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MX2015009460A - Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico. - Google Patents

Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico.

Info

Publication number
MX2015009460A
MX2015009460A MX2015009460A MX2015009460A MX2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A MX 2015009460 A MX2015009460 A MX 2015009460A
Authority
MX
Mexico
Prior art keywords
liquid cooling
electronic device
cooling
cooling mediums
liquid
Prior art date
Application number
MX2015009460A
Other languages
English (en)
Inventor
Mohamed Esseghir
Anny L Flory
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2015009460A publication Critical patent/MX2015009460A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Lubricants (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Medios líquidos de enfriamiento empleados para inmersión fría de dispositivos de hardware electrónico. Tales medios líquidos de enfriamiento tienen un punto de inflamación de al menos 190°C, según lo determinado de acuerdo con ASTM D92 y una viscosidad de 27 centistokes ("cSt") o menos a 40 ° C, tal como se determina de acuerdo con ASTM D445. Tales medios líquidos de enfriamiento se pueden emplear para inmersión fría de tales dispositivos como servidores informáticos, motherboards del servidor, y microprocesadores.
MX2015009460A 2013-01-24 2013-12-17 Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico. MX2015009460A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361756019P 2013-01-24 2013-01-24
PCT/US2013/075670 WO2014116369A1 (en) 2013-01-24 2013-12-17 Liquid cooling medium for electronic device cooling

Publications (1)

Publication Number Publication Date
MX2015009460A true MX2015009460A (es) 2015-09-24

Family

ID=49956377

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015009460A MX2015009460A (es) 2013-01-24 2013-12-17 Medio liquido de enfriamiento para el enfriamiento de dispositivo electronico.

Country Status (9)

Country Link
US (1) US20150319889A1 (es)
EP (1) EP2948516A1 (es)
JP (1) JP6282289B2 (es)
KR (1) KR20150109368A (es)
CN (1) CN104903420A (es)
BR (1) BR112015015845A2 (es)
CA (1) CA2897962A1 (es)
MX (1) MX2015009460A (es)
WO (1) WO2014116369A1 (es)

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WO2018051501A1 (ja) 2016-09-16 2018-03-22 富士通株式会社 液浸槽および液浸槽を有する装置
JP6217835B1 (ja) * 2016-09-16 2017-10-25 富士通株式会社 液浸冷却装置
CN106569565A (zh) * 2016-10-31 2017-04-19 曙光信息产业(北京)有限公司 浸没式液冷服务器
JP6237942B1 (ja) * 2017-01-30 2017-11-29 富士通株式会社 液浸冷却装置
CN106833544A (zh) * 2017-03-27 2017-06-13 卓聪（上海）环保科技发展有限公司 It通信设备浸没式冷却剂及其制备方法
US11064634B1 (en) * 2020-02-25 2021-07-13 TMGCore, LLC Testing methods and apparatuses using simulated servers
ES2943957T3 (es) 2019-06-12 2023-06-16 Lubrizol Corp Sistema, método y fluido orgánicos de transferencia de calor
FI20205816A1 (en) * 2020-08-21 2022-02-22 Neste Oyj COOLANT FOR DIRECT, SINGLE-PHASE IMMEDIATE COOLING
WO2023009478A1 (en) * 2021-07-26 2023-02-02 The Lubrizol Corporation Organic heat transfer system, method and fluid
US11608217B1 (en) 2022-01-01 2023-03-21 Liquidstack Holding B.V. Automated closure for hermetically sealing an immersion cooling tank during a hot swap of equipment therein
JP7715849B2 (ja) 2022-07-14 2025-07-30 Ｅｎｅｏｓ株式会社 液浸冷却システム用冷却液
EP4321592A1 (de) 2022-08-08 2024-02-14 OQ Chemicals GmbH Effiziente und umweltfreundliche kühlmittel zur direkten kühlung elektrischer akkumulatoren
CN115820219A (zh) * 2022-12-15 2023-03-21 开泰通信技术有限公司 一种按比例调配的导热矿物油

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Also Published As

Publication number Publication date
US20150319889A1 (en) 2015-11-05
BR112015015845A2 (pt) 2017-07-11
CN104903420A (zh) 2015-09-09
EP2948516A1 (en) 2015-12-02
WO2014116369A1 (en) 2014-07-31
KR20150109368A (ko) 2015-10-01
JP2016513304A (ja) 2016-05-12
CA2897962A1 (en) 2014-07-31
JP6282289B2 (ja) 2018-02-21

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