MA39377A1 - Circuit imprime flexible, et module de concentrateur photovoltaïque et panneau de concentrateur photovoltaïque utilisant celui-ci. - Google Patents
Circuit imprime flexible, et module de concentrateur photovoltaïque et panneau de concentrateur photovoltaïque utilisant celui-ci.Info
- Publication number
- MA39377A1 MA39377A1 MA39377A MA39377A MA39377A1 MA 39377 A1 MA39377 A1 MA 39377A1 MA 39377 A MA39377 A MA 39377A MA 39377 A MA39377 A MA 39377A MA 39377 A1 MA39377 A1 MA 39377A1
- Authority
- MA
- Morocco
- Prior art keywords
- photovoltaic concentrator
- flexible printed
- base material
- insulating base
- printed circuit
- Prior art date
Links
- 239000000463 material Substances 0.000 abstract 4
- 239000004642 Polyimide Substances 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
- H02S20/10—Supporting structures directly fixed to the ground
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/85—Protective back sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/484—Refractive light-concentrating means, e.g. lenses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photovoltaic Devices (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
L'invention concerne une carte de câblage imprimé flexible qui comprend : un matériau de base isolant flexible semblable à un film ayant une valeur de tension de tenue d'au moins 2 000 v ; et une couche conductrice, qui est formée sur le matériau de base isolant et qui constitue un motif de circuit. Le matériau de base isolant contient du polyimide en tant que composant principal et présente un taux de teneur en charge de 0 %. Par conséquent, on obtient la carte de câblage imprimé flexible comportant le matériau de base isolant qui supprime la détérioration des caractéristiques de tension de tenue même dans un environnement de grande humidité.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014081023A JP2015201600A (ja) | 2014-04-10 | 2014-04-10 | フレキシブルプリント配線板並びにこれを用いた集光型太陽光発電モジュール及び集光型太陽光発電パネル |
| PCT/JP2015/053942 WO2015156028A1 (fr) | 2014-04-10 | 2015-02-13 | Carte de câblage imprimé flexible, module de production d'énergie solaire à concentration utilisant cette dernière et panneau de production d'énergie solaire à concentration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MA39377A1 true MA39377A1 (fr) | 2016-12-30 |
| MA39377B2 MA39377B2 (fr) | 2020-05-29 |
Family
ID=54287609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MA39377A MA39377B2 (fr) | 2014-04-10 | 2015-02-13 | Circuit imprime flexible, et module de concentrateur photovoltaïque et panneau de concentrateur photovoltaïque utilisant celui-ci. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10937918B2 (fr) |
| JP (3) | JP2015201600A (fr) |
| CN (1) | CN106165549B (fr) |
| MA (1) | MA39377B2 (fr) |
| TW (1) | TWI670861B (fr) |
| WO (1) | WO2015156028A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI636266B (zh) * | 2017-10-16 | 2018-09-21 | 行政院原子能委員會核能研究所 | 檢測太陽電池封裝之方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5328751B2 (fr) | 1974-11-27 | 1978-08-16 | ||
| JPS52122487A (en) * | 1976-04-08 | 1977-10-14 | Agency Of Ind Science & Technol | Solar battery device |
| JPH0665707B2 (ja) * | 1985-09-20 | 1994-08-24 | 鐘淵化学工業株式会社 | 改良されたポリイミドフイルム |
| JP2540398B2 (ja) | 1991-07-23 | 1996-10-02 | 宇部興産株式会社 | 芳香族ポリイミドフィルム及びその製法 |
| JP2990636B2 (ja) | 1993-01-21 | 1999-12-13 | 信越化学工業株式会社 | 易滑性ポリイミドフィルムの製造法 |
| JP2002217508A (ja) | 2001-01-19 | 2002-08-02 | Fuji Electric Co Ltd | 金属ベース基板およびその製造方法 |
| TWI320046B (en) * | 2002-02-26 | 2010-02-01 | Polyamide-imide resin, flexible metal-clad laminate and flexible print substrate | |
| CN1720136A (zh) * | 2002-12-05 | 2006-01-11 | 株式会社钟化 | 叠层体、印刷电路布线板及它们的制造方法 |
| JP2006083206A (ja) | 2004-09-14 | 2006-03-30 | Du Pont Toray Co Ltd | ポリイミドフィルム、その製造方法およびこれを基材とした金属配線板 |
| EP1872941A4 (fr) * | 2005-04-18 | 2008-12-10 | Toyo Boseki | Film de polyimide stratifie a couches minces et carte de circuit imprime flexible |
| JP2007254643A (ja) * | 2006-03-24 | 2007-10-04 | Toyobo Co Ltd | 易滑性ポリイミドフィルム、銅張積層基板及び回路基板 |
| JP2008218579A (ja) | 2007-03-01 | 2008-09-18 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
| JP5665846B2 (ja) * | 2010-03-10 | 2015-02-04 | 新日鉄住金化学株式会社 | 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体 |
| KR101433555B1 (ko) * | 2011-04-15 | 2014-08-22 | 도요보 가부시키가이샤 | 적층체와 그 제조 방법 및 그것을 이용한 디바이스 구조체의 제조 방법 |
| US20140093723A1 (en) | 2011-05-27 | 2014-04-03 | Masaki Takeuchi | Substrate, method for producing same, heat-releasing substrate, and heat-releasing module |
| JP2013074123A (ja) * | 2011-09-28 | 2013-04-22 | Fujifilm Corp | 光電変換素子用基板および光電変換素子 |
| JP5814725B2 (ja) * | 2011-10-03 | 2015-11-17 | 住友電気工業株式会社 | 集光型太陽光発電モジュール及び集光型太陽光発電パネル |
| JP5214005B2 (ja) * | 2011-10-12 | 2013-06-19 | シャープ株式会社 | 集光型太陽電池モジュール及び太陽光発電システム |
| CN104205348B (zh) * | 2011-12-09 | 2017-05-31 | 森普留斯公司 | 高浓度光电模块及其制造方法 |
| JP5948890B2 (ja) | 2012-01-20 | 2016-07-06 | 住友電気工業株式会社 | 集光型太陽光発電モジュール、集光型太陽光発電パネル、及び、集光型太陽光発電モジュール用フレキシブルプリント配線板 |
| WO2013114685A1 (fr) * | 2012-02-01 | 2013-08-08 | 東洋紡株式会社 | Stratifié, procédé de fabrication de celui-ci et procédé de fabrication de structure de dispositif utilisant celui-ci |
| JP5927948B2 (ja) | 2012-02-02 | 2016-06-01 | 住友電気工業株式会社 | 集光型太陽光発電パネル及び集光型太陽光発電装置 |
-
2014
- 2014-04-10 JP JP2014081023A patent/JP2015201600A/ja active Pending
-
2015
- 2015-02-13 WO PCT/JP2015/053942 patent/WO2015156028A1/fr not_active Ceased
- 2015-02-13 US US15/302,888 patent/US10937918B2/en not_active Expired - Fee Related
- 2015-02-13 MA MA39377A patent/MA39377B2/fr unknown
- 2015-02-13 CN CN201580018753.8A patent/CN106165549B/zh not_active Expired - Fee Related
- 2015-03-11 TW TW104107739A patent/TWI670861B/zh not_active IP Right Cessation
-
2016
- 2016-04-28 JP JP2016090761A patent/JP2016154262A/ja active Pending
-
2019
- 2019-01-21 JP JP2019007770A patent/JP6625250B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016154262A (ja) | 2016-08-25 |
| TW201543706A (zh) | 2015-11-16 |
| JP2015201600A (ja) | 2015-11-12 |
| CN106165549A (zh) | 2016-11-23 |
| MA39377B2 (fr) | 2020-05-29 |
| US10937918B2 (en) | 2021-03-02 |
| WO2015156028A1 (fr) | 2015-10-15 |
| US20170033249A1 (en) | 2017-02-02 |
| JP6625250B2 (ja) | 2019-12-25 |
| JP2019068106A (ja) | 2019-04-25 |
| TWI670861B (zh) | 2019-09-01 |
| CN106165549B (zh) | 2019-04-02 |
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