[go: up one dir, main page]

Burns et al., 1990 - Google Patents

Thin films for micromechanical sensors

Burns et al., 1990

View PDF
Document ID
3555481095864976363
Author
Burns D
Guckel H
Publication year
Publication venue
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

External Links

Snippet

Thin films compatible with integrated circuit and batch processing technologies are utilized in the fabrication of cost‐effective, high performance integrated micromechanical sensors. These films are used as structural layers, sacrificial layers, passivation layers, oxidation …
Continue reading at pubs.aip.org (PDF) (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements

Similar Documents

Publication Publication Date Title
Guckel Surface micromachined pressure transducers
Laconte et al. Micromachined thin-film sensors for SOI-CMOS co-integration
Tabata et al. Mechanical property measurements of thin films using load-deflection of composite rectangular membranes
Rai-Choudhury MEMS and MOEMS Technology and Applications
Elwenspoek et al. Mechanical microsensors
Barlian et al. Semiconductor piezoresistance for microsystems
EP0829012B1 (en) Method of producing a semiconductor transducer
JP5769721B2 (en) Method of manufacturing at least one deformable membrane micropump and deformable membrane micropump
US8511171B2 (en) Device for measuring environmental forces and method of fabricating the same
US6084257A (en) Single crystal silicon sensor with high aspect ratio and curvilinear structures
Burns et al. Thin films for micromechanical sensors
Wolffenbuttel et al. Polysilicon bridges for the realization of tactile sensors
Christel et al. Single-crysytal silicon pressure sensors with 500× overpressure protection
Rangelow et al. Fabrication of piezoresistive-sensed AFM cantilever probe with integrated tip
Kramer et al. Postbuckled micromachined square membranes under differential pressure
Guckel Silicon microsensors: construction, design and performance
Takahashi et al. Triaxial piezoresistive force sensor probe with high sensitivity and stiffness using 3D notch structure
Tibrewala et al. Analysis of full and cross-shaped boss membranes with piezoresistors in transversal strain configuration
Glukhovskoy et al. Proof of concept: glass-membrane based differential pressure sensor
Knutti Finding markets for microstructures
White et al. Design and characterization of a MEMS piezoresistive cochlear-like acoustic sensor
Tsai et al. Out-of-plane microstructures using stress engineering of thin films
Tsou et al. On the out-of-plane deformation of V-shaped micromachined beams
Prochaska et al. Production of silicon diaphragms by precision grinding
Huang et al. Studies on curvature deformation control of bilayer cantilever fabricated by surface micromachining of SOI wafer