MX2016015360A - Deposicion de elementos informaticos integrados (ice) mediante una etapa de traslacion. - Google Patents
Deposicion de elementos informaticos integrados (ice) mediante una etapa de traslacion.Info
- Publication number
- MX2016015360A MX2016015360A MX2016015360A MX2016015360A MX2016015360A MX 2016015360 A MX2016015360 A MX 2016015360A MX 2016015360 A MX2016015360 A MX 2016015360A MX 2016015360 A MX2016015360 A MX 2016015360A MX 2016015360 A MX2016015360 A MX 2016015360A
- Authority
- MX
- Mexico
- Prior art keywords
- ice
- thermal component
- substrate holder
- deposition
- integrated computational
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/12—Means for transmitting measuring-signals or control signals from the well to the surface, or from the surface to the well, e.g. for logging while drilling
- E21B47/13—Means for transmitting measuring-signals or control signals from the well to the surface, or from the surface to the well, e.g. for logging while drilling by electromagnetic energy, e.g. radio frequency
- E21B47/135—Means for transmitting measuring-signals or control signals from the well to the surface, or from the surface to the well, e.g. for logging while drilling by electromagnetic energy, e.g. radio frequency using light waves, e.g. infrared or ultraviolet waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Geology (AREA)
- Mining & Mineral Resources (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Fluid Mechanics (AREA)
- Environmental & Geological Engineering (AREA)
- Geophysics (AREA)
- Electromagnetism (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Las modalidades descritas incluyen un sistema y método para fabricar un núcleo de elemento informático integrado (ICE). El método comprende alterar una distancia entre un componente térmico y un portador de sustrato que porta al menos un sustrato durante un proceso de deposición de películas delgadas para mejorar la uniformidad del núcleo de ICE. En una modalidad, la alteración de la distancia entre el componente térmico y el portador de sustrato que porta al menos un sustrato incluye mover al menos una parte del portador de sustrato en al menos una dirección en relación con el componente térmico y también mover el componente térmico en al menos un sentido en relación con el portador de sustrato durante el proceso de deposición de películas delgadas.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2014/044818 WO2016003401A1 (en) | 2014-06-30 | 2014-06-30 | Deposition of integrated computational elements (ice) using a translation stage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2016015360A true MX2016015360A (es) | 2017-03-03 |
Family
ID=55019757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016015360A MX2016015360A (es) | 2014-06-30 | 2014-06-30 | Deposicion de elementos informaticos integrados (ice) mediante una etapa de traslacion. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10316405B2 (es) |
| EP (2) | EP3129521A4 (es) |
| BR (1) | BR112016026909B1 (es) |
| MX (1) | MX2016015360A (es) |
| SA (1) | SA516380347B1 (es) |
| WO (1) | WO2016003401A1 (es) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017204861A1 (de) * | 2017-03-23 | 2018-09-27 | Carl Zeiss Smt Gmbh | Verfahren zum Bestimmen eines Materialabtrags und Vorrichtung zur Strahlbearbeitung eines Werkstücks |
| US20210080380A1 (en) * | 2019-09-16 | 2021-03-18 | Halliburton Energy Services, Inc. | Customized Thin Film Optical Element Fabrication System and Method |
| US20220298622A1 (en) * | 2021-03-16 | 2022-09-22 | University Of Rochester | Electron-Beam Deposition of Striated Composite Layers for High-Fluence Laser Coatings |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5133286A (en) * | 1989-04-14 | 1992-07-28 | Samsung Electro-Mechanics Co., Ltd. | Substrate-heating device and boat structure for a vacuum-depositing apparatus |
| GB9225270D0 (en) * | 1992-12-03 | 1993-01-27 | Gec Ferranti Defence Syst | Depositing different materials on a substrate |
| US7195797B2 (en) * | 2000-07-10 | 2007-03-27 | Atomic Telecom | High throughput high-yield vacuum deposition system |
| US7138156B1 (en) * | 2000-09-26 | 2006-11-21 | Myrick Michael L | Filter design algorithm for multi-variate optical computing |
| AU2002216615A1 (en) * | 2000-10-05 | 2002-04-15 | Opnetics Corporation | In-situ thickness and refractive index monitoring and control system for thin film deposition |
| US20030168613A1 (en) * | 2002-03-08 | 2003-09-11 | Cheng-Chung Lee And Ycl Optcom Co., Ltd. | Multi-layer optical interference filter deposited by using only one starting coating material |
| JP4418926B2 (ja) | 2003-10-17 | 2010-02-24 | 株式会社昭和真空 | 光学薄膜形成用装置及び方法 |
| WO2010018639A1 (ja) * | 2008-08-15 | 2010-02-18 | 株式会社シンクロン | 蒸着装置及び薄膜デバイスの製造方法 |
| US8879053B2 (en) * | 2012-04-26 | 2014-11-04 | Halliburton Energy Services, Inc. | Devices having an integrated computational element and a proximal interferent monitor and methods for determining a characteristic of a sample therewith |
| WO2015163853A1 (en) | 2014-04-22 | 2015-10-29 | Halliburton Energy Services, Inc. | Systems and methods for analyzing contaminants in flowing bulk powder compositions |
-
2014
- 2014-06-30 MX MX2016015360A patent/MX2016015360A/es unknown
- 2014-06-30 EP EP14896447.1A patent/EP3129521A4/en active Pending
- 2014-06-30 EP EP23162610.2A patent/EP4219788A1/en active Pending
- 2014-06-30 US US15/303,653 patent/US10316405B2/en active Active
- 2014-06-30 WO PCT/US2014/044818 patent/WO2016003401A1/en not_active Ceased
- 2014-06-30 BR BR112016026909-8A patent/BR112016026909B1/pt active IP Right Grant
-
2016
- 2016-11-21 SA SA516380347A patent/SA516380347B1/ar unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BR112016026909A2 (pt) | 2017-08-15 |
| US20170029939A1 (en) | 2017-02-02 |
| SA516380347B1 (ar) | 2020-06-19 |
| EP4219788A1 (en) | 2023-08-02 |
| WO2016003401A1 (en) | 2016-01-07 |
| EP3129521A1 (en) | 2017-02-15 |
| EP3129521A4 (en) | 2017-12-27 |
| US10316405B2 (en) | 2019-06-11 |
| BR112016026909B1 (pt) | 2021-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11202103273WA (en) | Method for forming molybdenum films on a substrate | |
| EP3351063A4 (en) | System, apparatus and method for utilizing surface mount technology on plastic substrates | |
| SG10201608588SA (en) | Susceptor For Holding A Semiconductor Wafer Having Orientation Notch, A Method For Depositing A Layer On A Semiconductor Wafer, And Semiconductor Wafer | |
| SG11201710300SA (en) | Substrate holding device, film deposition device, and substrate holding method | |
| SG10201705697RA (en) | Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor device | |
| SG11202005075RA (en) | Method for depositing an epitaxial layer on a front side of a semiconductor wafer and apparatus for carrying out the method | |
| PL3195344T3 (pl) | Aparat i sposób osadzania z zastosowaniem wirtualnej katody (VCD) do wytwarzania cienkich warstw | |
| EP3890000C0 (en) | PROCESS FOR MANUFACTURING DIAMOND SUBSTRATE | |
| EP3396703A4 (en) | WAFERTRÄGERMECHANISM, DEVICE FOR CHEMICAL GAS PHASE DEPOSITION AND MANUFACTURING PROCESS FOR EPITAKTISCHE WAFER | |
| SG10201907085QA (en) | Semiconductor substrate processing method | |
| GB201802102D0 (en) | Manufacturing method for IPS TFT-LCD array substrate, and IPS TFT-LCD array substrate | |
| SG11201605743UA (en) | Ingaas film grown on si substrate and method for manufacturing same | |
| SG11201707558SA (en) | Gaas thin film grown on si substrate, and preparation method for gaas thin film grown on si substrate | |
| IL266186A (en) | Process for the generation of thin silicon-containing films | |
| SG11201705935YA (en) | Epitaxially coated semiconductor wafer, and method for producing an epitaxially coated semiconductor wafer | |
| EP3418424A4 (en) | COMPOSITE SUBSTRATE, PELLETIC LAYER AND METHOD FOR PRODUCING A COMPOSITE SUBSTRATE SUBSTRATE | |
| GB2541524A (en) | Manufacturing process for integrated computational elements | |
| EP3171390A4 (en) | Thin substrate, method for manufacturing same, and method for transporting substrate | |
| IN2014MU01274A (es) | ||
| SG11201706844QA (en) | Substrate holder and method for bonding two substrates | |
| EP3067438A4 (en) | Method for forming intermediate layer formed between substrate and dlc film, method for forming dlc film, and intermediate layer formed between substrate and dlc film | |
| GB201701166D0 (en) | An apparatus for electrochemically processing semiconductor substrates | |
| MX2016015360A (es) | Deposicion de elementos informaticos integrados (ice) mediante una etapa de traslacion. | |
| GB2556205B (en) | Method for manufacturing thin film transistor array substrate | |
| PL3135645T3 (pl) | Podłoże szklane wyposażone w film powlekający i sposób wytwarzania podłoża szklanego wyposażonego w film powlekający |