MXPA03001294A - Montaje de disipacion de calor resistente a la vibracion y golpe. - Google Patents
Montaje de disipacion de calor resistente a la vibracion y golpe.Info
- Publication number
- MXPA03001294A MXPA03001294A MXPA03001294A MXPA03001294A MXPA03001294A MX PA03001294 A MXPA03001294 A MX PA03001294A MX PA03001294 A MXPA03001294 A MX PA03001294A MX PA03001294 A MXPA03001294 A MX PA03001294A MX PA03001294 A MXPA03001294 A MX PA03001294A
- Authority
- MX
- Mexico
- Prior art keywords
- heat dissipation
- threaded
- base portion
- heat
- central member
- Prior art date
Links
Classifications
-
- H10W40/641—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Se describe un dispositivo (10) de disipacion de calor resistente a vibracion y golpe para remover calor de un objeto (12) que genera calor. El dispositivo (10) de disipacion de calor incluye una pinza (22) de retencion que tiene un miembro central (24) y un par de patas (28) que cuelgan hacia abajo del mismo. Se coloca una abertura (26) a traves de un miembro central (24) y define un agujero del miembro central que tiene rosca hembra formada en la misma. Los extremos libres (30) del par de patas (28) se aseguran con relacion al objeto (12) que genera calor. Se adapta un miembro (11) de disipacion de calor que tiene una porcion base roscada (14) con una superficie (16) del fondo substancialmente plana para ser recibido con rosca en el agujero (26) del miembro central de modo que la superficie (16) del fondo plana del miembro (11) de disipacion de calor este en comunicacion termica al ras con el miembro (12) de generacion de calor. Se coloca un miembro (20) de trinquete entre la pinza (22) de retencion y el miembro (11) de disipacion de calor para controlar la recepcion roscada de la pocion (14) en la pinza (22) de retencion. El miembro (20) de trinquete permite solo el roscado de instalacion hacia dentro de la porcion base (14) en el agujero (26) del miembro central en tanto que impide la remocion roscada de la porcion base (14) fuera de la pinza (22) de retencion. El uso de una herramienta (200) permite la remocion roscada de la porcion base (14) fuera de la pinza (22) de retencion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/637,418 US6293331B1 (en) | 2000-08-11 | 2000-08-11 | Vibration and shock resistant heat sink assembly |
| PCT/IB2001/001593 WO2002015265A2 (en) | 2000-08-11 | 2001-07-19 | Vibration and shock resistant heat sink assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA03001294A true MXPA03001294A (es) | 2004-07-30 |
Family
ID=24555846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA03001294A MXPA03001294A (es) | 2000-08-11 | 2001-07-19 | Montaje de disipacion de calor resistente a la vibracion y golpe. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6293331B1 (es) |
| CN (1) | CN1284232C (es) |
| AU (1) | AU2001282398A1 (es) |
| MX (1) | MXPA03001294A (es) |
| TW (1) | TWI272891B (es) |
| WO (1) | WO2002015265A2 (es) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6496374B1 (en) * | 2000-10-24 | 2002-12-17 | Lsi Logic Corporation | Apparatus suitable for mounting an integrated circuit |
| US6430052B1 (en) * | 2001-05-08 | 2002-08-06 | Cisco Technology, Inc. | Techniques for cooling a circuit board component |
| US6386274B1 (en) * | 2001-06-28 | 2002-05-14 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| US6452803B1 (en) * | 2001-07-20 | 2002-09-17 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| US6633489B2 (en) * | 2001-07-31 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | Dynamic isolating mount for processor packages |
| US6549407B1 (en) * | 2001-12-27 | 2003-04-15 | Intel Corporation | Heat exchanger retention mechanism |
| US6781831B1 (en) | 2002-02-14 | 2004-08-24 | Mercury Computer Systems, Inc. | Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers |
| US6879486B1 (en) | 2002-02-14 | 2005-04-12 | Mercury Computer Systems, Inc. | Central inlet circuit board assembly |
| US6697255B1 (en) | 2002-02-14 | 2004-02-24 | Mercury Computer Systems, Inc. | Circuit board assembly with integrated shaping and control of flow resistance curve |
| US6690575B1 (en) | 2002-02-14 | 2004-02-10 | Mercury Computer Systems, Inc. | Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies |
| US6661657B1 (en) | 2002-02-14 | 2003-12-09 | Mercury Computer Systems, Inc. | Circuit board assembly for use in a central inlet chassis configuration |
| US6759588B1 (en) | 2002-02-14 | 2004-07-06 | Mercury Computer Systems, Inc. | Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover |
| US6683787B1 (en) | 2002-02-14 | 2004-01-27 | Mercury Computer Systems, Inc. | Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks |
| US7452712B2 (en) | 2002-07-30 | 2008-11-18 | Applied Biosystems Inc. | Sample block apparatus and method of maintaining a microcard on a sample block |
| US6728104B1 (en) | 2002-10-23 | 2004-04-27 | Cisco Technology, Inc. | Methods and apparatus for cooling a circuit board component |
| US6714416B1 (en) | 2002-11-13 | 2004-03-30 | Cisco Technology, Inc. | Mechanisms and techniques for fastening a heat sink to a circuit board component |
| US6944023B2 (en) * | 2002-11-15 | 2005-09-13 | Celestica International Inc. | System and method for mounting a heat sink |
| CA2509902A1 (en) * | 2002-12-13 | 2004-07-01 | Aurelium Biopharma Inc. | Nucleophosmin directed diagnostics and therapeutics for multidrug resistant neoplastic disease |
| US7242583B2 (en) * | 2002-12-16 | 2007-07-10 | Paricon Technologies, Corporation | System for loading a heat sink mechanism independently of clamping load on electrical device |
| US6914780B1 (en) | 2003-01-16 | 2005-07-05 | Cisco Technology, Inc. | Methods and apparatus for cooling a circuit board component using a heat pipe assembly |
| US20050237528A1 (en) * | 2003-09-19 | 2005-10-27 | Oldham Mark F | Transparent heater for thermocycling |
| US7570443B2 (en) | 2003-09-19 | 2009-08-04 | Applied Biosystems, Llc | Optical camera alignment |
| US7139174B1 (en) | 2003-10-29 | 2006-11-21 | Cisco Technology, Inc. | Techniques for attaching a heat sink assembly to a circuit board component |
| US7203065B1 (en) * | 2003-11-24 | 2007-04-10 | Ciena Corporation | Heatsink assembly |
| IL159399A0 (en) * | 2003-12-16 | 2004-06-01 | Rafael Armament Dev Authority | Integrated-circuit cooling system |
| US7113406B1 (en) | 2004-07-22 | 2006-09-26 | Cisco Technology, Inc. | Methods and apparatus for fastening a set of heatsinks to a circuit board |
| US20060026835A1 (en) * | 2004-08-03 | 2006-02-09 | Wood James G | Heat exchanger fins and method for fabricating fins particularly suitable for stirling engines |
| US7321493B2 (en) * | 2004-12-01 | 2008-01-22 | Cisco Technology, Inc. | Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board |
| US7324344B2 (en) * | 2004-12-01 | 2008-01-29 | Cisco Technology, Inc. | Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board |
| US7362578B2 (en) * | 2005-08-16 | 2008-04-22 | Tyco Electronics Corporation | Heat sink fastening system |
| CN101231546A (zh) * | 2007-01-24 | 2008-07-30 | 鸿富锦精密工业(深圳)有限公司 | 散热装置组合 |
| CN101742819B (zh) * | 2008-11-21 | 2013-03-20 | 鸿富锦精密工业(深圳)有限公司 | 电路板组合 |
| TWM361659U (en) * | 2009-01-13 | 2009-07-21 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly and clip thereof |
| CN101853058A (zh) * | 2009-03-30 | 2010-10-06 | 鸿富锦精密工业(深圳)有限公司 | 主板散热器 |
| KR101351010B1 (ko) * | 2009-04-14 | 2014-01-10 | 후지쯔 가부시끼가이샤 | 전자 기기 |
| US20110035935A1 (en) * | 2009-08-12 | 2011-02-17 | Pen-Chun YU | Heat sink fast disassembling structure |
| US12048123B2 (en) * | 2020-01-23 | 2024-07-23 | Intel Corporation | Heat dissipation device having shielding/containment extensions |
| GB2598343B (en) * | 2020-08-27 | 2022-11-30 | Continental Automotive Romania Srl | Circular heatsink |
| DE102020133973A1 (de) * | 2020-12-17 | 2022-06-23 | Avl Software And Functions Gmbh | Wärmetauscher, insbesondere für eine Leistungselektronik |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2432513A (en) | 1946-05-24 | 1947-12-16 | Bell Telephone Labor Inc | Ionic discharge device |
| US2916159A (en) | 1956-06-05 | 1959-12-08 | Thompson Ramo Wooldridge Inc | Mounting clip |
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| NL260951A (es) | 1960-03-07 | |||
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| US3229756A (en) | 1964-01-21 | 1966-01-18 | Laszlo Z Keresztury | Semiconductor heat sink and/or cooler |
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| US4345267A (en) | 1980-03-31 | 1982-08-17 | Amp Incorporated | Active device substrate connector having a heat sink |
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| JPS58176959A (ja) | 1982-04-12 | 1983-10-17 | Usac Electronics Ind Co Ltd | 放熱フインの装着構造 |
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| FR2625038B1 (fr) | 1987-12-22 | 1990-08-17 | Cit Alcatel | Procede et dispositif de refroidissement d'un boitier de circuit integre |
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| US5397919A (en) | 1993-03-04 | 1995-03-14 | Square Head, Inc. | Heat sink assembly for solid state devices |
| US5313099A (en) | 1993-03-04 | 1994-05-17 | Square Head, Inc. | Heat sink assembly for solid state devices |
| US5566052A (en) * | 1995-06-08 | 1996-10-15 | Northern Telecom Limited | Electronic devices with electromagnetic radiation interference shields and heat sinks |
| US5667870A (en) * | 1995-07-24 | 1997-09-16 | Chip Coolers, Inc. | Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member |
| DE29516627U1 (de) | 1995-10-20 | 1995-12-14 | Lin, Jen-Cheng, Taipeh/T'ai-pei | CPU-Kühlkörper-Befestigungselement |
| US5708564A (en) | 1996-05-07 | 1998-01-13 | Lin; Andy | Heat sink mounting structure |
-
2000
- 2000-08-11 US US09/637,418 patent/US6293331B1/en not_active Expired - Fee Related
-
2001
- 2001-07-19 CN CNB018139884A patent/CN1284232C/zh not_active Expired - Fee Related
- 2001-07-19 MX MXPA03001294A patent/MXPA03001294A/es active IP Right Grant
- 2001-07-19 AU AU2001282398A patent/AU2001282398A1/en not_active Abandoned
- 2001-07-19 WO PCT/IB2001/001593 patent/WO2002015265A2/en not_active Ceased
- 2001-07-26 TW TW090118311A patent/TWI272891B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002015265A3 (en) | 2003-03-13 |
| TWI272891B (en) | 2007-02-01 |
| CN1446376A (zh) | 2003-10-01 |
| US6293331B1 (en) | 2001-09-25 |
| CN1284232C (zh) | 2006-11-08 |
| AU2001282398A1 (en) | 2002-02-25 |
| WO2002015265A2 (en) | 2002-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |