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MX2015016094A - Anode and high-speed plating device provided with same. - Google Patents

Anode and high-speed plating device provided with same.

Info

Publication number
MX2015016094A
MX2015016094A MX2015016094A MX2015016094A MX2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A MX 2015016094 A MX2015016094 A MX 2015016094A
Authority
MX
Mexico
Prior art keywords
anode
same
device provided
plating device
cylindrical section
Prior art date
Application number
MX2015016094A
Other languages
Spanish (es)
Inventor
Yoshitaka Mochizuki
Toshihisa Miyazaki
Akira Takamatsu
Original Assignee
Kyb Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyb Corp filed Critical Kyb Corp
Publication of MX2015016094A publication Critical patent/MX2015016094A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Provided is an anode capable of favorably plating for a long period of time. The anode (10) is cylindrical, forms a space through which a plating solution flows between itself and an article (1) to be plated and positioned in the interior thereof, and has a positive voltage imparted thereto. The anode (10) is provided with a conductive outer-cylindrical section (11), and an inner-cylindrical section (12) comprising a platinum plate material (12A) welded so as to contact the inner surface of the outer-cylindrical section (11).
MX2015016094A 2013-06-14 2014-06-06 Anode and high-speed plating device provided with same. MX2015016094A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013125552A JP6189655B2 (en) 2013-06-14 2013-06-14 Anode manufacturing method
PCT/JP2014/065049 WO2014199907A1 (en) 2013-06-14 2014-06-06 Anode and high-speed plating device provided with same

Publications (1)

Publication Number Publication Date
MX2015016094A true MX2015016094A (en) 2016-05-31

Family

ID=52022203

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015016094A MX2015016094A (en) 2013-06-14 2014-06-06 Anode and high-speed plating device provided with same.

Country Status (8)

Country Link
US (1) US20160108542A1 (en)
EP (1) EP3009537A4 (en)
JP (1) JP6189655B2 (en)
CN (1) CN105324521A (en)
BR (1) BR112015030429A2 (en)
MX (1) MX2015016094A (en)
TW (1) TWI646225B (en)
WO (1) WO2014199907A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193005B2 (en) 2013-06-14 2017-09-06 Ｋｙｂ株式会社 Holding device and high-speed plating apparatus provided with the same
JP6189656B2 (en) 2013-06-14 2017-08-30 Ｋｙｂ株式会社 Power supply member and high-speed plating apparatus including the same
US11542626B2 (en) 2020-10-08 2023-01-03 Honeywell International Inc. Systems and methods for enclosed electroplating chambers
KR20240037387A (en) 2021-10-19 2024-03-21 히다치 아스테모 가부시키가이샤 Rod manufacturing method and anode device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6046195B2 (en) * 1979-04-13 1985-10-15 ヤマハ発動機株式会社 High speed plating device
DE59481T1 (en) * 1981-03-03 1983-04-28 Yamaha Motor Co., Ltd., Iwata, Shizuoka DEVICE FOR HIGH-SPEED ELECTROPLATING.
DE3938160A1 (en) * 1989-11-16 1991-05-23 Peroxid Chemie Gmbh ELECTROLYSIS CELL FOR PRODUCING PEROXO AND PERHALOGENATE COMPOUNDS
DE10102145B4 (en) * 2000-01-19 2008-04-03 Suzuki Motor Corp., Hamamatsu Electroplating pretreatment device and plating treatment device
DE10029837B4 (en) * 2000-06-16 2005-02-17 Degussa Galvanotechnik Gmbh Process for the production of unilaterally platinated plates and expanded metal gratings of refractory metals
JP3513657B2 (en) * 2001-03-05 2004-03-31 ダイソー株式会社 Insoluble anode
ITMI20050373A1 (en) * 2005-03-09 2006-09-10 Nora Elettrodi S P A CYLINDRICAL ELECTRODE
JP4873695B2 (en) * 2006-04-14 2012-02-08 ダイソー株式会社 Hollow electrode with electrodeposition film
JP5467374B2 (en) * 2011-08-25 2014-04-09 ユケン工業株式会社 Apparatus for forming electroplating on shaft body, manufacturing method of shaft body having plating film, and plating solution for forming zinc-based plating film on shaft body

Also Published As

Publication number Publication date
EP3009537A4 (en) 2017-03-22
CN105324521A (en) 2016-02-10
JP6189655B2 (en) 2017-08-30
TW201510292A (en) 2015-03-16
EP3009537A1 (en) 2016-04-20
WO2014199907A1 (en) 2014-12-18
JP2015001005A (en) 2015-01-05
BR112015030429A2 (en) 2017-08-29
US20160108542A1 (en) 2016-04-21
TWI646225B (en) 2019-01-01

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