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MXPA04002588A - Etiqueta electronica de poco espesor y metodo para la fabricacion de la misma. - Google Patents

Etiqueta electronica de poco espesor y metodo para la fabricacion de la misma.

Info

Publication number
MXPA04002588A
MXPA04002588A MXPA04002588A MXPA04002588A MXPA04002588A MX PA04002588 A MXPA04002588 A MX PA04002588A MX PA04002588 A MXPA04002588 A MX PA04002588A MX PA04002588 A MXPA04002588 A MX PA04002588A MX PA04002588 A MXPA04002588 A MX PA04002588A
Authority
MX
Mexico
Prior art keywords
substrate
low thickness
conductive layer
card
electronic component
Prior art date
Application number
MXPA04002588A
Other languages
English (en)
Inventor
Droz Francois
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of MXPA04002588A publication Critical patent/MXPA04002588A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H10W70/699—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

El objetivo de la presente invencion es una tarjeta o etiqueta, flexible de poco la que estan instalados unos componentes de manera que se asegura una buena conexion electrica entre los contactos del componente y los conductores de la tarjeta. La presente invencion tambien tiene como objetivo proponer un metodo de fabricacion de este tipo de tarjetas o etiquetas. La tarjeta o etiqueta electronica, segun la invencion, se realiza mediante el ensamblaje de al menos un substrato (7) flexible de poco espesor, una capa conductora (4) y una capa adhesiva (1), e incluyendo al menos un componente electronico (11). Se caracteriza por el hecho de que el substrato (7) incluye al menos una ventana (8) donde se aloja el componente electronico (11), la capa adhesiva (1) mantiene la capa conductora (8) sobre el substrato, la capa conductora (4) se extiende parcialmente dentro de la superficie de la ventana (8) de tal manera que se forma al menos un contacto electrico (4') en el cual se conecta el componente electronico (11). El substrato (7) posee un espesor preferiblemente seleccionado en funcion de la altura mas elevada del componente que se va a instalar.
MXPA04002588A 2001-09-18 2002-09-17 Etiqueta electronica de poco espesor y metodo para la fabricacion de la misma. MXPA04002588A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH17182001 2001-09-18
PCT/IB2002/003953 WO2003026010A1 (fr) 2001-09-18 2002-09-17 Étiquette électronique de faible épaisseur et procédé de fabrication d'une telle étiquette

Publications (1)

Publication Number Publication Date
MXPA04002588A true MXPA04002588A (es) 2004-06-18

Family

ID=4566019

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA04002588A MXPA04002588A (es) 2001-09-18 2002-09-17 Etiqueta electronica de poco espesor y metodo para la fabricacion de la misma.

Country Status (12)

Country Link
US (1) US7150406B2 (es)
EP (1) EP1428258B1 (es)
JP (1) JP4257679B2 (es)
CN (1) CN100359682C (es)
AU (1) AU2002337402B2 (es)
BR (1) BRPI0212612B1 (es)
CA (1) CA2460840C (es)
ES (1) ES2649545T3 (es)
MX (1) MXPA04002588A (es)
RU (1) RU2300159C2 (es)
WO (1) WO2003026010A1 (es)
ZA (1) ZA200402147B (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109039B2 (ja) * 2002-08-28 2008-06-25 株式会社ルネサステクノロジ 電子タグ用インレットおよびその製造方法
JP4066929B2 (ja) * 2003-10-08 2008-03-26 株式会社日立製作所 電子装置及びその製造方法
EP1724712A1 (fr) * 2005-05-11 2006-11-22 Stmicroelectronics Sa Micromodule, notamment pour carte à puce
FR2885718B1 (fr) * 2005-05-11 2007-09-21 Gemplus Sa Adaptateur de format a adhesif pour dispositif a memoire et procede de fabrication
SI2036007T1 (sl) 2006-06-19 2013-05-31 Nagraid S.A. Postopek izdelave kartic, ki vsaka obsega elektronski modul, in vmesni izdelki
AU2007263133B2 (en) * 2006-06-19 2012-04-05 Nagravision S.A. Method of fabricating cards comprising at least one electronic module, assembly involved in this method and intermediate product
WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
MX2009007905A (es) 2007-02-09 2009-07-31 Nagraid Sa Metodo para producir tarjetas electronicas que incluyen al menos un patron impreso.
HK1109708A2 (zh) * 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
GB2453765A (en) * 2007-10-18 2009-04-22 Novalia Ltd Product packaging with printed circuit and means for preventing a short circuit
FI121592B (fi) * 2008-03-26 2011-01-31 Tecnomar Oy Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti
CN101345330A (zh) * 2008-08-25 2009-01-14 合隆科技(杭州)有限公司 射频天线及其制作方法
WO2013175261A1 (en) * 2012-05-21 2013-11-28 Linxens Holding Interconnection substrate and method of manufacturing the same
FR2992141B1 (fr) * 2012-06-14 2015-03-20 Microconnections Sas Procede de realisation de circuit electronique a protection de couche conductrice
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
EP2846355A1 (en) * 2013-07-26 2015-03-11 Linxens Holding Electrical substrate and process of manufacturing the same
WO2015085086A1 (en) 2013-12-04 2015-06-11 Temptime Corporation Condition change labels
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
CN110077135B (zh) * 2019-04-23 2020-07-17 捷卡（厦门）工业科技有限公司 一种带窗口的标签的生产工艺

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
FR2673041A1 (fr) * 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
FR2674681A1 (fr) * 1991-03-28 1992-10-02 Em Microelectronic Marin Sa Composant electronique ultramince et procede pour sa fabrication.
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
DE9422424U1 (de) * 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chipkarte mit einem elektronischen Modul
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
JPH08316411A (ja) * 1995-05-18 1996-11-29 Hitachi Ltd 半導体装置
EP1031939B1 (en) * 1997-11-14 2005-09-14 Toppan Printing Co., Ltd. Composite ic card
FR2796183B1 (fr) * 1999-07-07 2001-09-28 A S K Ticket d'acces sans contact et son procede de fabrication
JP2001175829A (ja) * 1999-10-08 2001-06-29 Dainippon Printing Co Ltd 非接触式データキャリアおよびｉｃチップ
WO2001026910A1 (fr) * 1999-10-08 2001-04-19 Dai Nippon Printing Co., Ltd. Support de donnees et puce de circuit integre sans contact
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card

Also Published As

Publication number Publication date
EP1428258A1 (fr) 2004-06-16
JP4257679B2 (ja) 2009-04-22
WO2003026010A1 (fr) 2003-03-27
CN100359682C (zh) 2008-01-02
EP1428258B1 (fr) 2017-08-30
CA2460840A1 (en) 2003-03-27
RU2004107999A (ru) 2005-05-10
CA2460840C (en) 2011-12-20
ES2649545T3 (es) 2018-01-12
BR0212612A (pt) 2004-08-17
RU2300159C2 (ru) 2007-05-27
BRPI0212612B1 (pt) 2016-01-19
AU2002337402B2 (en) 2007-08-16
JP2005503625A (ja) 2005-02-03
CN1555576A (zh) 2004-12-15
US7150406B2 (en) 2006-12-19
US20040256466A1 (en) 2004-12-23
ZA200402147B (en) 2005-07-27

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