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MX2024001470A - Metodo de analisis y/o mantenimiento de sistemas de fabricacion. - Google Patents

Metodo de analisis y/o mantenimiento de sistemas de fabricacion.

Info

Publication number
MX2024001470A
MX2024001470A MX2024001470A MX2024001470A MX2024001470A MX 2024001470 A MX2024001470 A MX 2024001470A MX 2024001470 A MX2024001470 A MX 2024001470A MX 2024001470 A MX2024001470 A MX 2024001470A MX 2024001470 A MX2024001470 A MX 2024001470A
Authority
MX
Mexico
Prior art keywords
maintenance
analysis
manufacturing systems
factory
defects
Prior art date
Application number
MX2024001470A
Other languages
English (en)
Inventor
Timothy Matthew Burke
Andrew Galen Scheuermann
Original Assignee
Arch Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arch Systems Inc filed Critical Arch Systems Inc
Publication of MX2024001470A publication Critical patent/MX2024001470A/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0895—Maintenance systems or processes, e.g. indicating need for maintenance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32221—Correlation between defect and measured parameters to find origin of defect
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32222—Fault, defect detection of origin of fault, defect of product
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32226—Computer assisted repair, maintenance of system components
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32234—Maintenance planning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2223/00—Indexing scheme associated with group G05B23/00
    • G05B2223/02—Indirect monitoring, e.g. monitoring production to detect faults of a system

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Un método para el análisis y/o mantenimiento de fábricas, que preferentemente incluye la recepción de información de la fábrica y/o la asociación de defectos con componentes de la fábrica, y que opcionalmente incluye la actuación basada en las asociaciones de defectos y/o el funcionamiento de las máquinas de la fábrica. El método se asocia preferentemente a uno o varios sistemas de fabricación y/o elementos de los mismos.
MX2024001470A 2021-08-02 2022-08-02 Metodo de analisis y/o mantenimiento de sistemas de fabricacion. MX2024001470A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163228495P 2021-08-02 2021-08-02
US202263306375P 2022-02-03 2022-02-03
PCT/US2022/039158 WO2023014708A1 (en) 2021-08-02 2022-08-02 Method for manufacturing system analysis and/or maintenance

Publications (1)

Publication Number Publication Date
MX2024001470A true MX2024001470A (es) 2024-02-27

Family

ID=85038936

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2024001470A MX2024001470A (es) 2021-08-02 2022-08-02 Metodo de analisis y/o mantenimiento de sistemas de fabricacion.

Country Status (6)

Country Link
US (1) US11598801B2 (es)
EP (1) EP4381282A4 (es)
JP (1) JP7802910B2 (es)
IL (1) IL310238A (es)
MX (1) MX2024001470A (es)
WO (1) WO2023014708A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115775102A (zh) * 2021-09-07 2023-03-10 鸿富锦精密电子（成都）有限公司 产品不良监控方法、电子装置及存储介质
US11947340B1 (en) * 2022-08-26 2024-04-02 Arch Systems Inc. System and method for machine program analysis
US11886177B1 (en) 2022-08-26 2024-01-30 Arch Systems Inc. System and method for manufacturing system data analysis

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245421A (en) * 1990-09-19 1993-09-14 Control Automation, Incorporated Apparatus for inspecting printed circuit boards with surface mounted components
US7486813B2 (en) * 1998-10-08 2009-02-03 Easton Hunt Capital Partners, L.P. Electronic assembly video inspection system
US6760471B1 (en) * 2000-06-23 2004-07-06 Teradyne, Inc. Compensation system and related techniques for use in a printed circuit board inspection system
FR2812958B1 (fr) * 2000-08-11 2002-11-08 Thomson Csf Systeme de maintenance pour un ensemble d'equipements
JP4350473B2 (ja) * 2002-09-13 2009-10-21 パナソニック株式会社 品質分析システム及び品質分析方法
JP2004214394A (ja) * 2002-12-27 2004-07-29 Matsushita Electric Ind Co Ltd 実装品質分析方法
JP4617998B2 (ja) * 2005-05-18 2011-01-26 オムロン株式会社 不良要因分析システム
US8496499B2 (en) 2006-04-05 2013-07-30 Pulse Electronics, Inc. Modular electronic header assembly and methods of manufacture
WO2007123238A1 (ja) * 2006-04-25 2007-11-01 Sharp Kabushiki Kaisha 不良原因設備特定システム
EP2902861B1 (en) * 2012-09-28 2020-11-18 FUJI Corporation Production line monitoring device
JP5930405B2 (ja) * 2013-06-24 2016-06-08 Ｎｅｃフィールディング株式会社 検査システム、検査方法及び端末
JP6264072B2 (ja) * 2014-02-10 2018-01-24 オムロン株式会社 品質管理装置及びその制御方法
US10051898B2 (en) * 2015-09-24 2018-08-21 Loomia Technologies, Inc. Smart soft good product, circuitry layer, and methods
US10789701B2 (en) 2017-04-13 2020-09-29 Instrumental, Inc. Method for predicting defects in assembly units
JP6671464B2 (ja) * 2016-04-19 2020-03-25 東京エレクトロン株式会社 処理装置のメンテナンス制御方法及び制御装置
US10360671B2 (en) 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching
CN111421954B (zh) * 2019-01-10 2022-02-18 鸿富锦精密电子(天津)有限公司 智能判定回馈方法及装置

Also Published As

Publication number Publication date
JP7802910B2 (ja) 2026-01-20
US20230032751A1 (en) 2023-02-02
JP2024531106A (ja) 2024-08-29
IL310238A (en) 2024-03-01
WO2023014708A1 (en) 2023-02-09
EP4381282A1 (en) 2024-06-12
EP4381282A4 (en) 2025-06-11
US11598801B2 (en) 2023-03-07

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