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MX9602624A - Metodo y aparato para colocar un cuerpo lineal. - Google Patents

Metodo y aparato para colocar un cuerpo lineal.

Info

Publication number
MX9602624A
MX9602624A MX9602624A MX9602624A MX9602624A MX 9602624 A MX9602624 A MX 9602624A MX 9602624 A MX9602624 A MX 9602624A MX 9602624 A MX9602624 A MX 9602624A MX 9602624 A MX9602624 A MX 9602624A
Authority
MX
Mexico
Prior art keywords
wires
substrate
linear body
collector
retained
Prior art date
Application number
MX9602624A
Other languages
English (en)
Inventor
Takeshi Yakou
Tsunenobu Satoi
Eiji Takaki
Toshio Akiyama
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7174827A external-priority patent/JPH0925056A/ja
Priority claimed from JP7174824A external-priority patent/JPH0925060A/ja
Priority claimed from JP17482695A external-priority patent/JP3428780B2/ja
Priority claimed from JP17482595A external-priority patent/JP3332674B2/ja
Priority claimed from JP8033621A external-priority patent/JPH09229987A/ja
Priority claimed from JP15411696A external-priority patent/JP3332726B2/ja
Application filed by Canon Kk filed Critical Canon Kk
Publication of MX9602624A publication Critical patent/MX9602624A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.

Landscapes

  • Photovoltaic Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

Esta invencion es para proporcionar un método de colocacion de cuerpo lineal capaz de extender un gran numero de alambres por encima de un trabajo, de manera eficiente. A fin de lograr este objeto, esta invencion proporciona un método de colocacion de cuerpo lineal para proporcionar una pluralidad de alambres colectores en un substrato revestido con una película fotosensible. La pluralidad de alambres colectores es retenida en un intervalo predeterminado entre los mismos antes de un extremo del substrato. La pluralidad de alambres conductores retenidos se estiran hacia el otro extremo del substrato, simultáneamente. El otro extremo de cada uno de los alambres colectores estirados se fija en el substrato. Subsecuentemente, mientras que los alambres colectores son retenidos en un extremo del substrato, un extremo de cada uno de los alambres colectores se fija a un extremo de substrato. Luego, los alambres colectores se cortan.
MX9602624A 1995-07-11 1996-07-04 Metodo y aparato para colocar un cuerpo lineal. MX9602624A (es)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP7174827A JPH0925056A (ja) 1995-07-11 1995-07-11 線を設ける装置におけるワイヤ切断機構及びワイヤ切断方法
JP7174824A JPH0925060A (ja) 1995-07-11 1995-07-11 線を設ける装置におけるボビン交換方法
JP17482695A JP3428780B2 (ja) 1995-07-11 1995-07-11 線を設ける装置におけるワイヤ把持機構
JP17482595A JP3332674B2 (ja) 1995-07-11 1995-07-11 線を設ける方法及び装置及び太陽電池基板
JP8033621A JPH09229987A (ja) 1996-02-21 1996-02-21 線を設ける装置におけるワイヤ断線検出装置及び方法及び断線復旧方法
JP15411696A JP3332726B2 (ja) 1996-06-14 1996-06-14 線状体の配設方法及び配設装置

Publications (1)

Publication Number Publication Date
MX9602624A true MX9602624A (es) 1997-01-31

Family

ID=27549696

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9602624A MX9602624A (es) 1995-07-11 1996-07-04 Metodo y aparato para colocar un cuerpo lineal.

Country Status (2)

Country Link
US (1) US5735967A (es)
MX (1) MX9602624A (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006006715B4 (de) * 2005-02-18 2016-10-20 Komax Holding Ag Vorrichtung und Verfahren zum Ausrichten und Befestigen eines Bandes an einer Solarzelle
KR100898979B1 (ko) * 2007-08-08 2009-05-25 주식회사 에이디피엔지니어링 기판 리프트 장치
US8662437B2 (en) * 2007-09-25 2014-03-04 Tohoku Seiki Industries, Ltd. Wire bobbin holder of bobbin cassette in wiring apparatus
JP2010067968A (ja) * 2008-09-11 2010-03-25 Komax Holding Ag 太陽素子に対して細長導体を付着するための方法および装置
CN102371320A (zh) * 2011-04-29 2012-03-14 苏州工业园区高登威科技有限公司 一种太阳能电池板切割装置
DE102011081674A1 (de) * 2011-08-26 2013-02-28 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zur elektrischen Kontaktierung von Solarzellenwafern
US20160380120A1 (en) * 2015-06-26 2016-12-29 Akira Terao Metallization and stringing for back-contact solar cells
KR102025666B1 (ko) 2016-03-24 2019-09-30 주식회사 제우스 태빙장치의 와이어 처리장치 및 방법
CN106653938B (zh) * 2016-11-11 2018-09-11 武汉帝尔激光科技股份有限公司 一种基于电池片加工的全自动掰片装置
TR202016383A1 (tr) * 2020-10-14 2022-04-21 Atatuerk Ueniversitesi Rektoerluegue Bilimsel Arastirma Projeleri Bap Koordinasyon Birimi KATMANLI Cu-GRAFEN ULTRA İLETKEN TEL ÜRETİMİ İÇİN YÖNTEM VE SİSTEM
KR102852137B1 (ko) * 2023-08-10 2025-08-29 한화솔루션 주식회사 와이어 정렬 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4348546A (en) * 1980-08-25 1982-09-07 Spire Corporation Front surface metallization and encapsulation of solar cells
JPH036867A (ja) * 1989-06-05 1991-01-14 Mitsubishi Electric Corp 光発電素子の電極構造、形成方法、及びその製造装置

Also Published As

Publication number Publication date
US5735967A (en) 1998-04-07

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Legal Events

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FG Grant or registration
MM Annulment or lapse due to non-payment of fees