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MXPA05010211A - Procedimiento de fabricacion de antena de tarjeta inteligente sobre soporte termoplastico y tarjeta inteligente obtenida por dicho procedimiento. - Google Patents

Procedimiento de fabricacion de antena de tarjeta inteligente sobre soporte termoplastico y tarjeta inteligente obtenida por dicho procedimiento.

Info

Publication number
MXPA05010211A
MXPA05010211A MXPA05010211A MXPA05010211A MXPA05010211A MX PA05010211 A MXPA05010211 A MX PA05010211A MX PA05010211 A MXPA05010211 A MX PA05010211A MX PA05010211 A MXPA05010211 A MX PA05010211A MX PA05010211 A MXPA05010211 A MX PA05010211A
Authority
MX
Mexico
Prior art keywords
smart card
antenna
support
making
contact
Prior art date
Application number
MXPA05010211A
Other languages
English (en)
Inventor
Benato Pierre
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of MXPA05010211A publication Critical patent/MXPA05010211A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

La presente invencion se refiere a un procedimiento de fabricacion de una antena de tarjeta inteligente hibrida de contacto-sin contacto o sin contacto que comprende un soporte 10, 11 sobre el cual esta realizada la antena, dos cuerpos de la tarjeta 32, 42, 34, 44 en cada costado del soporte, cada uno de los cuerpos de la tarjeta esta constituido de al menos una capa de material termoplastico, y de un chip 30 o de un modulo conectado a la antena. Este procedimiento comprende las siguientes etapas: una etapa de deposito de una capa de un material compuesto principalmente de una resina sobre una zona predeterminada 12, 13 de soporte de la antena, una etapa de fabricacion de la antena consistente en serigrafiar las espiras 14, 15 y dos contactos 16, 18, 17, 19 de conexion de la tinta polimerica conductora sobre la zona realizada previamente sobre el soporte y someter a un tratamiento termico el soporte a fin de cocer la tinta.
MXPA05010211A 2003-03-28 2004-03-26 Procedimiento de fabricacion de antena de tarjeta inteligente sobre soporte termoplastico y tarjeta inteligente obtenida por dicho procedimiento. MXPA05010211A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0303817A FR2853115B1 (fr) 2003-03-28 2003-03-28 Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede
PCT/FR2004/000777 WO2004088582A2 (fr) 2003-03-28 2004-03-26 Procede de fabrication d’antenne de carte a puce sur un support thermoplastique et carte a puce ainsi obtenue

Publications (1)

Publication Number Publication Date
MXPA05010211A true MXPA05010211A (es) 2005-11-08

Family

ID=32947238

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05010211A MXPA05010211A (es) 2003-03-28 2004-03-26 Procedimiento de fabricacion de antena de tarjeta inteligente sobre soporte termoplastico y tarjeta inteligente obtenida por dicho procedimiento.

Country Status (18)

Country Link
US (1) US7597266B2 (es)
EP (1) EP1609117B1 (es)
JP (1) JP4423287B2 (es)
KR (1) KR101033013B1 (es)
CN (1) CN1768349B (es)
AU (2) AU2004225311A1 (es)
BR (1) BRPI0408701A (es)
CA (1) CA2520441C (es)
DE (1) DE602004022031D1 (es)
ES (1) ES2330336T3 (es)
FR (1) FR2853115B1 (es)
IL (1) IL170967A (es)
MX (1) MXPA05010211A (es)
PT (1) PT1609117E (es)
RU (1) RU2337400C2 (es)
TW (1) TWI337423B (es)
WO (1) WO2004088582A2 (es)
ZA (1) ZA200507781B (es)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005030627A1 (de) * 2005-06-30 2007-01-04 Bundesdruckerei Gmbh Sicherheits- oder Wertdokument mit einer Einrichtung zur kontaktlosen Kommunikation mit einem externen Lese- und/oder Schreibgerät
US7224278B2 (en) 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
KR101351904B1 (ko) * 2006-04-28 2014-01-23 아스크 에세.아. 무선 주파수 인식장치 지지대 및 이의 제조방법
US7701352B2 (en) 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
USD570800S1 (en) * 2006-11-27 2008-06-10 Uniband Electronic Corp. ISM-band printed antenna for a portion of a circuit board
US8096479B2 (en) * 2007-02-23 2012-01-17 Newpage Wisconsin System Inc. Multifunctional paper identification label
HK1109708A2 (zh) 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
WO2008143043A1 (ja) * 2007-05-14 2008-11-27 Tateyama Kagaku Industry Co., Ltd. 無線ｉｃタグおよび無線ｉｃタグの製造方法
FR2917534B1 (fr) * 2007-06-15 2009-10-02 Ask Sa Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
US20110011939A1 (en) * 2007-12-19 2011-01-20 Linda Seah Contact-less and dual interface inlays and methods for producing the same
AU2009200139B2 (en) 2008-01-15 2012-02-16 Aristocrat Technologies Australia Pty Limited A method of processing a user data card, an interface module and a gaming system
US7744005B2 (en) * 2008-01-16 2010-06-29 Taiwan Name Plate Co., Ltd. Induction card with a printed antenna
US20090229108A1 (en) * 2008-03-17 2009-09-17 Ethertronics, Inc. Methods for forming antennas using thermoforming
USD608769S1 (en) * 2008-07-11 2010-01-26 Muehlbauer Ag UHF antenna
CN101873776A (zh) * 2009-04-27 2010-10-27 深圳富泰宏精密工业有限公司 具有天线功能的电子装置壳体及其制造方法
CN101888751A (zh) * 2009-05-11 2010-11-17 深圳富泰宏精密工业有限公司 具有天线功能的电子装置壳体及其制造方法
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
FR2962579A1 (fr) * 2010-07-12 2012-01-13 Ask Sa Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication
FR2977958A1 (fr) * 2011-07-12 2013-01-18 Ask Sa Carte a circuit integre hybride contact-sans contact a tenue renforcee du module electronique
US20130075469A1 (en) * 2011-09-28 2013-03-28 Silviu Stochita My Vacation Card
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
FR3002108A1 (fr) * 2013-02-14 2014-08-15 Ask Sa Procede de fabrication d'une antenne pour dispositif radiofrequence sur support mince et dispositif comprenant une antenne ainsi obtenue
WO2014149926A1 (en) 2013-03-15 2014-09-25 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
RU2607725C1 (ru) * 2015-08-06 2017-01-10 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Смарт-карта с двойным интерфейсом и способ ее изготовления
FR3045891A1 (fr) * 2015-12-22 2017-06-23 Oberthur Technologies Procede de fabrication par lamination a chaud d'une carte a microcircuit comportant un flex dans une cavite et carte ainsi obtenue
CN107181049B (zh) * 2016-03-10 2020-01-31 速码波科技股份有限公司 天线模块
RU2629143C1 (ru) * 2016-07-21 2017-08-24 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Пластиковый брелок с полноцветной печатью, оснащенный встроенной RFID-меткой, и способ его изготовления
DE102016216365A1 (de) 2016-08-31 2018-03-01 Robert Bosch Gmbh Wandlereinrichtung
US10163050B2 (en) * 2016-11-29 2018-12-25 Capital One Services, Llc Wood inlay card and method for making the same
CN109769044A (zh) * 2017-11-09 2019-05-17 天翼电信终端有限公司 一种移动终端
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19632813C2 (de) * 1996-08-14 2000-11-02 Siemens Ag Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
FR2769440B1 (fr) * 1997-10-03 1999-12-03 Gemplus Card Int Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2778475B1 (fr) * 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
DE69927342T2 (de) * 1998-07-08 2006-06-22 Dai Nippon Printing Co., Ltd. Kontaktlose chipkarte und verfahren zu ihrer herstellung
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
WO2001003188A1 (en) * 1999-07-01 2001-01-11 Intermec Ip Corp. Integrated circuit attachment process and apparatus
FR2800518B1 (fr) * 1999-10-28 2007-02-23 A S K Antenne de couplage a inductance elevee
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
JP3680676B2 (ja) * 2000-02-03 2005-08-10 松下電器産業株式会社 非接触データキャリア
RU2158204C1 (ru) * 2000-03-17 2000-10-27 Закрытое акционерное общество "Розан-Файненс" Способ изготовления ламинированных бесконтактных чиповых карт
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
JP2002074300A (ja) * 2000-08-31 2002-03-15 Shinko Electric Ind Co Ltd 非接触型ｉｃカ−ド及びその製造方法
JP3809056B2 (ja) * 2000-09-14 2006-08-16 新光電気工業株式会社 Ｉｃカード
JP4873776B2 (ja) * 2000-11-30 2012-02-08 ソニー株式会社 非接触ｉｃカード
FR2826154B1 (fr) * 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
EP1426177A4 (en) * 2001-09-05 2008-01-02 Sony Corp PLASTIC CARD
FR2881252A1 (fr) * 2005-01-24 2006-07-28 Ask Sa Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication

Also Published As

Publication number Publication date
AU2011200175B2 (en) 2011-09-15
RU2005133201A (ru) 2006-03-10
EP1609117B1 (fr) 2009-07-15
RU2337400C2 (ru) 2008-10-27
ES2330336T3 (es) 2009-12-09
JP2006523395A (ja) 2006-10-12
TWI337423B (en) 2011-02-11
WO2004088582A3 (fr) 2005-05-19
BRPI0408701A (pt) 2006-03-07
CN1768349B (zh) 2010-04-28
AU2004225311A1 (en) 2004-10-14
CA2520441A1 (fr) 2004-10-14
FR2853115A1 (fr) 2004-10-01
CN1768349A (zh) 2006-05-03
IL170967A (en) 2011-05-31
KR101033013B1 (ko) 2011-05-09
WO2004088582A2 (fr) 2004-10-14
AU2011200175A1 (en) 2011-02-03
PT1609117E (pt) 2009-10-20
CA2520441C (fr) 2012-11-06
ZA200507781B (en) 2006-06-28
TW200419845A (en) 2004-10-01
US7597266B2 (en) 2009-10-06
EP1609117A2 (fr) 2005-12-28
DE602004022031D1 (de) 2009-08-27
FR2853115B1 (fr) 2005-05-06
KR20060009823A (ko) 2006-02-01
US20060181478A1 (en) 2006-08-17
JP4423287B2 (ja) 2010-03-03
HK1091571A1 (zh) 2007-01-19

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