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MX2018001527A - Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje. - Google Patents

Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje.

Info

Publication number
MX2018001527A
MX2018001527A MX2018001527A MX2018001527A MX2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A MX 2018001527 A MX2018001527 A MX 2018001527A
Authority
MX
Mexico
Prior art keywords
molded body
high voltage
electric device
voltage applications
electrical component
Prior art date
Application number
MX2018001527A
Other languages
English (en)
Other versions
MX388187B (es
Inventor
Glenn Darin
BLACKBURN Scott
Original Assignee
Vishay Dale Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Dale Electronics Llc filed Critical Vishay Dale Electronics Llc
Publication of MX2018001527A publication Critical patent/MX2018001527A/es
Publication of MX388187B publication Critical patent/MX388187B/es

Links

Classifications

    • H10W70/421—
    • H10W20/20—
    • H10W42/60—
    • H10W70/464—
    • H10W70/475—
    • H10W70/481—
    • H10W74/111—
    • H10W90/811—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

Se proporciona un dispositivo eléctrico que comprende un cuerpo moldeado estriado que aloja un componente eléctrico. El cuerpo moldeado estriado incluye al menos una superficie o porción que tiene una pluralidad de estrías a lo largo de al menos una porción de la superficie. El componente eléctrico puede ser un componente eléctrico pasivo o activo. El componente eléctrico puede conectarse a un bastidor de conductores y moldearse en el cuerpo moldeado estriado.
MX2018001527A 2015-08-07 2016-08-04 Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje. MX388187B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562202580P 2015-08-07 2015-08-07
PCT/US2016/045534 WO2017027315A1 (en) 2015-08-07 2016-08-04 Molded body and electrical device having a molded body for high voltage applications

Publications (2)

Publication Number Publication Date
MX2018001527A true MX2018001527A (es) 2018-05-17
MX388187B MX388187B (es) 2025-03-19

Family

ID=57983699

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018001527A MX388187B (es) 2015-08-07 2016-08-04 Cuerpo moldeado y dispositivo electrico que tiene un cuerpo moldeado para aplicaciones de alto voltaje.

Country Status (13)

Country Link
US (2) US9865532B2 (es)
EP (1) EP3332421B1 (es)
JP (1) JP7042738B2 (es)
KR (1) KR102536008B1 (es)
CN (2) CN116314100A (es)
CA (1) CA2995090A1 (es)
ES (1) ES2974813T3 (es)
HK (1) HK1256144A1 (es)
HU (1) HUE066244T2 (es)
IL (1) IL257339B (es)
MX (1) MX388187B (es)
TW (1) TWI708269B (es)
WO (1) WO2017027315A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013005939A1 (de) * 2013-04-05 2014-10-09 Isabellenhütte Heusler Gmbh & Co. Kg Messwiderstand und entsprechendes Messverfahren
CN116314100A (zh) 2015-08-07 2023-06-23 韦沙戴尔电子有限公司 模制体和用于高电压应用的具有模制体的电气装置
US10483178B2 (en) * 2017-01-03 2019-11-19 Infineon Technologies Ag Semiconductor device including an encapsulation material defining notches
CN110165442B (zh) * 2018-02-12 2020-11-03 泰达电子股份有限公司 金属块焊接柱组合及其应用的电源模块
JP7169771B2 (ja) * 2018-05-25 2022-11-11 Koa株式会社 抵抗器
WO2020011732A1 (en) * 2018-07-11 2020-01-16 Lem International Sa Current transducer with integrated primary conductor
US11682606B2 (en) * 2019-02-07 2023-06-20 Ford Global Technologies, Llc Semiconductor with integrated electrically conductive cooling channels
JP7762552B2 (ja) * 2021-12-07 2025-10-30 Koa株式会社 電子部品
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1056862S1 (en) 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package
JPWO2024177013A1 (es) * 2023-02-20 2024-08-29
CN117766470B (zh) * 2024-02-20 2024-05-14 北京怀柔实验室 半导体器件的封装结构和封装方法

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US696757A (en) 1901-09-05 1902-04-01 Gen Electric Shunt for electrical instruments.
US779737A (en) 1904-08-18 1905-01-10 Gen Electric Shunt for electrical measuring instruments.
US859255A (en) 1905-01-13 1907-07-09 Gen Electric Shunt for electrical measuring instruments.
US3238489A (en) * 1962-06-11 1966-03-01 Dale Electronics Electrical resistor
US3795046A (en) * 1972-04-05 1974-03-05 Sprague Electric Co Method of making a heat sinked resistor
JPS556086Y2 (es) * 1973-07-12 1980-02-12
US4159459A (en) 1977-06-23 1979-06-26 Angstrohm Precision, Inc. Non-inductive cylindrical thin film resistor
JPS5517324U (es) * 1978-07-18 1980-02-04
US4529958A (en) * 1983-05-02 1985-07-16 Dale Electronics, Inc. Electrical resistor
US4906802A (en) * 1988-02-18 1990-03-06 Neal Castleman Molded chip carrier
JPH03222350A (ja) * 1990-01-29 1991-10-01 Hitachi Ltd 樹脂封止形半導体装置及びその実装構造
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
JPH0677354A (ja) 1992-08-24 1994-03-18 Hitachi Ltd 半導体装置
JP3238803B2 (ja) * 1993-08-24 2001-12-17 ローム株式会社 面実装型有極性電子部品の基板実装構造
JPH0766325A (ja) * 1993-08-26 1995-03-10 Rohm Co Ltd 合成樹脂パッケージ型電子部品の構造
US5481241A (en) 1993-11-12 1996-01-02 Caddock Electronics, Inc. Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink
US5582240A (en) 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
JPH0897333A (ja) * 1994-09-29 1996-04-12 Tokin Corp 半導体モールドパッケージ
US5604477A (en) 1994-12-07 1997-02-18 Dale Electronics, Inc. Surface mount resistor and method for making same
US5835679A (en) 1994-12-29 1998-11-10 Energy Converters, Inc. Polymeric immersion heating element with skeletal support and optional heat transfer fins
US5709960A (en) * 1996-06-21 1998-01-20 Motorola, Inc. Mold compound
TW379276B (en) * 1997-04-10 2000-01-11 Ver Zur Forderung Des Inst Fur Porous flow-through molded body and method for its production
EP0926733B1 (en) 1997-12-16 2004-03-17 STMicroelectronics S.r.l. Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink
JP3871802B2 (ja) * 1998-04-14 2007-01-24 松下電器産業株式会社 樹脂成形基板及び樹脂成形基板の製造方法
JP2000306935A (ja) 1999-04-23 2000-11-02 Hitachi Maxell Ltd 半導体装置及びその製造方法
US6392208B1 (en) 1999-08-06 2002-05-21 Watlow Polymer Technologies Electrofusing of thermoplastic heating elements and elements made thereby
US6617685B1 (en) 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
US6181234B1 (en) 1999-12-29 2001-01-30 Vishay Dale Electronics, Inc. Monolithic heat sinking resistor
US6680015B2 (en) 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
DE10017741A1 (de) * 2000-04-10 2001-10-25 Infineon Technologies Ag Gehäuse für Halbleiterchips
CN1181509C (zh) * 2000-09-14 2004-12-22 松下电工株式会社 电磁装置和高电压发生装置及电磁装置的制造方法
US7119447B2 (en) 2001-03-28 2006-10-10 International Rectifier Corporation Direct fet device for high frequency application
JP2003100749A (ja) 2001-09-20 2003-04-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
US20030139510A1 (en) 2001-11-13 2003-07-24 Sagal E. Mikhail Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom
US20030116552A1 (en) 2001-12-20 2003-06-26 Stmicroelectronics Inc. Heating element for microfluidic and micromechanical applications
KR100958422B1 (ko) * 2003-01-21 2010-05-18 페어차일드코리아반도체 주식회사 고전압 응용에 적합한 구조를 갖는 반도체 패키지
JP4059181B2 (ja) * 2003-09-29 2008-03-12 株式会社村田製作所 多端子型積層セラミック電子部品の製造方法
US7345364B2 (en) 2004-02-04 2008-03-18 Agere Systems Inc. Structure and method for improved heat conduction for semiconductor devices
US7190068B2 (en) 2004-06-25 2007-03-13 Intel Corporation Bottom heat spreader
DE202004018188U1 (de) * 2004-11-23 2005-03-03 Hübener, Paul Vorrichtung zur Herstellung von Teigtaschen
US7692148B2 (en) 2005-01-26 2010-04-06 Analog Devices, Inc. Thermal sensor with thermal barrier
US7718967B2 (en) 2005-01-26 2010-05-18 Analog Devices, Inc. Die temperature sensors
US7190252B2 (en) 2005-02-25 2007-03-13 Vishay Dale Electronics, Inc. Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same
US7166913B2 (en) 2005-04-19 2007-01-23 International Business Machines Corporation Heat dissipation for heat generating element of semiconductor device and related method
US7671455B2 (en) 2005-11-02 2010-03-02 International Rectifier Corporation Semiconductor device package with integrated heat spreader
JP2006108721A (ja) 2006-01-16 2006-04-20 Matsushita Electric Works Ltd 電磁装置
JP4301248B2 (ja) 2006-01-16 2009-07-22 パナソニック電工株式会社 電磁装置
KR101221805B1 (ko) * 2006-03-03 2013-01-14 페어차일드코리아반도체 주식회사 전력 소자용 패키지 및 패키지 어셈블리
JP4846434B2 (ja) 2006-05-09 2011-12-28 コーア株式会社 セメント抵抗器
JP5076549B2 (ja) 2007-02-23 2012-11-21 株式会社デンソー 半導体装置
DE112008001425T5 (de) 2007-05-25 2010-04-15 Molex Inc., Lisle Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet
WO2009005108A1 (ja) 2007-06-29 2009-01-08 Koa Corporation 抵抗器
MY154596A (en) * 2007-07-25 2015-06-30 Carsem M Sdn Bhd Thin plastic leadless package with exposed metal die paddle
JP4982894B2 (ja) 2007-08-03 2012-07-25 コーア株式会社 セメント抵抗器
US7843309B2 (en) 2007-09-27 2010-11-30 Vishay Dale Electronics, Inc. Power resistor
US20090154111A1 (en) 2007-12-17 2009-06-18 Lynch Thomas W Reticulated heat dissipation
TWI355068B (en) * 2008-02-18 2011-12-21 Cyntec Co Ltd Electronic package structure
US7763970B2 (en) 2008-02-27 2010-07-27 Infineon Technologies Ag Power module
DE102009004136B4 (de) 2009-01-06 2011-09-01 Phoenix Contact Gmbh & Co. Kg Elektrische Anschlussklemme zum Durchführen einer Leitung durch eine Wandung
USD613258S1 (en) 2009-05-15 2010-04-06 Koninklije Philips Electronics N.V. Heatsink
US8946881B2 (en) * 2010-08-04 2015-02-03 Fairchild Semiconductor Corporation High-voltage packaged device
US9646755B2 (en) 2010-11-15 2017-05-09 Pulse Electronics, Inc. Advanced electronic header apparatus and methods
EP2705530B1 (en) 2011-05-03 2018-07-04 Vishay Dale Electronics, Inc. Heat spreader for electrical components
JP5683419B2 (ja) * 2011-09-14 2015-03-11 ホシデン株式会社 コネクタ及びこれを備えた電子機器
US9812588B2 (en) * 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
DE102012102567B4 (de) 2012-03-26 2016-02-25 Phoenix Contact Gmbh & Co. Kg Verschiebbare Isolationsbarriere
US8575767B1 (en) * 2012-10-06 2013-11-05 Ixys Corporation Reflow of thermoplastic sheet for passivation of power integrated circuits
JP6099135B2 (ja) 2013-03-27 2017-03-22 日本電気通信システム株式会社 電子機器、実装基板、及び実装基板の製造方法
JP6152615B2 (ja) 2013-03-28 2017-06-28 Fdk株式会社 巻線部品
CN116314100A (zh) 2015-08-07 2023-06-23 韦沙戴尔电子有限公司 模制体和用于高电压应用的具有模制体的电气装置

Also Published As

Publication number Publication date
WO2017027315A1 (en) 2017-02-16
JP2018522423A (ja) 2018-08-09
CN108140629A (zh) 2018-06-08
HK1256144A1 (zh) 2019-09-13
CN116314100A (zh) 2023-06-23
EP3332421A1 (en) 2018-06-13
TW201717223A (zh) 2017-05-16
KR20180039121A (ko) 2018-04-17
TWI708269B (zh) 2020-10-21
MX388187B (es) 2025-03-19
US9865532B2 (en) 2018-01-09
US20170040239A1 (en) 2017-02-09
EP3332421B1 (en) 2024-01-03
EP3332421A4 (en) 2019-04-10
ES2974813T3 (es) 2024-07-01
CA2995090A1 (en) 2017-02-16
KR102536008B1 (ko) 2023-05-23
US10566272B2 (en) 2020-02-18
US20180261533A1 (en) 2018-09-13
HUE066244T2 (hu) 2024-07-28
JP7042738B2 (ja) 2022-03-28
IL257339B (en) 2021-07-29
IL257339A (en) 2018-03-29

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