Sciti et al., 2001 - Google Patents
Laser-induced surface drilling of silicon carbideSciti et al., 2001
- Document ID
- 180333421137758140
- Author
- Sciti D
- Bellosi A
- Publication year
- Publication venue
- Applied surface science
External Links
Snippet
Laser microdrilling was performed on the surface of silicon carbide components, in order to investigate the surface modification in relationships with the laser processing parameters. Several SiC surfaces were laser textured with blind microholes different in shape and size …
- 229910010271 silicon carbide 0 title abstract description 34
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Sciti et al. | Laser-induced surface drilling of silicon carbide | |
| Kacar et al. | Characterization of the drilling alumina ceramic using Nd: YAG pulsed laser | |
| Dumitru et al. | Laser processing of hardmetals: Physical basics and applications | |
| Hanon et al. | Experimental and theoretical investigation of the drilling of alumina ceramic using Nd: YAG pulsed laser | |
| Dumitru et al. | Femtosecond ablation of ultrahard materials | |
| Zhang et al. | Micromachining features of TiC ceramic by femtosecond pulsed laser | |
| Zhang et al. | Polishing of alumina ceramic to submicrometer surface roughness by picosecond laser | |
| Schnell et al. | Heat accumulation during femtosecond laser treatment at high repetition rate–A morphological, chemical and crystallographic characterization of self-organized structures on Ti6Al4V | |
| Sinha | Thermal model for nanosecond laser ablation of alumina | |
| Zhai et al. | Investigations on the ablation behavior of C/SiC under femtosecond laser | |
| Tamrin et al. | Laser drilling of composite material: A review | |
| Chen et al. | Femtosecond laser pulse ablation characteristics of polymer-derived SiAlCN ceramics | |
| Bustamante et al. | Novel approach to nanosecond laser drilling of a crack-free through hole on SiC wafer | |
| Marimuthu et al. | High-power ultrashort pulse laser machining of tungsten carbide | |
| Li et al. | Femtosecond laser drilling of alumina wafers | |
| Cao et al. | The ablation behavior and mechanism of nanosecond laser machined SiCf/SiC composite under different assisted gases | |
| US5138130A (en) | Laser rough and finish machining of hard materials | |
| Marimuthu et al. | Picosecond laser machining of ceramic matrix composite | |
| Guo et al. | Spatter-free laser drilling of alumina ceramics based on gelcasting technology | |
| Sciti et al. | Excimer laser-induced microstructural changes of alumina and silicon carbide | |
| Nagarajan et al. | Femtosecond laser processing of cemented carbide for selective removal of cobalt | |
| Zhang et al. | Picosecond laser machining of deep holes in silicon infiltrated silicon carbide ceramics | |
| Dumitru et al. | Metallographical analysis of steel and hard metal substrates after deep-drilling with femtosecond laser pulses | |
| Chen et al. | Analysis of laser damage threshold and morphological changes at the surface of a HgCdTe crystal | |
| Tehniat et al. | Surface morphology correlated with sputtering yield measurements of laser-ablated iron |