MX2011004111A - Marcador para marcar o codificar un objeto y método para producir este marcador y uso. - Google Patents
Marcador para marcar o codificar un objeto y método para producir este marcador y uso.Info
- Publication number
- MX2011004111A MX2011004111A MX2011004111A MX2011004111A MX2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A
- Authority
- MX
- Mexico
- Prior art keywords
- marker
- elements
- conductive
- code
- marker elements
- Prior art date
Links
- 239000003550 marker Substances 0.000 title claims abstract description 225
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000011810 insulating material Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 55
- 230000008569 process Effects 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 10
- 238000012795 verification Methods 0.000 description 10
- 238000003908 quality control method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0059608U AT11108U1 (de) | 2008-10-17 | 2008-10-17 | Markierung zum markieren bzw. codieren eines gegenstands sowie verfahren zur herstellung einer derartigen markierung und verwendung |
| PCT/AT2009/000400 WO2010042965A1 (de) | 2008-10-17 | 2009-10-14 | Markierung zum markieren bzw. codieren eines gegenstands sowie verfahren zur herstellung einer derartigen markierung und verwendung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2011004111A true MX2011004111A (es) | 2011-06-22 |
Family
ID=41381806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2011004111A MX2011004111A (es) | 2008-10-17 | 2009-10-14 | Marcador para marcar o codificar un objeto y método para producir este marcador y uso. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2345313A1 (de) |
| CN (2) | CN201522810U (de) |
| AT (1) | AT11108U1 (de) |
| DE (1) | DE202009018996U1 (de) |
| MX (1) | MX2011004111A (de) |
| WO (1) | WO2010042965A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106652768B (zh) * | 2017-01-24 | 2023-01-03 | 中信戴卡股份有限公司 | 一种用于铝合金产品的标记部件 |
| CN110321749B (zh) | 2018-03-28 | 2022-05-13 | 奥特斯(中国)有限公司 | 用于部件承载件的双重编码可追踪系统 |
| CN109287066B (zh) * | 2018-09-03 | 2024-08-06 | 赣州金顺科技有限公司 | 一种印制线路板产品编码装置及方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1174727A (en) | 1967-08-17 | 1969-12-17 | Ibm | A Method of Fabricating a Memory Device |
| GB2196184A (en) | 1986-10-10 | 1988-04-20 | Crystalate Electronics | Process for production of multilayer electrical device |
| FR2636175B1 (fr) | 1988-09-02 | 1990-11-23 | Apr Composants | Dispositif de codage notamment pour carte a circuits integres |
| BR9608243A (pt) | 1995-05-04 | 1999-06-29 | Intel Corp | Painel de circuito impresso com configuração de encaminhamento seletivo |
| EP0986289A3 (de) | 1998-09-09 | 2000-06-07 | Siemens Aktiengesellschaft | Schaltungsanordnung und Verfahren zur Kennzeichnung von Leiterplatten |
| DE10126846A1 (de) | 2001-06-01 | 2002-12-05 | Siemens Ag | Bauteil, Verwendung eines solchen Bauteils sowie Verfahren zum Codieren einer elektronischen Baugruppe |
| US6937508B1 (en) | 2002-10-08 | 2005-08-30 | J. Mikko Hakkarainen | Non-volatile, high-density integrated circuit memory |
| FR2869731B1 (fr) | 2004-05-03 | 2006-07-28 | Labinal Sa | Brassage par permutations utilisant des circuits imprimes configurables |
| TWI246375B (en) * | 2004-05-06 | 2005-12-21 | Siliconware Precision Industries Co Ltd | Circuit board with quality-identified mark and method for identifying the quality of circuit board |
| TWI322645B (en) | 2006-12-20 | 2010-03-21 | Nan Ya Printed Circuit Board Corp | Lot traceable printed circuit board |
-
2008
- 2008-10-17 AT AT0059608U patent/AT11108U1/de not_active IP Right Cessation
- 2008-12-15 CN CN2008201817325U patent/CN201522810U/zh not_active Expired - Lifetime
-
2009
- 2009-10-14 DE DE200920018996 patent/DE202009018996U1/de not_active Expired - Lifetime
- 2009-10-14 MX MX2011004111A patent/MX2011004111A/es active IP Right Grant
- 2009-10-14 WO PCT/AT2009/000400 patent/WO2010042965A1/de not_active Ceased
- 2009-10-14 CN CN2009801408424A patent/CN102187744B/zh active Active
- 2009-10-14 EP EP09748932A patent/EP2345313A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN102187744A (zh) | 2011-09-14 |
| CN201522810U (zh) | 2010-07-07 |
| EP2345313A1 (de) | 2011-07-20 |
| WO2010042965A1 (de) | 2010-04-22 |
| AT11108U1 (de) | 2010-04-15 |
| CN102187744B (zh) | 2013-10-02 |
| DE202009018996U1 (de) | 2015-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |