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MX2018007193A - Deposicion electroquimica de elementos en medios acuosos. - Google Patents

Deposicion electroquimica de elementos en medios acuosos.

Info

Publication number
MX2018007193A
MX2018007193A MX2018007193A MX2018007193A MX2018007193A MX 2018007193 A MX2018007193 A MX 2018007193A MX 2018007193 A MX2018007193 A MX 2018007193A MX 2018007193 A MX2018007193 A MX 2018007193A MX 2018007193 A MX2018007193 A MX 2018007193A
Authority
MX
Mexico
Prior art keywords
elements
aqueous media
electrochemical deposition
electrodeposition
atm
Prior art date
Application number
MX2018007193A
Other languages
English (en)
Inventor
Nulwala Hunaid
Zhou Xu
D Watkins John
Original Assignee
Lumishield Tech Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumishield Tech Incorporated filed Critical Lumishield Tech Incorporated
Publication of MX2018007193A publication Critical patent/MX2018007193A/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/42Electroplating: Baths therefor from solutions of light metals
    • C25D3/44Aluminium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/54Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/08Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating using gases, e.g. pressure influence
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16Electroplating with layers of varying thickness
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

La descripción se refiere a un método para la electrodeposición de al menos un metal sobre una superficie de un sustrato conductor. En algunas modalidades, la electrodeposición se lleva a cabo a una temperatura de aproximadamente 10°C a aproximadamente 70°C, aproximadamente 0.5 atm (50.662 kPa) a aproximadamente 5 atm (506.62 kPa), en una atmósfera que comprende oxígeno. En algunas modalidades, el método comprende electrodepositar el al menos un metal a través de reducción electroquímica de un complejo de metal disuelto en un medio sustancialmente acuoso.
MX2018007193A 2016-02-16 2016-02-16 Deposicion electroquimica de elementos en medios acuosos. MX2018007193A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/018050 WO2017142513A1 (en) 2016-02-16 2016-02-16 Electrochemical deposition of elements in aqueous media

Publications (1)

Publication Number Publication Date
MX2018007193A true MX2018007193A (es) 2018-08-23

Family

ID=55442889

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018007193A MX2018007193A (es) 2016-02-16 2016-02-16 Deposicion electroquimica de elementos en medios acuosos.

Country Status (13)

Country Link
US (1) US20190256994A1 (es)
EP (1) EP3417097B1 (es)
JP (1) JP6718509B2 (es)
KR (1) KR102174846B1 (es)
CN (1) CN108779566A (es)
AU (1) AU2016393673B2 (es)
BR (1) BR112018016802A2 (es)
CA (1) CA3009779C (es)
ES (1) ES2877331T3 (es)
IL (1) IL260354A (es)
MX (1) MX2018007193A (es)
PL (1) PL3417097T3 (es)
WO (1) WO2017142513A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018222977A1 (en) * 2017-06-01 2018-12-06 Lumishield Technologies Incorporated Methods and compositions for electrochemical deposition of metal rich layers in aqueous solutions
WO2020160531A1 (en) * 2019-02-01 2020-08-06 Lumishield Technologies Incorporated Methods and compositions for improved adherence of organic coatings to materials
CN111636078B (zh) * 2020-07-24 2023-11-10 宁波革创新材料科技有限公司 一种水性电镀多孔铝的方法
KR102565001B1 (ko) 2020-12-01 2023-08-09 주식회사 엘지화학 양극 활물질 전구체, 이의 제조방법 및 이를 이용한 양극 활물질의 제조방법

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FR529229A (fr) * 1920-07-27 1921-11-25 Noren Leonie Procédé permettant de recouvrir d'une couche d'aluminium, un fil ou autre objet en cuivre
DE2453829C2 (de) * 1974-11-13 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Additiven und ihre Verwendung als Glanzbildner
US4601958A (en) 1984-09-26 1986-07-22 Allied Corporation Plated parts and their production
EP0786539A2 (en) * 1996-01-26 1997-07-30 Elf Atochem North America, Inc. High current density zinc organosulfonate electrogalvanizing process and composition
JP3039374B2 (ja) * 1996-05-30 2000-05-08 住友金属工業株式会社 耐燃料腐食性に優れためっき鋼板
EP1162289A1 (en) * 2000-06-08 2001-12-12 Lucent Technologies Inc. Palladium electroplating bath and process for electroplating
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7371467B2 (en) * 2002-01-08 2008-05-13 Applied Materials, Inc. Process chamber component having electroplated yttrium containing coating
KR20060009930A (ko) * 2003-05-12 2006-02-01 알케마 인코포레이티드 고순도 설폰산 전해질 용액
CA2526401C (en) * 2003-05-19 2010-03-23 Arkema Inc. Zinc lanthanide sulfonic acid electrolytes
KR100855531B1 (ko) * 2004-04-13 2008-09-01 어플라이드 머티어리얼스, 인코포레이티드 전기 도금된 이트륨 함유 코팅을 갖는 프로세스 챔버 요소
US20080257744A1 (en) * 2007-04-19 2008-10-23 Infineon Technologies Ag Method of making an integrated circuit including electrodeposition of aluminium
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JP2014156614A (ja) * 2011-04-11 2014-08-28 Hitachi Ltd 電気アルミニウムめっき液
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WO2016004189A1 (en) * 2014-07-03 2016-01-07 Nulwala Hunaid B Selected compositions for aluminum processes and devices

Also Published As

Publication number Publication date
EP3417097A1 (en) 2018-12-26
EP3417097B1 (en) 2021-04-07
IL260354A (en) 2018-08-30
AU2016393673A1 (en) 2018-06-28
ES2877331T3 (es) 2021-11-16
WO2017142513A1 (en) 2017-08-24
US20190256994A1 (en) 2019-08-22
AU2016393673B2 (en) 2020-04-30
JP6718509B2 (ja) 2020-07-08
CN108779566A (zh) 2018-11-09
KR20180107101A (ko) 2018-10-01
CA3009779C (en) 2021-03-23
KR102174846B1 (ko) 2020-11-05
JP2019505665A (ja) 2019-02-28
PL3417097T3 (pl) 2021-11-02
BR112018016802A2 (pt) 2018-12-26
CA3009779A1 (en) 2017-08-24

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