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MX2010000674A - Dispositivo resistivo de capas de pelicula gruesa que emplea una cinta dielectrica. - Google Patents

Dispositivo resistivo de capas de pelicula gruesa que emplea una cinta dielectrica.

Info

Publication number
MX2010000674A
MX2010000674A MX2010000674A MX2010000674A MX2010000674A MX 2010000674 A MX2010000674 A MX 2010000674A MX 2010000674 A MX2010000674 A MX 2010000674A MX 2010000674 A MX2010000674 A MX 2010000674A MX 2010000674 A MX2010000674 A MX 2010000674A
Authority
MX
Mexico
Prior art keywords
resistive device
thick film
resistive
layer
dielectric tape
Prior art date
Application number
MX2010000674A
Other languages
English (en)
Inventor
Roger Brummell
Angie Privett
Original Assignee
Watlow Electric Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Mfg filed Critical Watlow Electric Mfg
Publication of MX2010000674A publication Critical patent/MX2010000674A/es

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003Thick film resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/01Mounting; Supporting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/40Heating elements having the shape of rods or tubes
    • H05B3/42Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49099Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

Se proporciona un dispositivo resistivo para su uso en proporcionar una carga resistiva a un objetivo bajo la aplicación de energía desde una fuente de energía, el dispositivo resistivo se adapta para una conexión eléctrica a la fuente de energía a través de un par de hilos terminales. El dispositivo resistivo incluye un material de película gruesa, y el material de película gruesa define por lo menos una capa de cinta. El dispositivo resistivo puede ser, a manera de ejemplo, un calentador o una resistencia de carga, y también puede incluir un sustrato sobre el cual se dispone una capa de cinta dieléctrica, una capa resistiva dispuesta sobre la capa de cinta dieléctrica, y una capa protectora dispuesta sobre la capa resistiva.
MX2010000674A 2007-07-18 2008-07-17 Dispositivo resistivo de capas de pelicula gruesa que emplea una cinta dielectrica. MX2010000674A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/779,703 US8089337B2 (en) 2007-07-18 2007-07-18 Thick film layered resistive device employing a dielectric tape
PCT/US2008/070296 WO2009012369A2 (en) 2007-07-18 2008-07-17 Thick film layered resistive device employing a dielectric tape

Publications (1)

Publication Number Publication Date
MX2010000674A true MX2010000674A (es) 2010-03-17

Family

ID=40084368

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010000674A MX2010000674A (es) 2007-07-18 2008-07-17 Dispositivo resistivo de capas de pelicula gruesa que emplea una cinta dielectrica.

Country Status (8)

Country Link
US (1) US8089337B2 (es)
EP (1) EP2174323A2 (es)
JP (1) JP2010533982A (es)
CN (1) CN101796595A (es)
CA (1) CA2693199C (es)
MX (1) MX2010000674A (es)
TW (1) TWI384498B (es)
WO (1) WO2009012369A2 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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US8557082B2 (en) 2007-07-18 2013-10-15 Watlow Electric Manufacturing Company Reduced cycle time manufacturing processes for thick film resistive devices
US10159114B2 (en) * 2008-03-18 2018-12-18 Watlow Electric Manufacturing Company Layered heater system with honeycomb core structure
US8061402B2 (en) * 2008-04-07 2011-11-22 Watlow Electric Manufacturing Company Method and apparatus for positioning layers within a layered heater system
JP2013153130A (ja) * 2011-12-28 2013-08-08 Rohm Co Ltd チップ抵抗器
US8786397B1 (en) * 2013-02-07 2014-07-22 Excelliance Mos Corporation Electric field resistor
US10297373B1 (en) * 2018-04-19 2019-05-21 Littelfuse, Inc. Jelly roll-type positive temperature coefficient device
US11730205B2 (en) 2020-10-20 2023-08-22 Dr. Dabber Inc. Quick connect adapter and electronic vaporizer having a ceramic heating element having a quick connect adapter
US11064738B2 (en) * 2020-10-20 2021-07-20 Dr. Dabber Inc. Ceramic heating element with embedded temperature sensor and electronic vaporizer having a ceramic heating element with embedded temperature sensor

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Also Published As

Publication number Publication date
US20090021342A1 (en) 2009-01-22
WO2009012369A3 (en) 2009-07-30
EP2174323A2 (en) 2010-04-14
US8089337B2 (en) 2012-01-03
TW200919495A (en) 2009-05-01
CA2693199C (en) 2013-09-10
CN101796595A (zh) 2010-08-04
TWI384498B (zh) 2013-02-01
CA2693199A1 (en) 2009-01-22
JP2010533982A (ja) 2010-10-28
WO2009012369A2 (en) 2009-01-22

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