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MX2018003285A - Disposicion de tarjeta de circuito impreso para aparatos de soldadura y corte. - Google Patents

Disposicion de tarjeta de circuito impreso para aparatos de soldadura y corte.

Info

Publication number
MX2018003285A
MX2018003285A MX2018003285A MX2018003285A MX2018003285A MX 2018003285 A MX2018003285 A MX 2018003285A MX 2018003285 A MX2018003285 A MX 2018003285A MX 2018003285 A MX2018003285 A MX 2018003285A MX 2018003285 A MX2018003285 A MX 2018003285A
Authority
MX
Mexico
Prior art keywords
pcb
printed circuit
power supply
provision
welding
Prior art date
Application number
MX2018003285A
Other languages
English (en)
Inventor
Gharib Awad
Anjanappa Muniswamappa
SANGHAVI Pranav
Original Assignee
Esab Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esab Group Inc filed Critical Esab Group Inc
Publication of MX2018003285A publication Critical patent/MX2018003285A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/013—Arc cutting, gouging, scarfing or desurfacing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/10—Other electric circuits therefor; Protective circuits; Remote controls
    • B23K9/1006—Power supply
    • B23K9/1043—Power supply characterised by the electric circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/16—Arc welding or cutting making use of shielding gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/32—Accessories
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dc-Dc Converters (AREA)
  • Inverter Devices (AREA)
  • Arc Welding Control (AREA)
  • Generation Of Surge Voltage And Current (AREA)

Abstract

Un suministro de energía para proporcionar energía de soldadura. El suministro de energía puede incluir una primera tarjeta de circuito impreso (PCB) dispuesta en un lado primario del suministro de energía; un primer conjunto de componentes montados en la primera PCB; una segunda PCB dispuesta en un lado secundario del suministro de energía; un segundo conjunto de componentes montados en la segunda PCB; una fase de transformador acoplada a la primera PCB y a la segunda PCB, en donde la primera PCB y la segunda PCB se pueden separar de manera independiente del suministro de energía.
MX2018003285A 2015-09-18 2016-09-16 Disposicion de tarjeta de circuito impreso para aparatos de soldadura y corte. MX2018003285A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562220544P 2015-09-18 2015-09-18
PCT/US2016/052068 WO2017049041A1 (en) 2015-09-18 2016-09-16 Printed circuit board arrangement for welding and cutting apparatus

Publications (1)

Publication Number Publication Date
MX2018003285A true MX2018003285A (es) 2018-05-16

Family

ID=57121508

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018003285A MX2018003285A (es) 2015-09-18 2016-09-16 Disposicion de tarjeta de circuito impreso para aparatos de soldadura y corte.

Country Status (8)

Country Link
US (1) US11081969B2 (es)
EP (1) EP3351060A1 (es)
CN (1) CN108029190B (es)
AU (2) AU2016323585B2 (es)
BR (1) BR112018004927A2 (es)
CA (1) CA2998178A1 (es)
MX (1) MX2018003285A (es)
WO (1) WO2017049041A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2018003285A (es) 2015-09-18 2018-05-16 Esab Group Inc Disposicion de tarjeta de circuito impreso para aparatos de soldadura y corte.

Family Cites Families (32)

* Cited by examiner, † Cited by third party
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JP4450104B2 (ja) * 2008-04-30 2010-04-14 ダイキン工業株式会社 接続部材の取付構造及び冷凍装置
JP4816788B2 (ja) * 2009-10-29 2011-11-16 ダイキン工業株式会社 配線基板ユニット
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KR20130134786A (ko) * 2012-05-31 2013-12-10 주식회사 실리콘웍스 Led 램프 구동을 위한 전원 회로 및 전원 공급 방법 그리고 플라이백 트랜스포머의 일차측 제어 회로
TWM449340U (zh) * 2012-06-06 2013-03-21 Power Mate Technology Co Ltd 小型化變壓裝置
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Also Published As

Publication number Publication date
CA2998178A1 (en) 2017-03-23
WO2017049041A1 (en) 2017-03-23
AU2016323585A1 (en) 2018-04-05
BR112018004927A2 (pt) 2018-10-09
AU2016323585B2 (en) 2019-01-31
US20180254713A1 (en) 2018-09-06
AU2019201725A1 (en) 2019-04-04
US11081969B2 (en) 2021-08-03
CN108029190A (zh) 2018-05-11
CN108029190B (zh) 2020-06-12
EP3351060A1 (en) 2018-07-25
AU2019201725B2 (en) 2020-10-15

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