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MX2018001410A - Procedimiento para recubrir una unidad electrica y componente electrico. - Google Patents

Procedimiento para recubrir una unidad electrica y componente electrico.

Info

Publication number
MX2018001410A
MX2018001410A MX2018001410A MX2018001410A MX2018001410A MX 2018001410 A MX2018001410 A MX 2018001410A MX 2018001410 A MX2018001410 A MX 2018001410A MX 2018001410 A MX2018001410 A MX 2018001410A MX 2018001410 A MX2018001410 A MX 2018001410A
Authority
MX
Mexico
Prior art keywords
electrical
procedure
cover
unit
electrical component
Prior art date
Application number
MX2018001410A
Other languages
English (en)
Inventor
Schillinger Jakob
Huber Dietmar
Biebricher Lothar
Raukopf Svenja
Original Assignee
Continental Teves Ag & Co Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves Ag & Co Ohg filed Critical Continental Teves Ag & Co Ohg
Publication of MX2018001410A publication Critical patent/MX2018001410A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H10W72/00—
    • H10W74/01—
    • H10W74/111—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H10W70/468—
    • H10W90/758—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Details Of Resistors (AREA)
  • Fuses (AREA)
  • Casings For Electric Apparatus (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

La invención se refiere a un procedimiento para recubrir una unidad eléctrica, recubriéndose la unidad eléctrica con dos cuerpos moldeados de material plástico. La invención se refiere además a un componente eléctrico, que se ha fabricado mediante un procedimiento de este tipo.
MX2018001410A 2015-08-25 2016-08-03 Procedimiento para recubrir una unidad electrica y componente electrico. MX2018001410A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015216217.6A DE102015216217A1 (de) 2015-08-25 2015-08-25 Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
PCT/EP2016/068568 WO2017032575A1 (de) 2015-08-25 2016-08-03 Verfahren zum ummanteln einer elektrischen einheit und elektrisches bauelement

Publications (1)

Publication Number Publication Date
MX2018001410A true MX2018001410A (es) 2018-04-13

Family

ID=56686790

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018001410A MX2018001410A (es) 2015-08-25 2016-08-03 Procedimiento para recubrir una unidad electrica y componente electrico.

Country Status (7)

Country Link
US (1) US10390435B2 (es)
EP (1) EP3342261A1 (es)
KR (1) KR102119986B1 (es)
CN (1) CN108029193B (es)
DE (1) DE102015216217A1 (es)
MX (1) MX2018001410A (es)
WO (1) WO2017032575A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023200226A1 (de) * 2023-01-12 2024-07-18 Robert Bosch Gesellschaft mit beschränkter Haftung Sensorvorrichtung, Batteriemanagementsystem und Batteriemodul

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2191632A (en) * 1986-06-16 1987-12-16 George D Wolff Position sensor assemblies and methods for fabricating same
DE4325712C2 (de) * 1993-07-30 1996-03-21 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
DE19640255C2 (de) * 1996-09-30 2001-01-18 Tyco Electronics Logistics Ag Verfahren zur Herstellung eines elektronischen Moduls mit einem kunststoffumspritzten Leadframe
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
GB0000067D0 (en) * 2000-01-06 2000-02-23 Delta Electrical Limited Current detector and current measurement apparatus including such detector with temparature compensation
US6683250B2 (en) * 2001-07-25 2004-01-27 Visteon Global Technologies, Inc. Protected electronic assembly
DE10221857A1 (de) * 2002-05-16 2003-11-27 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
JP2008039571A (ja) 2006-08-04 2008-02-21 Denso Corp 電流センサ
JP4380748B2 (ja) * 2007-08-08 2009-12-09 ヤマハ株式会社 半導体装置、及び、マイクロフォンパッケージ
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
JP5278166B2 (ja) * 2009-05-28 2013-09-04 セイコーエプソン株式会社 電子デバイスの製造方法及び電子デバイス
DE102009026804A1 (de) * 2009-06-08 2010-12-09 Robert Bosch Gmbh Verfahren zur Herstellung elektronischer Bauteile
CN102686428B (zh) * 2009-09-10 2015-07-29 因特瓦产品有限责任公司 门闩组件的壳体部件及其制造方法
KR101543333B1 (ko) * 2010-04-23 2015-08-11 삼성전자주식회사 발광소자 패키지용 리드 프레임, 발광소자 패키지, 및 발광소자 패키지를 채용한 조명장치
DE102010061750B4 (de) * 2010-11-23 2024-07-04 Robert Bosch Gmbh Bauteil mit einer elektronischen Einrichtung und Verfahren zu dessen Herstellung
US9147637B2 (en) * 2011-12-23 2015-09-29 Infineon Technologies Ag Module including a discrete device mounted on a DCB substrate
US9053317B2 (en) * 2013-02-28 2015-06-09 Winbond Electronics Corporation Nonvolatile memory device having authentication, and methods of operation and manufacture thereof
DE112015000852A5 (de) * 2014-02-18 2016-12-15 Continental Automotive Gmbh Elektronisches Modul

Also Published As

Publication number Publication date
US20180177053A1 (en) 2018-06-21
KR102119986B1 (ko) 2020-06-05
WO2017032575A1 (de) 2017-03-02
CN108029193A (zh) 2018-05-11
EP3342261A1 (de) 2018-07-04
DE102015216217A1 (de) 2017-03-02
KR20180044959A (ko) 2018-05-03
US10390435B2 (en) 2019-08-20
CN108029193B (zh) 2020-07-07

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