MX9202065A - Composicion moldeadora epoxi para aplicaciones de montaje superficial. - Google Patents

Composicion moldeadora epoxi para aplicaciones de montaje superficial.

Info

Publication number: MX9202065A
Authority: MX; Mexico
Prior art keywords: epoxy molding; surface mounting; molding composition; mounting applications; applications
Prior art date: 1991-05-01

Application number

MX9202065A

Other languages

English (en)

Inventor

Michael Kenrick Gallagher

Michael Anthony Petti

Original Assignee

Rohm & Haas

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-05-01

Filing date

1992-04-30

Publication date

1992-12-01

1992-04-30 Application filed by Rohm & Haas filed Critical Rohm & Haas

1992-12-01 Publication of MX9202065A publication Critical patent/MX9202065A/es

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H10W74/473—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)
Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Details Of Resistors (AREA)
Knives (AREA)
Wrappers (AREA)
Paints Or Removers (AREA)

MX9202065A 1991-05-01 1992-04-30 Composicion moldeadora epoxi para aplicaciones de montaje superficial. MX9202065A (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US69388291A	1991-05-01	1991-05-01

Publications (1)

Publication Number	Publication Date
MX9202065A true MX9202065A (es)	1992-12-01

Family

ID=24786516

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
MX9202065A MX9202065A (es)	1991-05-01	1992-04-30	Composicion moldeadora epoxi para aplicaciones de montaje superficial.

Country Status (21)

Country	Link
US (1)	US5434199A (es)
EP (1)	EP0511833B1 (es)
JP (1)	JP3340462B2 (es)
KR (1)	KR100234942B1 (es)
CN (1)	CN1041578C (es)
AT (1)	ATE142370T1 (es)
AU (1)	AU660666B2 (es)
BR (1)	BR9201580A (es)
CA (1)	CA2066497A1 (es)
DE (1)	DE69213308T2 (es)
FI (1)	FI921981A7 (es)
IE (1)	IE921403A1 (es)
IL (1)	IL101664A (es)
MX (1)	MX9202065A (es)
MY (1)	MY110809A (es)
NO (1)	NO921632L (es)
NZ (1)	NZ242461A (es)
PH (1)	PH30678A (es)
SG (1)	SG38926A1 (es)
TW (1)	TW252138B (es)
ZA (1)	ZA923022B (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW398163B (en) *	1996-10-09	2000-07-11	Matsushita Electric Industrial Co Ltd	The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
JPH10195179A (ja) *	1997-01-08	1998-07-28	Shin Etsu Chem Co Ltd	半導体封止用エポキシ樹脂組成物及び半導体装置
SG63803A1 (en) *	1997-01-23	1999-03-30	Toray Industries	Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
US6214905B1 (en)	1997-12-23	2001-04-10	Cookson Singapore Pte Ltd C/O Alpha Metals, Inc.	Epoxy mold compound and method
TW459016B (en)	1998-03-13	2001-10-11	Sumitomo Chemical Co	Epoxy resin composition and resin-encapsulated semiconductor device
JP3479827B2 (ja) *	1998-04-27	2003-12-15	信越化学工業株式会社	半導体封止用エポキシ樹脂組成物及び半導体装置
US6297306B1 (en)	1998-05-15	2001-10-02	Shin-Etsu Chemical Co., Ltd.	Semiconductor encapsulating epoxy resin composition and semiconductor device
JP3388537B2 (ja) *	1998-05-15	2003-03-24	信越化学工業株式会社	半導体封止用エポキシ樹脂組成物及び半導体装置
US6291556B1 (en)	1999-03-26	2001-09-18	Shin-Etsu Chemical Co., Ltd.	Semiconductor encapsulating epoxy resin composition and semiconductor device
JP2000294692A (ja) *	1999-04-06	2000-10-20	Hitachi Ltd	樹脂封止型電子装置及びその製造方法並びにそれを使用した内燃機関用点火コイル装置
TW538482B (en)	1999-04-26	2003-06-21	Shinetsu Chemical Co	Semiconductor encapsulating epoxy resin composition and semiconductor device
JP4187062B2 (ja) *	2000-08-24	2008-11-26	電気化学工業株式会社	金属ベース回路基板
KR20030096309A (ko) *	2001-04-13	2003-12-24	이데미쓰세끼유가가꾸가부시끼가이샤	광통신 부품용 폴리아릴렌 설파이드 수지 조성물
US20050049334A1 (en) *	2003-09-03	2005-03-03	Slawomir Rubinsztain	Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
US20040166241A1 (en) *	2003-02-20	2004-08-26	Henkel Loctite Corporation	Molding compositions containing quaternary organophosphonium salts
JP4300418B2 (ja) *	2004-04-30	2009-07-22	信越化学工業株式会社	エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
WO2006075599A1 (ja) *	2005-01-13	2006-07-20	Sumitomo Bakelite Company, Ltd.	半導体封止用エポキシ樹脂組成物及び半導体装置
DE602006019896D1 (de) *	2005-11-16	2011-03-10	Basf Se	Flammwidrige prepregs und laminate für leiterplatten
US8063120B2 (en)	2006-05-12	2011-11-22	Denki Kagaku Kogyo Kabushiki Kaisha	Ceramic powder and use thereof
JP2009057500A (ja) *	2007-08-31	2009-03-19	Dow Corning Toray Co Ltd	硬化性エポキシ樹脂組成物およびその硬化物
JP5864828B2 (ja)	2007-08-31	2016-02-17	東レ・ダウコーニング株式会社	シリコーンゴムパウダーおよびその製造方法
WO2013149386A1 (zh) *	2012-04-05	2013-10-10	广东生益科技股份有限公司	环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
US9036109B2 (en) *	2012-08-20	2015-05-19	Apple Inc.	Electronic device with thermally matched light guide plate
CN107275018A (zh) *	2017-05-16	2017-10-20	东莞市晴远电子有限公司	一种无感电阻及用于该无感电阻的高导热绝缘材料
CN113474414B (zh) *	2019-02-25	2025-03-25	株式会社可乐丽	防水部件和具备其的电子设备、使用嵌入成形体的防水方法以及电子设备的防水方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4417006A (en) *	1981-06-08	1983-11-22	Material Sciences Corporation	Organopolysiloxane coating compositions
JPS62270617A (ja) *	1986-05-20	1987-11-25	Mitsui Toatsu Chem Inc	半導体封止用樹脂組成物
KR900006033B1 (ko) *	1987-05-30	1990-08-20	고려화학 주식회사	저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물
JP2595292B2 (ja) *	1988-03-17	1997-04-02	住友ベークライト株式会社	電気・電子部品封止用樹脂組成物
JPH01294765A (ja) *	1988-05-20	1989-11-28	Nippon Retsuku Kk	エポキシ樹脂組成物
JPH0229420A (ja) *	1988-07-19	1990-01-31	Matsushita Electric Works Ltd	封止用エポキシ樹脂成形材料
JPH0232117A (ja) *	1988-07-21	1990-02-01	Mitsui Toatsu Chem Inc	半導体封止用樹脂組成物
JP2660012B2 (ja) *	1988-09-13	1997-10-08	株式会社東芝	ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置
JP2641277B2 (ja) *	1988-11-30	1997-08-13	住友ベークライト株式会社	エポキシ樹脂組成物
JPH02182747A (ja) *	1989-01-09	1990-07-17	Matsushita Electric Works Ltd	エポキシ樹脂成形材料
JPH02212514A (ja) *	1989-02-14	1990-08-23	Sumitomo Bakelite Co Ltd	樹脂組成物
JP2642470B2 (ja) *	1989-02-23	1997-08-20	株式会社東芝	封止用樹脂組成物及び樹脂封止型半導体装置
JP2631233B2 (ja) *	1989-03-31	1997-07-16	一夫中野	往復回転運動を１方向回転運動に変換して取り出す装置
US5134204A (en) *	1989-05-12	1992-07-28	Mitsui Toatsu Chemicals, Inc.	Resin composition for sealing semiconductors
JPH02302422A (ja) *	1989-05-18	1990-12-14	Mitsui Toatsu Chem Inc	半導体封止用樹脂組成物
US5114991A (en) *	1990-02-26	1992-05-19	Gencorp Inc.	Paper felts or mats

1992
- 1992-04-21 CA CA 2066497 patent/CA2066497A1/en not_active Abandoned
- 1992-04-21 IL IL10166492A patent/IL101664A/en active IP Right Grant
- 1992-04-22 MY MYPI92000683A patent/MY110809A/en unknown
- 1992-04-23 NZ NZ242461A patent/NZ242461A/en unknown
- 1992-04-27 KR KR1019920007113A patent/KR100234942B1/ko not_active Expired - Fee Related
- 1992-04-27 ZA ZA923022A patent/ZA923022B/xx unknown
- 1992-04-28 AT AT92303832T patent/ATE142370T1/de not_active IP Right Cessation
- 1992-04-28 EP EP19920303832 patent/EP0511833B1/en not_active Expired - Lifetime
- 1992-04-28 AU AU15195/92A patent/AU660666B2/en not_active Ceased
- 1992-04-28 DE DE69213308T patent/DE69213308T2/de not_active Expired - Fee Related
- 1992-04-28 NO NO92921632A patent/NO921632L/no unknown
- 1992-04-28 PH PH44275A patent/PH30678A/en unknown
- 1992-04-28 SG SG1996000789A patent/SG38926A1/en unknown
- 1992-04-29 BR BR9201580A patent/BR9201580A/pt active Search and Examination
- 1992-04-30 CN CN92103962A patent/CN1041578C/zh not_active Expired - Fee Related
- 1992-04-30 FI FI921981A patent/FI921981A7/fi not_active Application Discontinuation
- 1992-04-30 MX MX9202065A patent/MX9202065A/es unknown
- 1992-05-01 JP JP11262492A patent/JP3340462B2/ja not_active Expired - Fee Related
- 1992-05-07 TW TW81103553A patent/TW252138B/zh active
- 1992-07-01 IE IE140392A patent/IE921403A1/en not_active IP Right Cessation
1994
- 1994-10-07 US US08/320,097 patent/US5434199A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
FI921981L (fi)	1992-11-02
CN1041578C (zh)	1999-01-06
FI921981A0 (fi)	1992-04-30
IL101664A0 (en)	1992-12-30
IL101664A (en)	1996-01-31
DE69213308T2 (de)	1997-01-30
MY110809A (en)	1999-05-31
CA2066497A1 (en)	1992-11-02
ATE142370T1 (de)	1996-09-15
AU660666B2 (en)	1995-07-06
BR9201580A (pt)	1992-12-15
NZ242461A (en)	1994-04-27
EP0511833B1 (en)	1996-09-04
KR920021646A (ko)	1992-12-18
KR100234942B1 (ko)	1999-12-15
JP3340462B2 (ja)	2002-11-05
PH30678A (en)	1997-09-16
NO921632D0 (no)	1992-04-28
IE921403A1 (en)	1992-11-04
FI921981A7 (fi)	1992-11-02
EP0511833A3 (en)	1992-12-30
JPH05152467A (ja)	1993-06-18
CN1069147A (zh)	1993-02-17
NO921632L (no)	1992-11-02
TW252138B (es)	1995-07-21
AU1519592A (en)	1992-11-05
DE69213308D1 (de)	1996-10-10
SG38926A1 (en)	1999-09-21
EP0511833A2 (en)	1992-11-04
US5434199A (en)	1995-07-18
ZA923022B (en)	1992-12-30

Publication	Publication Date	Title
MX9202065A (es)	1992-12-01	Composicion moldeadora epoxi para aplicaciones de montaje superficial.
DE58909861D1 (de)	1999-11-25	Reaktiver Schmelzklebstoff
ATE271577T1 (de)	2004-08-15	Wärmehärtbare harze aus maleinimiden und/oder vinylderivaten
BR9006347A (pt)	1991-09-24	Composicoes de revestimento,de latex curavel,em dois componentes,processo para prover um revestimento protetor sobre uma superficie de concreto de cimento portland e artigo
DE60109366D1 (de)	2005-04-21	Klebstoff auf der Basis von Epoxidharzen mit Allyl- oder Vinylgruppen zur Befestigung von Halbleitern
DE69129476D1 (de)	1998-07-02	Elastomer-modifiziertes Epoxydharz für Pulverbeschichtungszusammensetzungen
NO983859D0 (no)	1998-08-21	Beleggingssammensetninger inneholdende en bicyclo- eller spiro-ortoesterfunksjonell forbindelse
ATE24329T1 (de)	1987-01-15	Klebende thermoplastische zusammensetzungen.
EP0867475A3 (en)	1998-11-18	Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
DE68923152D1 (de)	1995-07-27	Epoxyharz und siliciumhaltiges Elastomer umfassende härtbare Zweikomponentenzusammensetzung.
DE69121926D1 (de)	1996-10-17	Kautschuk-modifizierte Epoxyharzzusammensetzungen
ATE123502T1 (de)	1995-06-15	Härtbare epoxydharzzusammensetzungen.
DE59010594D1 (de)	1997-01-23	Tropfenabdeckmassen für elektrische und elektronische Bauelemente
ES2107440T3 (es)	1997-12-01	Agente de curado para resinas epoxi.
ATE267855T1 (de)	2004-06-15	Bei niedriger temperatur härtbare einkomponenten- pulverbeschichtungszusammensetzung
EP0197524A3 (en)	1988-11-17	Curable epoxy-acrylamide compositions
IT1237828B (it)	1993-06-18	Composizione a base di resine poliestere con duplice azione di colla e stucco, utilizzabile su materiali di diversa natura.
ATE356159T1 (de)	2007-03-15	Bei niedriger temperatur härtbare epoxid- pulverbeschichtungszusammensetzung