MX2016004690A - Soporte para componentes electronicos de potencia, modulo de potencia provistos con tal soporte y metodo de produccion correspondiente. - Google Patents
Soporte para componentes electronicos de potencia, modulo de potencia provistos con tal soporte y metodo de produccion correspondiente.Info
- Publication number
- MX2016004690A MX2016004690A MX2016004690A MX2016004690A MX2016004690A MX 2016004690 A MX2016004690 A MX 2016004690A MX 2016004690 A MX2016004690 A MX 2016004690A MX 2016004690 A MX2016004690 A MX 2016004690A MX 2016004690 A MX2016004690 A MX 2016004690A
- Authority
- MX
- Mexico
- Prior art keywords
- support
- components
- inner layer
- production method
- module provided
- Prior art date
Links
Classifications
-
- H10W40/255—
-
- H10W40/037—
-
- H10W40/228—
-
- H10W40/258—
-
- H10W70/02—
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Ceramic Engineering (AREA)
Abstract
Se describe un soporte para componentes electrónicos de potencia, módulo de potencia provisto con tal soporte y método de producción correspondiente. El soporte para componentes electrónicos de potencia comprende un material compuesto en multicapas co-laminado que tiene por lo menos una capa interna (8) que consiste de un material que tiene un coeficiente de expansión térmica seleccionado de acuerdo con el coeficiente de expansión de tales componentes y capas externas (6, 7) que consisten de un material conductor de calor que cubre cada lado de la capa interna e interconectado por disipadores (P) que consisten de un material conductor de calor y dispuestos en la capa interna. Cada capa interna forma un inserto colocado en un área para montar los componentes, de tal manera que las capas externas se extienden lateralmente más allá del inserto.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/FR2013/052493 WO2015055899A1 (fr) | 2013-10-18 | 2013-10-18 | Support pour composants électroniques de puissance, module de puissance doté d'un tel support, et procédé de fabrication correspondant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2016004690A true MX2016004690A (es) | 2016-11-29 |
Family
ID=49641790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016004690A MX2016004690A (es) | 2013-10-18 | 2013-10-18 | Soporte para componentes electronicos de potencia, modulo de potencia provistos con tal soporte y metodo de produccion correspondiente. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160254210A1 (es) |
| EP (1) | EP3058591B1 (es) |
| JP (1) | JP2016539511A (es) |
| KR (1) | KR20160083856A (es) |
| CN (1) | CN105900230A (es) |
| MX (1) | MX2016004690A (es) |
| TW (1) | TW201539681A (es) |
| WO (1) | WO2015055899A1 (es) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731757B (zh) * | 2017-09-27 | 2019-11-08 | 开发晶照明(厦门)有限公司 | 光电装置及其基板 |
| EP3471138B1 (en) * | 2017-10-12 | 2021-06-16 | The Goodsystem Corp. | Heat sink plate |
| US20200006190A1 (en) * | 2018-06-29 | 2020-01-02 | Abb Schweiz Ag | Heat transfer structure, power electronics module, cooling element, method of manufacturing a heat transfer structure and method of manufacturing a power electronics component |
| TWI715497B (zh) * | 2020-05-14 | 2021-01-01 | 劉台徽 | 串疊連接的電力電子器件封裝方法及其封裝結構 |
| WO2022039441A1 (ko) * | 2020-08-19 | 2022-02-24 | 주식회사 아모센스 | 파워모듈 및 그 제조방법 |
| CN117316954A (zh) * | 2022-06-22 | 2023-12-29 | 群创光电股份有限公司 | 可挠曲电子装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
| US5151777A (en) * | 1989-03-03 | 1992-09-29 | Delco Electronics Corporation | Interface device for thermally coupling an integrated circuit to a heat sink |
| JPH05109947A (ja) * | 1991-10-12 | 1993-04-30 | Sumitomo Special Metals Co Ltd | 熱伝導材料とその製造方法 |
| US6317331B1 (en) * | 1998-08-19 | 2001-11-13 | Kulicke & Soffa Holdings, Inc. | Wiring substrate with thermal insert |
| US7059049B2 (en) * | 1999-07-02 | 2006-06-13 | International Business Machines Corporation | Electronic package with optimized lamination process |
| US20010038140A1 (en) * | 2000-04-06 | 2001-11-08 | Karker Jeffrey A. | High rigidity, multi-layered semiconductor package and method of making the same |
| JP4062994B2 (ja) * | 2001-08-28 | 2008-03-19 | 株式会社豊田自動織機 | 放熱用基板材、複合材及びその製造方法 |
| JP2003078082A (ja) * | 2001-09-06 | 2003-03-14 | Toyota Industries Corp | 複合材料の成形方法 |
| JP2004063655A (ja) * | 2002-07-26 | 2004-02-26 | Toyota Industries Corp | 放熱システム、放熱方法、熱緩衝部材、半導体モジュール、ヒートスプレッダおよび基板 |
| US6844621B2 (en) * | 2002-08-13 | 2005-01-18 | Fuji Electric Co., Ltd. | Semiconductor device and method of relaxing thermal stress |
| JP3788410B2 (ja) * | 2002-08-27 | 2006-06-21 | 株式会社豊田自動織機 | 低膨張板の製造方法 |
| US6921971B2 (en) * | 2003-01-15 | 2005-07-26 | Kyocera Corporation | Heat releasing member, package for accommodating semiconductor element and semiconductor device |
| JP4471646B2 (ja) * | 2003-01-15 | 2010-06-02 | 株式会社豊田自動織機 | 複合材及びその製造方法 |
| US7078816B2 (en) * | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
| KR20070010187A (ko) * | 2004-04-27 | 2007-01-22 | 제이에스알 가부시끼가이샤 | 시트상 프로브, 그의 제조 방법 및 그의 용도 |
| JP2007220719A (ja) * | 2006-02-14 | 2007-08-30 | Hitachi Cable Ltd | 半導体回路部材とその製造方法 |
| JP4558012B2 (ja) * | 2007-07-05 | 2010-10-06 | 株式会社東芝 | 半導体パッケージ用放熱プレート及び半導体装置 |
| KR101244587B1 (ko) * | 2008-06-02 | 2013-03-25 | 파나소닉 주식회사 | 그래파이트 복합체 및 그 제조 방법 |
| FR2951020B1 (fr) * | 2009-10-01 | 2012-03-09 | Nat De Metrologie Et D Essais Lab | Materiau composite multicouche utilise pour la fabrication de substrats de modules electroniques et procede de fabrication correspondant |
| KR101273724B1 (ko) * | 2010-08-18 | 2013-06-12 | 삼성전기주식회사 | 방열 기판 및 그 제조 방법, 그리고 상기 방열 기판을 구비하는 발광소자 패키지 |
| TWM416821U (en) * | 2011-06-16 | 2011-11-21 | Anica Corp | Flexible display device and card with display function using the same |
| US20150001700A1 (en) * | 2013-06-28 | 2015-01-01 | Infineon Technologies Ag | Power Modules with Parylene Coating |
-
2013
- 2013-10-18 US US15/030,286 patent/US20160254210A1/en not_active Abandoned
- 2013-10-18 JP JP2016548437A patent/JP2016539511A/ja active Pending
- 2013-10-18 MX MX2016004690A patent/MX2016004690A/es unknown
- 2013-10-18 WO PCT/FR2013/052493 patent/WO2015055899A1/fr not_active Ceased
- 2013-10-18 CN CN201380080712.2A patent/CN105900230A/zh active Pending
- 2013-10-18 KR KR1020167009596A patent/KR20160083856A/ko not_active Withdrawn
- 2013-10-18 EP EP13795548.0A patent/EP3058591B1/fr not_active Not-in-force
-
2014
- 2014-10-17 TW TW103135915A patent/TW201539681A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20160254210A1 (en) | 2016-09-01 |
| WO2015055899A1 (fr) | 2015-04-23 |
| EP3058591A1 (fr) | 2016-08-24 |
| EP3058591B1 (fr) | 2020-11-18 |
| CN105900230A (zh) | 2016-08-24 |
| JP2016539511A (ja) | 2016-12-15 |
| TW201539681A (zh) | 2015-10-16 |
| KR20160083856A (ko) | 2016-07-12 |
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