[go: up one dir, main page]

MX2015013360A - Dispositivo y metodo de colocacion de modulo. - Google Patents

Dispositivo y metodo de colocacion de modulo.

Info

Publication number
MX2015013360A
MX2015013360A MX2015013360A MX2015013360A MX2015013360A MX 2015013360 A MX2015013360 A MX 2015013360A MX 2015013360 A MX2015013360 A MX 2015013360A MX 2015013360 A MX2015013360 A MX 2015013360A MX 2015013360 A MX2015013360 A MX 2015013360A
Authority
MX
Mexico
Prior art keywords
placement device
module
module placement
mate
substrate
Prior art date
Application number
MX2015013360A
Other languages
English (en)
Other versions
MX357791B (es
Inventor
Thomas Vanderpuy
Original Assignee
Muth K W Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muth K W Co Inc filed Critical Muth K W Co Inc
Publication of MX2015013360A publication Critical patent/MX2015013360A/es
Publication of MX357791B publication Critical patent/MX357791B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Automatic Assembly (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Rear-View Mirror Devices That Are Mounted On The Exterior Of The Vehicle (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Mechanical Engineering (AREA)

Abstract

Un dispositivo y método de colocación de módulo permiten el acoplamiento de precisión de un módulo a un sustrato. El dispositivo y método pueden utilizarse efectivamente, por ejemplo, para acoplar una fuente de luz tal como un módulo LED a un lado posterior del espejo automotriz que tiene porciones que permiten que la luz atraviese.
MX2015013360A 2013-03-19 2014-03-18 Dispositivo y metodo de colocacion de modulo. MX357791B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/847,262 US9769930B2 (en) 2013-03-19 2013-03-19 Module placement device and method
PCT/US2014/031088 WO2014153358A2 (en) 2013-03-19 2014-03-18 Module placement device and method

Publications (2)

Publication Number Publication Date
MX2015013360A true MX2015013360A (es) 2016-06-07
MX357791B MX357791B (es) 2018-07-25

Family

ID=51568248

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015013360A MX357791B (es) 2013-03-19 2014-03-18 Dispositivo y metodo de colocacion de modulo.

Country Status (13)

Country Link
US (1) US9769930B2 (es)
EP (1) EP2976186B1 (es)
JP (1) JP2016516306A (es)
KR (1) KR20150132136A (es)
CA (1) CA2907555C (es)
ES (1) ES2768621T3 (es)
HU (1) HUE047824T2 (es)
MX (1) MX357791B (es)
PL (1) PL2976186T3 (es)
PT (1) PT2976186T (es)
RS (1) RS59773B1 (es)
SI (1) SI2976186T1 (es)
WO (1) WO2014153358A2 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6434943B2 (ja) * 2016-09-20 2018-12-05 本田技研工業株式会社 組立装置
KR20230002411A (ko) * 2020-04-17 2023-01-05 무스 미러 시스템즈, 엘엘씨 고정 장치 및 그의 이용 방법
CN112172672B (zh) 2020-10-13 2023-12-22 麦格纳（太仓）汽车科技有限公司 警示灯模块装配至后视镜镜片的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317953B1 (en) 1981-05-11 2001-11-20 Lmi-Diffracto Vision target based assembly
JPH03212999A (ja) * 1990-01-18 1991-09-18 Yamagata Kashio Kk 電子部品搭載作業装置
US5380978A (en) 1991-07-12 1995-01-10 Pryor; Timothy R. Method and apparatus for assembly of car bodies and other 3-dimensional objects
JPH07237496A (ja) * 1994-03-01 1995-09-12 Nissan Motor Co Ltd 車両用後写鏡装置
US6000784A (en) * 1997-03-11 1999-12-14 Ricoh Company, Ltd. Structure and method for mounting an ink jet head
US6111683A (en) 1997-04-02 2000-08-29 Gentex Corporation Electrochromic mirrors having a signal light
US6224709B1 (en) * 1998-01-27 2001-05-01 Ricoh Company, Ltd. Method for assembling parts
JPH11340695A (ja) * 1998-05-25 1999-12-10 Sony Corp 組立装置
JP2000085473A (ja) * 1998-09-16 2000-03-28 Ichikoh Ind Ltd 灯具内蔵の車両用ミラー
JP3762246B2 (ja) * 2001-04-04 2006-04-05 Ｔｄｋ株式会社 処理装置
JP2003133800A (ja) * 2001-10-22 2003-05-09 Juki Corp 電子部品実装装置
JP2006344136A (ja) 2005-06-10 2006-12-21 Fanuc Ltd ロボット制御装置
US8157155B2 (en) 2008-04-03 2012-04-17 Caterpillar Inc. Automated assembly and welding of structures
EP2255930A1 (de) 2009-05-27 2010-12-01 Leica Geosystems AG Verfahren und System zum hochpräzisen Positionieren mindestens eines Objekts in eine Endlage im Raum
US8836888B2 (en) * 2009-12-15 2014-09-16 Gentex Corporation Modular light source/electronics and automotive rearview assemblies using the same
US9009952B2 (en) 2011-08-29 2015-04-21 Asm Technology Singapore Pte. Ltd. Apparatus for assembling a lens module and an image sensor to form a camera module, and a method of assembling the same

Also Published As

Publication number Publication date
US20140283973A1 (en) 2014-09-25
HUE047824T2 (hu) 2020-05-28
PT2976186T (pt) 2020-01-29
SI2976186T1 (sl) 2020-03-31
ES2768621T3 (es) 2020-06-23
US9769930B2 (en) 2017-09-19
MX357791B (es) 2018-07-25
PL2976186T3 (pl) 2020-05-18
JP2016516306A (ja) 2016-06-02
WO2014153358A2 (en) 2014-09-25
CA2907555C (en) 2018-04-24
EP2976186A2 (en) 2016-01-27
WO2014153358A3 (en) 2014-11-27
RS59773B1 (sr) 2020-02-28
EP2976186A4 (en) 2017-03-29
KR20150132136A (ko) 2015-11-25
EP2976186B1 (en) 2019-12-25
CA2907555A1 (en) 2014-09-25

Similar Documents

Publication Publication Date Title
EP3028303A4 (en) Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
EP3045947A4 (en) Semiconductor laser module
CA2910559C (en) Devices, systems, and methods for three-dimensional printing
TWI561871B (en) Optical bench on substrate and method for forming the same
MX357426B (es) Metodos y aparatos para formar baterias impresas en dispositivos oftalmicos.
EP3014346A4 (en) Devices and methods for a contact lens with an inward facing light source
EP3069267A4 (en) Software component recommendation based on multiple trace runs
MX2016005769A (es) Alineacion de tiempo de datos de sensor.
EP2972649A4 (en) Connector assembly for an electronic device
EP3045964A4 (en) Backlight module
EP3081852A4 (en) Headlight module and headlight device
EP3349243A4 (en) Package for housing electronic component, electronic device, and electronic module
PL2844447T3 (pl) Sposób wytwarzania modułu optycznego z silikonowym układem optycznym, moduł optyczny i jego zastosowanie
TWI563219B (en) Illumination system having semiconductor light source module
EP3096070A4 (en) Light emission module, connector, and mounting structure for light emission module
GB201412780D0 (en) Optical tap modules having integrated splitters and aggregated multi-fiber tap output connectors
AU350547S (en) Filtration components
EP3070502A4 (en) LIGHT LINE DEVICE, MANUFACTURING METHOD AND LASER DIODE MODULE
MX2015012985A (es) Ensamble de lente que cumple con clase 1.
TW201612598A (en) Backlight module with optical control film
MX2013009396A (es) Metodo de ubicacion del conector smt con caracteristica de tapa smt.
EP3035099A4 (en) Imaging module, stereo camera for vehicle, and light shielding member for imaging module
GB2522320B (en) Driver circuit with a semiconductor light source and method for operating a driver circuit
TWD166713S (zh) 用於基板托盤的封接件
EP2937955A4 (en) Semiconductor laser module and production method for same

Legal Events

Date Code Title Description
GB Transfer or rights

Owner name: MUTH MIRROR SYSTEMS, LLC

FG Grant or registration