MXPA05009116A - Hoja de a1 de superficie tratada que tiene excelente soldabilidad recipiente de calor usando la hoja, y metodo para manufacturar la hoja de a1 de superficie tratada que tiene excelente soldabilidad. - Google Patents
Hoja de a1 de superficie tratada que tiene excelente soldabilidad recipiente de calor usando la hoja, y metodo para manufacturar la hoja de a1 de superficie tratada que tiene excelente soldabilidad.Info
- Publication number
- MXPA05009116A MXPA05009116A MXPA05009116A MXPA05009116A MXPA05009116A MX PA05009116 A MXPA05009116 A MX PA05009116A MX PA05009116 A MXPA05009116 A MX PA05009116A MX PA05009116 A MXPA05009116 A MX PA05009116A MX PA05009116 A MXPA05009116 A MX PA05009116A
- Authority
- MX
- Mexico
- Prior art keywords
- sheet
- treated
- layer
- solderability
- sheet excellent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/12—Aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
- C23C28/025—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/028—Including graded layers in composition or in physical properties, e.g. density, porosity, grain size
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H10W40/258—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemically Coating (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Metodo para producir un hoja de Al tratada, que comprende el formar una capa de Zn sobre la superficie de un substrato de Al a traves de plateado de por desplazamiento, y luego formar una capa de Ni y una capa de Sn por platinado sobre la capa de Zn, o que comprende ademas el formar una capa que tenga la propiedad de un fundente de soldadura y que mejore la capacidad de disipacion del calor de la hoja Al, sobre la capa de Sn de la hoja de Al de superficie tratada anterior; una hoja de Al de superficie tratada producida a traves del metodo; un recipiente de calor usando la hoja de Al. La hoja de Al de superficie tratada es excelente en la adhesion de las capas de soldadura, la mojabilidad de una soldadura blanda y la resistencia de la soldadura, y muestra excelente capacidad de disipacion del calor, y por lo tanto puede usarse adecuadamente para un recipiente de calo capaz de ser soldado, y el metodo permite la produccion de la hoja de Al a un bajo costo.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003049689A JP4159897B2 (ja) | 2003-02-26 | 2003-02-26 | ハンダ性に優れた表面処理Al板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Al板の製造方法 |
| PCT/JP2004/000222 WO2004076724A1 (ja) | 2003-02-26 | 2004-01-15 | ハンダ性に優れた表面処理Al板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Al板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA05009116A true MXPA05009116A (es) | 2006-01-27 |
Family
ID=32923317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA05009116A MXPA05009116A (es) | 2003-02-26 | 2004-01-15 | Hoja de a1 de superficie tratada que tiene excelente soldabilidad recipiente de calor usando la hoja, y metodo para manufacturar la hoja de a1 de superficie tratada que tiene excelente soldabilidad. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070071994A1 (es) |
| EP (1) | EP1602750A4 (es) |
| JP (1) | JP4159897B2 (es) |
| KR (1) | KR20050103511A (es) |
| CN (1) | CN100482866C (es) |
| MX (1) | MXPA05009116A (es) |
| WO (1) | WO2004076724A1 (es) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3766411B2 (ja) * | 2003-08-20 | 2006-04-12 | 東洋鋼鈑株式会社 | ハンダ性に優れた表面処理Al板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Al板の製造方法 |
| JP5004414B2 (ja) * | 2004-10-12 | 2012-08-22 | 東洋鋼鈑株式会社 | ハンダ性に優れた表面処理Al板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Al板の製造方法 |
| JP4888992B2 (ja) * | 2005-01-27 | 2012-02-29 | 東洋鋼鈑株式会社 | 表面処理Al板の製造方法 |
| JP5101798B2 (ja) * | 2005-02-14 | 2012-12-19 | 東洋鋼鈑株式会社 | 表面処理Al板 |
| JP2006291340A (ja) * | 2005-04-14 | 2006-10-26 | Toshiyuki Arai | 表面処理アルミニウム板、表面処理アルミニウム板を使用した電気通電体及びヒートシンク、表面処理アルミニウム板の製造方法 |
| JP2006322665A (ja) * | 2005-05-19 | 2006-11-30 | Toyo Kohan Co Ltd | 中空積層体、それを用いたプレート型冷却部材、およびそれを用いた電子機器 |
| JP2006342369A (ja) * | 2005-06-07 | 2006-12-21 | Toyo Kohan Co Ltd | 表面処理Al板 |
| JP2006342395A (ja) * | 2005-06-09 | 2006-12-21 | Toyo Kohan Co Ltd | ハンダ性に優れた樹脂被覆めっき金属板 |
| KR100950916B1 (ko) * | 2008-05-06 | 2010-04-01 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 및 이에 의해 제조된인쇄회로기판 |
| JP2008223147A (ja) * | 2008-06-13 | 2008-09-25 | Toyo Kohan Co Ltd | ハンダ性に優れた表面処理Al板及びその製造方法 |
| CN103205744B (zh) * | 2012-01-12 | 2015-08-19 | 江苏嘉和热系统股份有限公司 | 散热器用铝合金的一种表面处理工艺 |
| DE102012213812A1 (de) * | 2012-08-03 | 2014-02-06 | Robert Bosch Gmbh | Einpresskontaktierung |
| JP2014040649A (ja) * | 2012-08-24 | 2014-03-06 | Auto Network Gijutsu Kenkyusho:Kk | コネクタ用めっき端子及びコネクタ用めっき端子の製造方法 |
| JP5965418B2 (ja) * | 2014-01-09 | 2016-08-03 | 株式会社日立金属ネオマテリアル | シャーシおよび携帯機器 |
| EP3150731B1 (en) | 2014-05-30 | 2018-12-19 | Toyo Aluminium Kabushiki Kaisha | Aluminum foil, electronic component wiring board, and aluminum foil manufacturing method |
| KR102010769B1 (ko) * | 2017-03-03 | 2019-08-14 | 한국해양대학교 산학협력단 | 아연도금층에 형성되는 주석/마그네슘 박막 및 그 제조방법 |
| DE102017125096B4 (de) * | 2017-10-26 | 2022-05-19 | Hanon Systems | Verfahren zum Herstellen eines Scrollverdichters und mit dem Verfahren hergestellter Scrollverdichter |
| JP6871524B1 (ja) * | 2020-03-23 | 2021-05-12 | 千住金属工業株式会社 | 積層接合材料、半導体パッケージおよびパワーモジュール |
| US20230223317A1 (en) * | 2022-01-13 | 2023-07-13 | Mitsubishi Electric Corporation | Resin-sealed semiconductor device |
| US20240015932A1 (en) * | 2022-07-08 | 2024-01-11 | Holding Zero, LLC | Composite thermal control substrate |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3150342A (en) * | 1960-02-10 | 1964-09-22 | Morganite Resistors Ltd | Non-linear resistors |
| US3915667A (en) * | 1973-09-20 | 1975-10-28 | Westinghouse Electric Corp | Abrasion resistant coating for aluminum base alloy and method |
| JPS5429555A (en) * | 1977-08-09 | 1979-03-05 | Toshiba Corp | Heat sink constituent |
| JPH0641789B2 (ja) * | 1982-02-22 | 1994-06-01 | トヨタ自動車株式会社 | 摺動部材 |
| JPS59208094A (ja) * | 1983-05-13 | 1984-11-26 | Mitsubishi Chem Ind Ltd | ブロンズ調鏡面製品 |
| JPS6130673A (ja) * | 1984-07-23 | 1986-02-12 | Mitsubishi Alum Co Ltd | アルミニウム材への亜鉛皮膜形成法 |
| CN85105468B (zh) * | 1985-07-18 | 1988-11-30 | 交通部公路科学研究所 | 用于预处理不易钎焊金属的刷镀液 |
| HU202936B (en) * | 1987-07-07 | 1991-04-29 | Orion Radio | Process for producing more-layer metal coating on surface of objects made of aluminium- or aluminium alloy |
| JPH05345969A (ja) * | 1992-06-12 | 1993-12-27 | Kobe Steel Ltd | 半田付け性及びめっき密着性に優れたAl系合金金属材 |
| CA2107866A1 (en) * | 1992-10-13 | 1994-04-14 | Sue Troup-Packman | Iron-plated aluminum alloy parts and method for plating the same |
| JPH0734254A (ja) * | 1993-07-19 | 1995-02-03 | Okuno Chem Ind Co Ltd | アルミニウム系材料への無電解めっき方法 |
| JP3435925B2 (ja) * | 1995-08-25 | 2003-08-11 | ソニー株式会社 | 半導体装置 |
| US6796484B2 (en) * | 2001-02-02 | 2004-09-28 | Corus Aluminum Walzprodukte Gmbh | Nickel-plated brazing product having improved corrosion performance |
| JP2003077451A (ja) * | 2001-08-30 | 2003-03-14 | Rohm Co Ltd | 電池保護モジュール接続構造 |
| JP3949505B2 (ja) * | 2002-04-26 | 2007-07-25 | シャープ株式会社 | 接続端子及びその製造方法並びに半導体装置及びその製造方法 |
-
2003
- 2003-02-26 JP JP2003049689A patent/JP4159897B2/ja not_active Expired - Fee Related
-
2004
- 2004-01-15 WO PCT/JP2004/000222 patent/WO2004076724A1/ja not_active Ceased
- 2004-01-15 US US10/547,087 patent/US20070071994A1/en not_active Abandoned
- 2004-01-15 MX MXPA05009116A patent/MXPA05009116A/es unknown
- 2004-01-15 KR KR1020057016071A patent/KR20050103511A/ko not_active Ceased
- 2004-01-15 CN CNB2004800053484A patent/CN100482866C/zh not_active Expired - Fee Related
- 2004-01-15 EP EP04702436A patent/EP1602750A4/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP4159897B2 (ja) | 2008-10-01 |
| CN1754010A (zh) | 2006-03-29 |
| JP2004263210A (ja) | 2004-09-24 |
| US20070071994A1 (en) | 2007-03-29 |
| KR20050103511A (ko) | 2005-10-31 |
| EP1602750A4 (en) | 2007-03-14 |
| WO2004076724A1 (ja) | 2004-09-10 |
| CN100482866C (zh) | 2009-04-29 |
| EP1602750A1 (en) | 2005-12-07 |
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