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MA39684B1 - Module de câblage - Google Patents

Module de câblage

Info

Publication number
MA39684B1
MA39684B1 MA39684A MA39684A MA39684B1 MA 39684 B1 MA39684 B1 MA 39684B1 MA 39684 A MA39684 A MA 39684A MA 39684 A MA39684 A MA 39684A MA 39684 B1 MA39684 B1 MA 39684B1
Authority
MA
Morocco
Prior art keywords
wiring
wiring board
adheres
adhesion region
adhesion
Prior art date
Application number
MA39684A
Other languages
English (en)
Other versions
MA39684A1 (fr
Inventor
Kazumasa Toya
Takashi Iwasaki
Youichi Nagai
Koji Mori
Kenji Saito
Rui Mikami
Takeshi Yamana
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of MA39684A1 publication Critical patent/MA39684A1/fr
Publication of MA39684B1 publication Critical patent/MA39684B1/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/30—Supporting structures being movable or adjustable, e.g. for angle adjustment
    • H02S20/32—Supporting structures being movable or adjustable, e.g. for angle adjustment specially adapted for solar tracking
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H02S30/10—Frame structures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/20—Optical components
    • H02S40/22—Light-reflecting or light-concentrating means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/42—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/904—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the shapes of the structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
    • H10F77/484—Refractive light-concentrating means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
    • H10F77/939—Output lead wires or elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Photovoltaic Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne un module de câblage (49) qui comprend : une carte de câblage (69) ; une partie de base (38) sur laquelle est agencée la carte de câblage (69) ; et une couche d'adhérence (59) qui fait adhérer la carte de câblage (69) à la partie de base (38). La carte de câblage (69) comprend : une partie pastille (60) sur laquelle est monté un élément de génération de puissance (19) ; et une partie de câblage (63) qui est électriquement connectée à l'élément de génération de puissance (19). La couche d'adhérence (59) possède : une région d'adhérence (50) de pastille qui fait adhérer la partie pastille (60) à la partie de base (38) ; et une région d'adhérence (53) de câblage qui fait adhérer la partie de câblage (63) à la partie de base (38). La largeur de la région d'adhérence (53) de câblage est plus petite que la largeur de la région d'adhérence (50) de pastille.
MA39684A 2014-07-10 2015-07-06 Module de câblage MA39684B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014142327 2014-07-10
PCT/JP2015/069407 WO2016006570A1 (fr) 2014-07-10 2015-07-06 Module de câblage

Publications (2)

Publication Number Publication Date
MA39684A1 MA39684A1 (fr) 2018-02-28
MA39684B1 true MA39684B1 (fr) 2020-03-31

Family

ID=54829518

Family Applications (4)

Application Number Title Priority Date Filing Date
MA39682A MA39682B2 (fr) 2014-07-10 2015-07-06 Substrat de câblage et dispositif photovoltaique.
MA39683A MA39683B1 (fr) 2014-07-10 2015-07-06 Module de generation d'énergie electrique et substrat de câblage
MA39681A MA39681B1 (fr) 2014-07-10 2015-07-06 Unité de circuit de génération d'energie electrique.
MA39684A MA39684B1 (fr) 2014-07-10 2015-07-06 Module de câblage

Family Applications Before (3)

Application Number Title Priority Date Filing Date
MA39682A MA39682B2 (fr) 2014-07-10 2015-07-06 Substrat de câblage et dispositif photovoltaique.
MA39683A MA39683B1 (fr) 2014-07-10 2015-07-06 Module de generation d'énergie electrique et substrat de câblage
MA39681A MA39681B1 (fr) 2014-07-10 2015-07-06 Unité de circuit de génération d'energie electrique.

Country Status (7)

Country Link
US (5) US10680127B2 (fr)
JP (4) JP6520943B2 (fr)
CN (6) CN106537611B (fr)
AU (4) AU2015288771B2 (fr)
MA (4) MA39682B2 (fr)
TW (5) TWI656653B (fr)
WO (4) WO2016006573A1 (fr)

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* Cited by examiner, † Cited by third party
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JP6759778B2 (ja) 2016-07-07 2020-09-23 住友電気工業株式会社 集光型太陽光発電モジュール、集光型太陽光発電装置及び水素精製システム
JP7021671B2 (ja) * 2017-08-07 2022-02-17 住友電気工業株式会社 集光型太陽光発電モジュール、集光型太陽光発電パネル、集光型太陽光発電装置、及び集光型太陽光発電モジュールの製造方法
JP7021670B2 (ja) * 2017-08-07 2022-02-17 住友電気工業株式会社 集光型太陽光発電モジュール、集光型太陽光発電パネル、及び集光型太陽光発電装置
CN107453699B (zh) * 2017-08-28 2024-01-23 江西清华泰豪三波电机有限公司 一种光伏组件及光伏装置
US10529881B2 (en) * 2018-03-01 2020-01-07 Solaero Technologies Corp. Interconnect member
WO2020004148A1 (fr) * 2018-06-27 2020-01-02 住友電気工業株式会社 Module de génération d'énergie solaire à concentration et panneau de génération d'énergie solaire à concentration
JP7424288B2 (ja) * 2018-06-27 2024-01-30 住友電気工業株式会社 フレキシブルプリント配線板の原形体、フレキシブルプリント配線板の製造方法、集光型太陽光発電モジュール、及び、発光モジュール
CN109067346A (zh) * 2018-07-20 2018-12-21 上海空间电源研究所 刚挠结合板太阳电池阵
CN111609370A (zh) * 2020-05-19 2020-09-01 田聪 一种基于电容传感的太阳能路灯雨天可保证亮度的装置

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JP2005051133A (ja) 2003-07-31 2005-02-24 Canon Inc プリント配線基板
US7550097B2 (en) 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
US8153886B1 (en) * 2003-10-20 2012-04-10 Amonix, Inc. Method of improving the efficiency of loosely packed solar cells in dense array applications
JP4648063B2 (ja) 2005-04-19 2011-03-09 日東電工株式会社 カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法
JP2007019334A (ja) 2005-07-08 2007-01-25 Mitsubishi Electric Corp 太陽電池装置
US8759138B2 (en) 2008-02-11 2014-06-24 Suncore Photovoltaics, Inc. Concentrated photovoltaic system modules using III-V semiconductor solar cells
US20110024162A1 (en) * 2008-04-21 2011-02-03 Sumitomo Bakelite Co., Ltd. Flexible wiring unit and electronic apparatus
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JP5214005B2 (ja) * 2011-10-12 2013-06-19 シャープ株式会社 集光型太陽電池モジュール及び太陽光発電システム
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Also Published As

Publication number Publication date
CN204885177U (zh) 2015-12-16
TWI666781B (zh) 2019-07-21
TWI666786B (zh) 2019-07-21
JP6520943B2 (ja) 2019-05-29
MA39681A1 (fr) 2018-01-31
CN106537612A (zh) 2017-03-22
TW201613120A (en) 2016-04-01
AU2015288774A1 (en) 2017-01-12
JP6565912B2 (ja) 2019-08-28
AU2015288772B2 (en) 2020-06-25
TWI661569B (zh) 2019-06-01
JPWO2016006568A1 (ja) 2017-04-27
AU2015288772A1 (en) 2017-01-12
CN106537611A (zh) 2017-03-22
AU2015288769B2 (en) 2020-04-30
MA39684A1 (fr) 2018-02-28
JPWO2016006571A1 (ja) 2017-04-27
US20170213923A1 (en) 2017-07-27
AU2015288774B2 (en) 2020-03-12
CN106663711A (zh) 2017-05-10
CN106537610B (zh) 2018-05-08
WO2016006568A1 (fr) 2016-01-14
US10985286B2 (en) 2021-04-20
US20170201208A1 (en) 2017-07-13
CN106663711B (zh) 2019-03-29
JPWO2016006570A1 (ja) 2017-04-27
WO2016006570A1 (fr) 2016-01-14
MA39683A1 (fr) 2018-01-31
WO2016006571A1 (fr) 2016-01-14
US20170213928A1 (en) 2017-07-27
AU2015288769A1 (en) 2017-01-12
JPWO2016006573A1 (ja) 2017-04-27
AU2015288771B2 (en) 2020-06-25
TW201611311A (zh) 2016-03-16
CN105261661B (zh) 2019-01-08
TW201607058A (zh) 2016-02-16
US10680127B2 (en) 2020-06-09
US20160013337A1 (en) 2016-01-14
AU2015288771A1 (en) 2017-01-12
MA39683B1 (fr) 2019-06-28
TWI658604B (zh) 2019-05-01
US9923107B2 (en) 2018-03-20
TWI656653B (zh) 2019-04-11
US20170200836A1 (en) 2017-07-13
CN105261661A (zh) 2016-01-20
JP6551409B2 (ja) 2019-07-31
TW201613119A (en) 2016-04-01
CN106537611B (zh) 2019-03-15
MA39681B1 (fr) 2019-06-28
TW201607057A (zh) 2016-02-16
MA39682B2 (fr) 2020-06-30
US11101395B2 (en) 2021-08-24
JP6551408B2 (ja) 2019-07-31
CN106537610A (zh) 2017-03-22
WO2016006573A1 (fr) 2016-01-14
CN106537612B (zh) 2019-03-01

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