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MXPA03000513A - Montaje de componente electrico y metodo de fabricacion.. - Google Patents

Montaje de componente electrico y metodo de fabricacion..

Info

Publication number
MXPA03000513A
MXPA03000513A MXPA03000513A MXPA03000513A MXPA03000513A MX PA03000513 A MXPA03000513 A MX PA03000513A MX PA03000513 A MXPA03000513 A MX PA03000513A MX PA03000513 A MXPA03000513 A MX PA03000513A MX PA03000513 A MXPA03000513 A MX PA03000513A
Authority
MX
Mexico
Prior art keywords
particles
electrical component
fabrication
component assembly
assembly
Prior art date
Application number
MXPA03000513A
Other languages
English (en)
Inventor
Herbert J Neuhaus
Original Assignee
Nanopierce Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanopierce Technologies Inc filed Critical Nanopierce Technologies Inc
Publication of MXPA03000513A publication Critical patent/MXPA03000513A/es

Links

Classifications

    • H10W72/071—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W90/701—
    • H10W72/07173—
    • H10W72/072—
    • H10W72/073—
    • H10W72/074—
    • H10W72/20—
    • H10W72/241—
    • H10W72/251—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Un montaje de componente electrico y metodo para la fabricacion del montaje en el cual las particulas (318) se fijan en superficies de contacto de metal (314) y a las cuales se les aplica presion a fin de provocar que las particulas penetren al menos en una de las superficies de contacto (314). En un metodo, las particulas duras (318) se aplican en una de las superficies de metal (314) mediante el proceso de electro-deposicion de las particulas en un bano de deposicion. En otro metodo, las particulas duras (318) se aplican en una capa adhesiva no conductiva (324) colocada entre un componente electronico (310) y un substrato (312). Una vez que la presion es aplicada ya sea en el componente electronico (310) o en el substrato (312), se forma una union permanente electricamente conductiva.
MXPA03000513A 2000-07-21 2001-06-22 Montaje de componente electrico y metodo de fabricacion.. MXPA03000513A (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US22002700P 2000-07-21 2000-07-21
US23356100P 2000-09-19 2000-09-19
US68423800A 2000-10-05 2000-10-05
US09/812,140 US20020027294A1 (en) 2000-07-21 2001-03-19 Electrical component assembly and method of fabrication
PCT/US2001/020094 WO2002009484A2 (en) 2000-07-21 2001-06-22 Electrical component assembly and method of fabrication

Publications (1)

Publication Number Publication Date
MXPA03000513A true MXPA03000513A (es) 2004-09-10

Family

ID=27499169

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03000513A MXPA03000513A (es) 2000-07-21 2001-06-22 Montaje de componente electrico y metodo de fabricacion..

Country Status (9)

Country Link
US (1) US20020027294A1 (es)
EP (1) EP1309997A2 (es)
JP (1) JP2004504730A (es)
KR (1) KR20030020939A (es)
CN (1) CN1620725A (es)
AU (1) AU2001271413A1 (es)
MX (1) MXPA03000513A (es)
TW (1) TW508636B (es)
WO (1) WO2002009484A2 (es)

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Also Published As

Publication number Publication date
WO2002009484A2 (en) 2002-01-31
CN1620725A (zh) 2005-05-25
AU2001271413A1 (en) 2002-02-05
TW508636B (en) 2002-11-01
JP2004504730A (ja) 2004-02-12
US20020027294A1 (en) 2002-03-07
EP1309997A2 (en) 2003-05-14
KR20030020939A (ko) 2003-03-10
WO2002009484A3 (en) 2002-06-06

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