[go: up one dir, main page]

MX2013012200A - Metodo de pulverizacion catódica por magnetron de impulso de alta potencia que proporciona la ionizacion mejorada de las particulas obtenidas por pulverización catódica y aparato para su implementacion. - Google Patents

Metodo de pulverizacion catódica por magnetron de impulso de alta potencia que proporciona la ionizacion mejorada de las particulas obtenidas por pulverización catódica y aparato para su implementacion.

Info

Publication number
MX2013012200A
MX2013012200A MX2013012200A MX2013012200A MX2013012200A MX 2013012200 A MX2013012200 A MX 2013012200A MX 2013012200 A MX2013012200 A MX 2013012200A MX 2013012200 A MX2013012200 A MX 2013012200A MX 2013012200 A MX2013012200 A MX 2013012200A
Authority
MX
Mexico
Prior art keywords
implementation
high power
sputtering method
magnetron sputtering
sputtered particles
Prior art date
Application number
MX2013012200A
Other languages
English (en)
Inventor
Markus Lechthaler
Original Assignee
Oerlikon Trading Ag Trübbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag Trübbach filed Critical Oerlikon Trading Ag Trübbach
Publication of MX2013012200A publication Critical patent/MX2013012200A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T407/00—Cutters, for shaping
    • Y10T407/19—Rotary cutting tool
    • Y10T407/1904—Composite body of diverse material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Se describe un método para realizar un proceso de recubrimiento por HIPIMS, mediante el cual una distancia mínima 5 entre el objetivo y el sustrato se reduce hasta que se obtenga una corriente de polarización esencialmente máxima en el sustrato durante el proceso de recubrimiento, y de ese modo se mejora considerablemente la calidad de recubrimiento y se aumenta la velocidad de deposición en comparación con los procesos convencionales para el recubrimiento por HIPIMS.
MX2013012200A 2011-04-20 2012-04-16 Metodo de pulverizacion catódica por magnetron de impulso de alta potencia que proporciona la ionizacion mejorada de las particulas obtenidas por pulverización catódica y aparato para su implementacion. MX2013012200A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161477216P 2011-04-20 2011-04-20
PCT/EP2012/001632 WO2012143110A1 (en) 2011-04-20 2012-04-16 High power impulse magnetron sputtering method providing enhanced ionization of the sputtered particles and apparatus for its implementation

Publications (1)

Publication Number Publication Date
MX2013012200A true MX2013012200A (es) 2014-03-27

Family

ID=45999772

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013012200A MX2013012200A (es) 2011-04-20 2012-04-16 Metodo de pulverizacion catódica por magnetron de impulso de alta potencia que proporciona la ionizacion mejorada de las particulas obtenidas por pulverización catódica y aparato para su implementacion.

Country Status (12)

Country Link
US (1) US20140127519A1 (es)
EP (1) EP2699709A1 (es)
JP (1) JP2014517870A (es)
KR (1) KR20140027167A (es)
CN (1) CN103608483A (es)
BR (1) BR112013026914A2 (es)
CA (1) CA2833927A1 (es)
MX (1) MX2013012200A (es)
PH (1) PH12013502181A1 (es)
RU (1) RU2013151452A (es)
SG (1) SG194537A1 (es)
WO (1) WO2012143110A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI1102335A2 (pt) 2011-05-27 2013-06-25 Mahle Metal Leve Sa elemento dotado de pelo menos uma superfÍcie de deslizamento com um revestimento para uso em um motor de combustço interna ou em um compressor
DE102011116576A1 (de) * 2011-10-21 2013-04-25 Oerlikon Trading Ag, Trübbach Bohrer mit Beschichtung
KR101891900B1 (ko) † 2013-07-03 2018-09-28 외를리콘 서피스 솔루션즈 아게, 페피콘 TixSi1-xN 층 및 그의 생산
US20160376694A1 (en) * 2013-11-27 2016-12-29 Ecole Polytechnique Federale De Lausanne (Epfl) Method and Apparatus for Coating Nanoparticulate Films on Complex Substrates
JP7509790B2 (ja) 2019-02-11 2024-07-02 アプライド マテリアルズ インコーポレイテッド パルスｐｖｄにおけるプラズマ改質によるウエハからの粒子除去方法
CN114032519A (zh) * 2021-10-29 2022-02-11 北京航空航天大学 电磁场耦合双极脉冲磁控溅射系统及提高流量和能量方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259078A (en) * 1975-11-11 1977-05-16 Nec Corp Continuous sputtering apparatus
US7335426B2 (en) * 1999-11-19 2008-02-26 Advanced Bio Prosthetic Surfaces, Ltd. High strength vacuum deposited nitinol alloy films and method of making same
GB2437080B (en) * 2006-04-11 2011-10-12 Hauzer Techno Coating Bv A vacuum treatment apparatus, a bias power supply and a method of operating a vacuum treatment apparatus
EP2010691B1 (de) * 2006-04-21 2017-12-06 CemeCon AG Beschichteter körper
GB0608582D0 (en) 2006-05-02 2006-06-07 Univ Sheffield Hallam High power impulse magnetron sputtering vapour deposition
BRPI0811241B1 (pt) * 2007-05-25 2019-06-25 Oerlikon Trading Ag, Trübbach Instalação e método de tratamento a vácuo
GB2450933A (en) * 2007-07-13 2009-01-14 Hauzer Techno Coating Bv Method of providing a hard coating

Also Published As

Publication number Publication date
SG194537A1 (en) 2013-12-30
US20140127519A1 (en) 2014-05-08
WO2012143110A1 (en) 2012-10-26
RU2013151452A (ru) 2015-05-27
EP2699709A1 (en) 2014-02-26
KR20140027167A (ko) 2014-03-06
CN103608483A (zh) 2014-02-26
JP2014517870A (ja) 2014-07-24
PH12013502181A1 (en) 2014-01-06
BR112013026914A2 (pt) 2018-02-14
CA2833927A1 (en) 2012-10-26

Similar Documents

Publication Publication Date Title
TW201614089A (en) A high power impulse magnetron sputtering process to achieve a high density high SP3 containing layer
Anders A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS)
PH12013502181A1 (en) High power impulse magnetron sputtering method providing enhanced ionization of the sputtered particles and apparatus for its implementation
WO2013045454A3 (en) Coating of substrates using hipims
WO2012169747A3 (ko) 벨트형 자석을 포함한 플라즈마 발생원 및 이를 이용한 박막 증착 시스템
TW200745362A (en) Reactive sputtering zinc oxide transparent conductive oxides onto large area substrates
WO2012145702A3 (en) Lithium sputter targets
JP2017534750A5 (es)
TW200741860A (en) Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
CA2916769C (en) Tib2 layers and manufacture thereof
EA200900182A1 (ru) Устройство для нанесения покрытий и способ нанесения покрытий
WO2010144761A3 (en) Ionized physical vapor deposition for microstructure controlled thin film deposition
MY171465A (en) Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates
WO2012097024A3 (en) Pvd process with synchronized process parameters and magnet position
IN2014DN03385A (es)
WO2009025258A1 (ja) スパッタリング方法及びスパッタリング装置
WO2009022573A1 (ja) 薄膜形成方法
TW200639266A (en) Method for operating a sputter cathode with a target
TW201612344A (en) Sputtering device
CN105734511B (zh) 降低磁控溅射设备沉积速率的方法及磁控溅射设备
WO2009025306A1 (ja) スパッタリング方法
WO2015051277A3 (en) Method and apparatus to produce high density overcoats
MY191633A (en) Sputtering target for forming magnetic recording film and method for producing same
CN205710902U (zh) 增强型磁控溅射卷绕镀膜设备
RU123778U1 (ru) Устройство для нанесения тонких пленок