc. Universal carrier supported thin copper line
JP2717911B2 (en) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 Copper foil for printed circuit and manufacturing method thereof
RU2166567C2 (en) * 1995-09-22 2001-05-10 Сиркюи Фуаль Люксембург Трейдинг С.А.Р.Л. Process of manufacture of electrically precipitated copper foil and copper foil produced by this process
JP3612594B2 (en) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 Composite foil with resin, method for producing the same, multilayer copper-clad laminate using the composite foil, and method for producing multilayer printed wiring board
WO2000057680A1 (en) * 1999-03-23 2000-09-28 Circuit Foil Luxembourg Trading S.À R.L. Method for manufacturing a multilayer printed circuit board and composite foil for use therein
JP3370624B2 (en) * 1999-08-24 2003-01-27 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil
JP3690962B2 (en) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement

Also Published As

Publication number Publication date
KR100821017B1 (en) 2008-04-10
EP1407062B1 (en) 2005-11-30
RU2287618C2 (en) 2006-11-20
WO2003008671A1 (en) 2003-01-30
DE60207720D1 (en) 2006-01-05
KR20040022465A (en) 2004-03-12
US7049007B2 (en) 2006-05-23
JP4129429B2 (en) 2008-08-06
EP1407062A1 (en) 2004-04-14
CN1529771A (en) 2004-09-15
US20040209106A1 (en) 2004-10-21
LU90804B1 (en) 2003-01-20
DE60207720T2 (en) 2006-08-17
JP2004535515A (en) 2004-11-25
TW575668B (en) 2004-02-11
CN1276996C (en) 2006-09-27
CA2454377A1 (en) 2003-01-30
RU2004104946A (en) 2005-06-10

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