[go: up one dir, main page]

MX2017015107A - Ensamble electrico revestido. - Google Patents

Ensamble electrico revestido.

Info

Publication number
MX2017015107A
MX2017015107A MX2017015107A MX2017015107A MX2017015107A MX 2017015107 A MX2017015107 A MX 2017015107A MX 2017015107 A MX2017015107 A MX 2017015107A MX 2017015107 A MX2017015107 A MX 2017015107A MX 2017015107 A MX2017015107 A MX 2017015107A
Authority
MX
Mexico
Prior art keywords
electrical assembly
layer
optionally
coated electrical
coating
Prior art date
Application number
MX2017015107A
Other languages
English (en)
Inventor
Aresta Gianfranco
Simon Hall Brooks Andrew
Vikram Singh Shailendra
Hennighan Gareth
Original Assignee
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semblant Ltd filed Critical Semblant Ltd
Publication of MX2017015107A publication Critical patent/MX2017015107A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

Un ensamble eléctrico el cual tiene un revestimiento de conformación de múltiples capas sobre por lo menos una superficie del ensamble eléctrico, en donde cada capa del revestimiento de múltiples capas se puede obtener por deposición de plasma de una mezcla de precursores que comprende (a) uno o más compuestos orgánicos de silicio, (b) opcionalmente O2, N2O, NO2, H2, NH3, N2, SiF4 y/o hexafluoropropileno (HFP), y (c) opcionalmente He, Ar y/o Kr. La composición química de la química de material de plasma depositada resultante se puede describir por la fórmula general: SiOxHyCzFaNb. Las propiedades del revestimiento de conformación se adaptan mediante el ajuste de los valores de x, y, z, a y b.
MX2017015107A 2015-06-10 2016-06-09 Ensamble electrico revestido. MX2017015107A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1510091.0A GB2539231B (en) 2015-06-10 2015-06-10 Coated electrical assembly
PCT/GB2016/051702 WO2016198870A1 (en) 2015-06-10 2016-06-09 Coated electrical assembly

Publications (1)

Publication Number Publication Date
MX2017015107A true MX2017015107A (es) 2018-05-17

Family

ID=53785253

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017015107A MX2017015107A (es) 2015-06-10 2016-06-09 Ensamble electrico revestido.

Country Status (14)

Country Link
US (3) US20170094810A1 (es)
EP (1) EP3308612A1 (es)
JP (1) JP6947648B2 (es)
KR (1) KR20180016550A (es)
CN (1) CN107852824A (es)
AU (1) AU2016275291A1 (es)
BR (1) BR112017025238A2 (es)
CA (1) CA2986357A1 (es)
GB (1) GB2539231B (es)
MX (1) MX2017015107A (es)
PH (1) PH12017502022A1 (es)
RU (1) RU2717842C2 (es)
TW (1) TW201710554A (es)
WO (1) WO2016198870A1 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12172017B2 (en) 2011-05-09 2024-12-24 Setpoint Medical Corporation Vagus nerve stimulation to treat neurodegenerative disorders
US11549181B2 (en) 2013-11-22 2023-01-10 Applied Materials, Inc. Methods for atomic layer deposition of SiCO(N) using halogenated silylamides
EP3354118B1 (en) * 2015-09-24 2021-06-02 Europlasma NV Polymer coatings and methods for depositing polymer coatings
CN114904142A (zh) 2016-01-20 2022-08-16 赛博恩特医疗器械公司 迷走神经刺激的控制
US11471681B2 (en) 2016-01-20 2022-10-18 Setpoint Medical Corporation Batteryless implantable microstimulators
US10583304B2 (en) 2016-01-25 2020-03-10 Setpoint Medical Corporation Implantable neurostimulator having power control and thermal regulation and methods of use
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
US11257628B2 (en) 2017-07-03 2022-02-22 KYOCERA AVX Components Corporation Solid electrolytic capacitor containing a nanocoating
US10770238B2 (en) 2017-07-03 2020-09-08 Avx Corporation Solid electrolytic capacitor assembly with hydrophobic coatings
KR101974748B1 (ko) * 2017-11-16 2019-05-02 한국세라믹기술원 소자의 방수처리 방법
KR102029596B1 (ko) * 2018-09-03 2019-10-08 삼성전기주식회사 커패시터 부품
US11260229B2 (en) 2018-09-25 2022-03-01 The Feinstein Institutes For Medical Research Methods and apparatuses for reducing bleeding via coordinated trigeminal and vagal nerve stimulation
CN211702520U (zh) * 2019-01-11 2020-10-16 南京德朔实业有限公司 电动工具和电路板
AU2020272128B9 (en) 2019-04-12 2025-11-20 Setpoint Medical Corporation Vagus nerve stimulation to treat neurodegenerative disorders
DE102020123252A1 (de) * 2019-12-12 2021-06-17 Heliatek Gmbh Beschichtung für ein optoelektronisches Bauelement, Verfahren zur Herstellung einer solchen Beschichtung, optoelektronisches Bauelement mit einer solchen Beschichtung
CN111465209B (zh) * 2020-04-16 2022-11-08 四川九立微波有限公司 一种用于射频电路的涂覆工艺及射频电路
US12016124B2 (en) * 2020-04-27 2024-06-18 Covidien Lp Coating for electrical components of surgical devices
IL304787B2 (en) 2020-05-21 2025-12-01 Feinstein Institutes For Medical Research Systems and methods for vagus nerve stimulation
US11439024B2 (en) * 2020-07-16 2022-09-06 Steering Solutions Ip Holding Corporation Method for manufacturing water resistant printed circuit board
US11447865B2 (en) 2020-11-17 2022-09-20 Applied Materials, Inc. Deposition of low-κ films
US12444497B2 (en) 2021-05-17 2025-10-14 Setpoint Medical Corporation Neurostimulation parameter authentication and expiration system for neurostimulation
WO2024108110A2 (en) * 2022-11-17 2024-05-23 The Feinstein Institutes For Medical Research Systems and methods for closed-loop neuromodulation using multiple biological signals

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396078B1 (en) * 1995-06-20 2002-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with a tapered hole formed using multiple layers with different etching rates
JP3565993B2 (ja) * 1995-06-20 2004-09-15 株式会社半導体エネルギー研究所 半導体装置の製造方法
US5895228A (en) * 1996-11-14 1999-04-20 International Business Machines Corporation Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives
JP2004537448A (ja) * 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング
US20040229051A1 (en) * 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
KR20070057200A (ko) * 2004-09-27 2007-06-04 다우 글로벌 테크놀로지스 인크. 플라즈마 강화 화학 기상 증착에 의한 다층 코팅
US20080102206A1 (en) * 2006-11-01 2008-05-01 Sigurd Wagner Multilayered coatings for use on electronic devices or other articles
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
US20080216704A1 (en) * 2007-03-09 2008-09-11 Fisher Controls International Llc Conformal Coating
US8962097B1 (en) * 2007-09-07 2015-02-24 Edward Maxwell Yokley Surface properties of polymeric materials with nanoscale functional coating
JP2011005837A (ja) * 2009-06-29 2011-01-13 Dainippon Printing Co Ltd ガスバリア性帯電防止粘着フィルム
GB201003067D0 (en) * 2010-02-23 2010-04-07 Semblant Ltd Plasma-polymerized polymer coating
US8899000B2 (en) * 2010-07-09 2014-12-02 Birdair, Inc. Architectural membrane and method of making same
US8766240B2 (en) * 2010-09-21 2014-07-01 Universal Display Corporation Permeation barrier for encapsulation of devices and substrates
US8772066B2 (en) * 2011-02-08 2014-07-08 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
DE102011017403A1 (de) * 2011-04-18 2012-10-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Abscheiden eines transparenten Barriereschichtsystems
WO2013025480A1 (en) * 2011-08-12 2013-02-21 Massachusetts Institute Of Technology Methods of coating surfaces using initiated plasma-enhanced chemical vapor deposition
US9312511B2 (en) * 2012-03-16 2016-04-12 Universal Display Corporation Edge barrier film for electronic devices
US9299956B2 (en) * 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US9449809B2 (en) * 2012-07-20 2016-09-20 Applied Materials, Inc. Interface adhesion improvement method
TWI504514B (zh) * 2012-12-11 2015-10-21 Ind Tech Res Inst 層疊結構、其製造方法及發光裝置
KR101992899B1 (ko) * 2012-12-17 2019-06-25 엘지디스플레이 주식회사 터치 패널 내장형 유기 발광 다이오드 표시 장치 및 이의 제조 방법
CN103762321B (zh) * 2013-12-31 2017-06-09 中山市贝利斯特包装制品有限公司 一种有机器件薄膜封装方法及装置

Also Published As

Publication number Publication date
US20250098077A1 (en) 2025-03-20
CA2986357A1 (en) 2016-12-15
BR112017025238A2 (pt) 2018-07-31
AU2016275291A1 (en) 2017-11-16
GB2539231B (en) 2017-08-23
CN107852824A (zh) 2018-03-27
RU2717842C2 (ru) 2020-03-26
TW201710554A (zh) 2017-03-16
RU2017144870A3 (es) 2019-10-02
GB201510091D0 (en) 2015-07-22
JP2018524805A (ja) 2018-08-30
GB2539231A (en) 2016-12-14
JP6947648B2 (ja) 2021-10-13
WO2016198870A1 (en) 2016-12-15
RU2017144870A (ru) 2019-07-12
KR20180016550A (ko) 2018-02-14
EP3308612A1 (en) 2018-04-18
US20170094810A1 (en) 2017-03-30
PH12017502022A1 (en) 2018-04-02
US20190090358A1 (en) 2019-03-21

Similar Documents

Publication Publication Date Title
MX2017015107A (es) Ensamble electrico revestido.
EP3807013A4 (en) THICKNESS LIMITED ELECTRIC SPRAY DEPOSITION
EP3728692A4 (en) CHEMICAL-RESISTANT MULTI-LAYER PAINTING APPLIED BY ATOMIC DEPOSITION
IL257990A (en) Methods for depositing a conformal metal or metalloid silicon nitride film and resultant films
TW201613049A (en) Semiconductor package and method of manufacture
EP3349237A4 (en) PROCESS FOR PREPARING AN SIC COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING A SEMICONDUCTOR SUBSTRATE
HUE065633T2 (hu) Új szubsztrát
KR102373189B9 (ko) 금속판, 증착용 마스크 및 이의 제조방법
EP3512979A4 (en) PARTICLE COATING BY ATOMIC LAYER DEPOSITION (ALD)
TW201614713A (en) Carbon and/or nitrogen incorporation in silicon-based films using silicon precursors with organic co-reactants by pe-ald
KR102617825B9 (ko) 금속기판 및 이를 이용한 증착용마스크
AR094886A1 (es) Conductor aéreo recubierto y método para hacerlo
EP3288097A4 (en) METAL SUBSTRATE AND SEPARATION MASK THEREWITH
MA50019A (fr) Substrat métallique revêtu
TWI800497B (zh) 具有氣封之化學沉積腔室
WO2014125077A3 (de) Flammhemmend ausgerüstetes holzsubstrat
IL280024A (en) Aerosol generating substrate
GB2550743A (en) Coated electrical assembly
EP3913116A4 (en) COMPOSITE SEMICONDUCTOR SUBSTRATE
MX386975B (es) Fármacos precursores de oxabicicloheptanos.
HUE064026T2 (hu) Bevont üvegszubsztrát
MX2020009096A (es) Estructuras ceramicas tridimensionales.
EP2989229A4 (en) Methods for the photo-initiated chemical vapor deposition (picvd) of coatings and coatings produced by these methods
EP4055223A4 (en) MFC SUBSTRATE WITH IMPROVED WATER VAPOR BARRIER
EP3904567A4 (en) COMPOSITE SEMICONDUCTOR SUBSTRATE