[go: up one dir, main page]

MX2015012979A - Patron de trazo de tarjeta de circuito electrico para reducir al minimo el agretamiento del capacitor y mejorar la confiabilidad. - Google Patents

Patron de trazo de tarjeta de circuito electrico para reducir al minimo el agretamiento del capacitor y mejorar la confiabilidad.

Info

Publication number
MX2015012979A
MX2015012979A MX2015012979A MX2015012979A MX2015012979A MX 2015012979 A MX2015012979 A MX 2015012979A MX 2015012979 A MX2015012979 A MX 2015012979A MX 2015012979 A MX2015012979 A MX 2015012979A MX 2015012979 A MX2015012979 A MX 2015012979A
Authority
MX
Mexico
Prior art keywords
circuit board
electrical circuit
improve reliability
trace pattern
board trace
Prior art date
Application number
MX2015012979A
Other languages
English (en)
Inventor
P Willis Andre
Original Assignee
Hiq Solar Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiq Solar Inc filed Critical Hiq Solar Inc
Publication of MX2015012979A publication Critical patent/MX2015012979A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

Una tarjeta de circuito impreso con una almohadilla de conexión de componentes, tal como una almohadilla de soldadura, que provee compensación de estrés térmico para un componente de circuito de montaje de superficie y método para fabricar dicha almohadilla. La almohadilla de conexión de componentes incluye grupos opuestos de varios dedos conductores que están conectados entre sí en sus extremos lejanos y separados en sus extremos cercanos en donde tienen superficies para montar un solo componente de circuito de montaje de superficie.
MX2015012979A 2013-03-14 2014-03-13 Patron de trazo de tarjeta de circuito electrico para reducir al minimo el agretamiento del capacitor y mejorar la confiabilidad. MX2015012979A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361782479P 2013-03-14 2013-03-14
US14/206,750 US9414490B2 (en) 2013-03-14 2014-03-12 Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability
PCT/US2014/026193 WO2014160265A1 (en) 2013-03-14 2014-03-13 Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability

Publications (1)

Publication Number Publication Date
MX2015012979A true MX2015012979A (es) 2016-08-05

Family

ID=51625378

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015012979A MX2015012979A (es) 2013-03-14 2014-03-13 Patron de trazo de tarjeta de circuito electrico para reducir al minimo el agretamiento del capacitor y mejorar la confiabilidad.

Country Status (5)

Country Link
US (1) US9414490B2 (es)
EP (1) EP2973625A4 (es)
CN (1) CN105164772A (es)
MX (1) MX2015012979A (es)
WO (1) WO2014160265A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300462B1 (en) * 2016-09-21 2019-12-11 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Capacitor dc-link arrangement
US10257925B2 (en) * 2017-04-10 2019-04-09 Tactotek Oy Method for manufacturing an electronic assembly
CN107509303A (zh) * 2017-07-28 2017-12-22 上海创功通讯技术有限公司 印刷电路板
KR102762877B1 (ko) 2019-09-09 2025-02-07 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
JP2025031250A (ja) * 2023-08-25 2025-03-07 株式会社日立製作所 制御基板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2410849B2 (de) * 1974-03-07 1979-12-06 Blaupunkt-Werke Gmbh, 3200 Hildesheim Verfahren zum Auflöten von Miniatur-Bauelementen
JPH09331146A (ja) * 1996-06-12 1997-12-22 Saitama Nippon Denki Kk 汎用表面実装部品ランド
US7364058B2 (en) * 1997-09-26 2008-04-29 Scientific Games International, Inc. Ticket dispensing apparatus
JP2000340446A (ja) 1999-05-26 2000-12-08 Tokin Ceramics Corp 端子付き電子部品
TW472367B (en) * 2000-12-12 2002-01-11 Siliconware Precision Industries Co Ltd Passive device pad design for avoiding solder pearls
JP2002353604A (ja) 2001-05-29 2002-12-06 Toyo Commun Equip Co Ltd プリント基板
TWI232561B (en) * 2003-10-17 2005-05-11 Advanced Semiconductor Eng Substrate having bond pads for bonding redundant solder beads
JP2006032511A (ja) 2004-07-14 2006-02-02 Citizen Electronics Co Ltd 基板及び実装基板
JP2007258605A (ja) * 2006-03-24 2007-10-04 Toshiba Corp 部品内蔵プリント配線板、部品内蔵プリント配線板の製造方法および電子機器
US7731391B2 (en) * 2006-06-07 2010-06-08 Microscan Systems, Inc. System and method for providing a uniform backlight
JP2008103547A (ja) 2006-10-19 2008-05-01 Murata Mach Ltd 半田ペースト塗布方法及び電子回路基板
BRPI1010878A2 (pt) 2009-06-09 2019-07-09 Poskatcheev Willis Andre circuito e método de coleta de potência para fontes de alimentação cc acopladas em série
JP5807145B2 (ja) * 2010-05-20 2015-11-10 パナソニックＩｐマネジメント株式会社 実装構造体

Also Published As

Publication number Publication date
WO2014160265A1 (en) 2014-10-02
US20140311791A1 (en) 2014-10-23
US9414490B2 (en) 2016-08-09
EP2973625A4 (en) 2017-02-22
CN105164772A (zh) 2015-12-16
EP2973625A1 (en) 2016-01-20

Similar Documents

Publication Publication Date Title
GB2509810A (en) Stretchable circuit assemblies
MY188109A (en) Electronic component
WO2015035016A3 (en) High current interconnect system and method for use in a battery module
PH12016502502A1 (en) Printed circuit board, electronic component, and method for producing printed circuit board
EP2876985A3 (en) Power conversion device and power conversion assembly
MX2015012979A (es) Patron de trazo de tarjeta de circuito electrico para reducir al minimo el agretamiento del capacitor y mejorar la confiabilidad.
WO2012175207A3 (de) Elektronische baugruppe und verfahren zu deren herstellung
WO2014139666A8 (de) Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil
MX379589B (es) Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.
MY169393A (en) Electronic control unit and electric power steering apparatus having the same
WO2016105781A3 (en) Reducing trace length and insertion loss of high speed signals on a network switch board
WO2011112409A3 (en) Wiring substrate with customization layers
IN2014CN01630A (es)
EP4277290A3 (en) Camera head
EP2922091A3 (en) Leadless chip carrier
TW201612461A (en) Heat dispersion structure and manufacturing method thereof
EP2986089A4 (en) Method for manufacturing solder circuit board, solder circuit board, and method for mounting electronic component
IN2013MU01206A (es)
FI20125389A7 (fi) Piirikorttijärjestely
EP2642834A3 (en) Printed circuit board
WO2012092092A3 (en) A method and apparatus for mounting electronic components on an antenna structure
WO2012085472A3 (fr) Circuit imprime a substrat metallique isole
PL2690721T3 (pl) Elektryczne złącze wtykowe lutowane na płytkach drukowanych z kompensacją tolerancji
MX2015004038A (es) Viga mixta de acero.
WO2014187834A3 (de) Elektronisches modul, insbesondere steuergerät für ein fahrzeug und verfahren zu dessen herstellung