MX2019006540A - Producto estañado y método para producir el mismo. - Google Patents
Producto estañado y método para producir el mismo.Info
- Publication number
- MX2019006540A MX2019006540A MX2019006540A MX2019006540A MX2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A
- Authority
- MX
- Mexico
- Prior art keywords
- layer
- plating
- plating material
- production method
- alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Se proporciona un producto estañado el cual tiene una capa de revestimiento de zinc sobre la superficie del mismo y la cual tiene buena resistencia a la corrosión y buena adhesión del revestimiento de zinc aún si la porción de conexión de una terminal del producto estañado a un cable eléctrico de aluminio o una aleación de aluminio no es procesada durante un ajuste a presión como estampado (o calafateado) cuando el producto estañado es usado como el material de la terminal la cual puede estar conectada al cable eléctrico por ajuste a presión y un método para producir el mismo. El producto estañado tiene: un material base 10 de cobre o una aleación de cobre; una capa que contiene estaño 12 formada sobre la superficie del material base 10, la capa que contiene estaño 12 tiene una capa de 10 aleación de cobre-estaño 121 y una capa de estaño 122 de estaño la cual es formada sobre la superficie de la capa de aleación de cobre-estaño 121 y la cual tiene un espesor no mayor de 5 µm; una capa de revestimiento de níquel 14 formada sobre la superficie de la capa que contiene estaño 12; y una capa de revestimiento de zinc 16 que sirve como la capa más externa formada sobre la superficie de la capa de revestimiento de níquel 14.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016236780A JP6734185B2 (ja) | 2016-12-06 | 2016-12-06 | Snめっき材およびその製造方法 |
| JP2017056366 | 2017-03-22 | ||
| JP2017221415A JP6940380B2 (ja) | 2017-03-22 | 2017-11-17 | Snめっき材およびその製造方法 |
| PCT/JP2017/041827 WO2018105388A1 (ja) | 2016-12-06 | 2017-11-21 | Snめっき材およびその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2019006540A true MX2019006540A (es) | 2019-08-01 |
Family
ID=67145440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2019006540A MX2019006540A (es) | 2016-12-06 | 2017-11-21 | Producto estañado y método para producir el mismo. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10985485B2 (es) |
| CN (1) | CN110036142B (es) |
| DE (1) | DE112017005628B4 (es) |
| MX (1) | MX2019006540A (es) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI3904549T3 (fi) | 2018-12-26 | 2023-10-19 | Mitsubishi Materials Corp | Kupariseoslevy, pinnoitekalvoon liitetty kupariseoslevy, ja menetelmät vastaavasti näiden tuotteiden valmistamiseksi |
| JP6957568B2 (ja) * | 2019-08-09 | 2021-11-02 | 株式会社オートネットワーク技術研究所 | 端子付き電線 |
| JP6936836B2 (ja) | 2019-08-09 | 2021-09-22 | 株式会社オートネットワーク技術研究所 | 端子付き電線 |
| JP7223332B2 (ja) | 2019-09-19 | 2023-02-16 | 株式会社オートネットワーク技術研究所 | ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット |
| JP7226209B2 (ja) | 2019-09-19 | 2023-02-21 | 株式会社オートネットワーク技術研究所 | ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット |
| CN116844754B (zh) * | 2023-08-09 | 2024-08-13 | 嘉铝(上海)科技发展有限公司 | 一种线缆用镀锡铝合金导体材料及其制备方法、应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5780172A (en) * | 1995-12-18 | 1998-07-14 | Olin Corporation | Tin coated electrical connector |
| EP1352993B1 (en) * | 2001-01-19 | 2011-05-11 | The Furukawa Electric Co., Ltd. | A method for preparation of metal-plated material |
| JP4402132B2 (ja) * | 2007-05-18 | 2010-01-20 | 日鉱金属株式会社 | リフローSnめっき材及びそれを用いた電子部品 |
| EP2267187A4 (en) * | 2008-03-31 | 2014-01-01 | Furukawa Electric Co Ltd | METALWORK FOR CONNECTING PART AND METHOD OF MANUFACTURING THEREOF |
| JP5284526B1 (ja) * | 2011-10-04 | 2013-09-11 | Jx日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法 |
| JP5882723B2 (ja) | 2011-12-26 | 2016-03-09 | 矢崎総業株式会社 | 端子 |
| JP5789207B2 (ja) * | 2012-03-07 | 2015-10-07 | 株式会社神戸製鋼所 | 嵌合型接続端子用Sn被覆層付き銅合金板及び嵌合型接続端子 |
| TWI485930B (zh) * | 2012-10-04 | 2015-05-21 | Jx Nippon Mining & Metals Corp | Metal material for electronic parts and manufacturing method thereof |
| JP2015053251A (ja) * | 2013-02-24 | 2015-03-19 | 古河電気工業株式会社 | 端子の製造方法、端子、電線の終端接続構造体の製造方法、および電線の終端接続構造体 |
| JP6221695B2 (ja) * | 2013-03-25 | 2017-11-01 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
| JP2015110829A (ja) * | 2013-10-30 | 2015-06-18 | 三菱マテリアル株式会社 | 錫めっき銅合金端子材 |
| JP6445895B2 (ja) * | 2014-03-04 | 2018-12-26 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
| WO2016031654A1 (ja) * | 2014-08-25 | 2016-03-03 | 株式会社神戸製鋼所 | 耐微摺動摩耗性に優れる接続部品用導電材料 |
| JP5897083B1 (ja) | 2014-08-25 | 2016-03-30 | 株式会社神戸製鋼所 | 耐微摺動摩耗性に優れる接続部品用導電材料 |
| JP6740635B2 (ja) * | 2015-03-13 | 2020-08-19 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及びその製造方法並びに電線端末部構造 |
-
2017
- 2017-11-21 MX MX2019006540A patent/MX2019006540A/es unknown
- 2017-11-21 CN CN201780075131.8A patent/CN110036142B/zh active Active
- 2017-11-21 US US16/462,695 patent/US10985485B2/en active Active
- 2017-11-21 DE DE112017005628.4T patent/DE112017005628B4/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE112017005628B4 (de) | 2023-09-14 |
| CN110036142B (zh) | 2021-04-20 |
| US10985485B2 (en) | 2021-04-20 |
| DE112017005628T5 (de) | 2019-07-25 |
| US20200076103A1 (en) | 2020-03-05 |
| CN110036142A (zh) | 2019-07-19 |
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