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MX2017007254A - Componente electrico sencillo de producir y metodo para producir un componente electrico. - Google Patents

Componente electrico sencillo de producir y metodo para producir un componente electrico.

Info

Publication number
MX2017007254A
MX2017007254A MX2017007254A MX2017007254A MX2017007254A MX 2017007254 A MX2017007254 A MX 2017007254A MX 2017007254 A MX2017007254 A MX 2017007254A MX 2017007254 A MX2017007254 A MX 2017007254A MX 2017007254 A MX2017007254 A MX 2017007254A
Authority
MX
Mexico
Prior art keywords
electric component
producing
produce electric
produce
component
Prior art date
Application number
MX2017007254A
Other languages
English (en)
Other versions
MX380533B (es
Inventor
KRÜGER Hans
Portmann Jurgen
Stelzl Alois
Pahl Wolfgang
Bauer Christian
Original Assignee
Snaptrack Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snaptrack Inc filed Critical Snaptrack Inc
Publication of MX2017007254A publication Critical patent/MX2017007254A/es
Publication of MX380533B publication Critical patent/MX380533B/es

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  for microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/02—Transducers using more than one principle simultaneously
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/007—Protection circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H10W70/09—
    • H10W70/60—
    • H10W72/0198—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • H10W72/853—
    • H10W72/9413—
    • H10W74/019—
    • H10W90/00—
    • H10W90/10—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Otolaryngology (AREA)
  • Health & Medical Sciences (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Manufacture Of Switches (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

La invención se refiere a un componente eléctrico sencillo de producir para los microcircuitos con estructuras de componentes sensibles. Dicho componente comprende una estructura de conexión, y una estructura de conmutación en el lado inferior del microcircuito y un sustrato de soporte con al menos una capa de polímero.
MX2017007254A 2014-12-09 2015-10-19 Componente eléctrico sencillo de producir y método para producir un componente eléctrico. MX380533B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014118214.6A DE102014118214B4 (de) 2014-12-09 2014-12-09 Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
PCT/EP2015/074148 WO2016091438A1 (de) 2014-12-09 2015-10-19 Einfach herstellbares elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements

Publications (2)

Publication Number Publication Date
MX2017007254A true MX2017007254A (es) 2017-10-16
MX380533B MX380533B (es) 2025-03-12

Family

ID=54330770

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017007254A MX380533B (es) 2014-12-09 2015-10-19 Componente eléctrico sencillo de producir y método para producir un componente eléctrico.

Country Status (10)

Country Link
US (1) US11245977B2 (es)
EP (1) EP3231010B1 (es)
JP (1) JP6672301B2 (es)
KR (1) KR102561741B1 (es)
CN (1) CN107004664B (es)
BR (1) BR112017012118A2 (es)
DE (1) DE102014118214B4 (es)
ES (1) ES2873364T3 (es)
MX (1) MX380533B (es)
WO (1) WO2016091438A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11067768B2 (en) * 2017-11-16 2021-07-20 Tdk Taiwan Corp. Optical member driving mechanism
CN111003682A (zh) * 2018-10-08 2020-04-14 凤凰先驱股份有限公司 电子封装件及其制法
CN111821567A (zh) * 2019-03-30 2020-10-27 深圳硅基仿生科技有限公司 电子封装体及植入式器件
CN111422821A (zh) * 2020-03-13 2020-07-17 清华大学 微系统封装方法

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US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP4484544B2 (ja) 2004-02-25 2010-06-16 京セラ株式会社 高周波モジュールの製造方法
US7323675B2 (en) * 2005-09-21 2008-01-29 Sigurd Microelectronics Corp. Packaging structure of a light-sensing device with a spacer wall
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JP4903540B2 (ja) 2006-11-29 2012-03-28 京セラ株式会社 微小電子機械部品封止用基板及び複数個取り形態の微小電子機械部品封止用基板、並びに微小電子機械装置及び微小電子機械装置の製造方法
KR100826394B1 (ko) * 2007-05-17 2008-05-02 삼성전기주식회사 반도체 패키지 제조방법
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TWI348872B (en) 2007-10-17 2011-09-11 Ind Tech Res Inst Electro-acoustic sensing device
US8900931B2 (en) * 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
DE102009019446B4 (de) 2009-04-29 2014-11-13 Epcos Ag MEMS Mikrofon
US8227904B2 (en) 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
US8428286B2 (en) 2009-11-30 2013-04-23 Infineon Technologies Ag MEMS microphone packaging and MEMS microphone module
TWI451538B (zh) * 2010-01-19 2014-09-01 通用微機電系統公司 微機電系統（ｍｅｍｓ）麥克風封裝體及其製造方法
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
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US9239386B2 (en) * 2011-10-05 2016-01-19 Infineon Technologies Ag Sonic sensors and packages
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Also Published As

Publication number Publication date
JP2018506171A (ja) 2018-03-01
WO2016091438A1 (de) 2016-06-16
EP3231010A1 (de) 2017-10-18
US11245977B2 (en) 2022-02-08
US20170272855A1 (en) 2017-09-21
DE102014118214A1 (de) 2016-06-09
MX380533B (es) 2025-03-12
DE102014118214B4 (de) 2024-02-22
JP6672301B2 (ja) 2020-03-25
BR112017012118A2 (pt) 2018-01-02
KR102561741B1 (ko) 2023-07-28
KR20170094143A (ko) 2017-08-17
CN107004664A (zh) 2017-08-01
CN107004664B (zh) 2021-02-05
EP3231010B1 (de) 2021-03-03
ES2873364T3 (es) 2021-11-03

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